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Enhanced electrical properties of BOPP films by plasma treatment
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Xi ZHOU, Wenxiong CHEN, Meng PAN, Yang ZHANG, Lijie DONG
Electronic Components and Materials | 2025, 44(10) : 1145 - 1152
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Electronic Components and Materials | 2025, 44(10): 1145-1152
• Research & Development •
Enhanced electrical properties of BOPP films by plasma treatment
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Xi ZHOU, Wenxiong CHEN, Meng PAN, Yang ZHANG, Lijie DONG
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  • School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
Published: 2025-10-05 doi: 10.14106/j.cnki.1001-2028.2025.0036
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Biaxially oriented polypropylene（BOPP）exhibits superior energy conversion efficiency and remarkable power density. However，its inherently low dielectric constant fundamentally limits its energy storage capacity，thereby impeding its applications in power storage systems，smart manufacturing，and aerospace engineering. In this study，oxygen plasma treatment was systematically employed to modify the surface of BOPP films，which effectively increased the number of oxygen-containing functional groups on the film surface and enhanced its hydrophilicity. Subsequently，the electrical properties of the modified BOPP films were comprehensively characterized，and the influence of plasma treatment time on these properties was quantitatively investigated. The results indicate that with the extension of plasma treatment time，the dielectric constant of BOPP films increased monotonically from 2.20 to 2.37.When the treatment time was 5min，the breakdown strength and discharge energy density of the modified films reached 785.7MV·m-1 and 6.78J·cm-3，respectively. This work provides a feasible and novel strategy for the development of dielectric films with high energy storage performance，laying a foundation for their broader application in the advanced energy storage scenarios.

plasma treatment  /  polypropylene  /  dielectric properties  /  breakdown strength  /  energy density
Xi ZHOU, Wenxiong CHEN, Meng PAN, Yang ZHANG, Lijie DONG. Enhanced electrical properties of BOPP films by plasma treatment[J]. Electronic Components and Materials, 2025 , 44 (10) : 1145 -1152 . DOI: 10.14106/j.cnki.1001-2028.2025.0036
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Year 2025 volume 44 Issue 10
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doi: 10.14106/j.cnki.1001-2028.2025.0036
  • Receive Date：2025-01-21
  • Online Date：2026-04-16
  • Published：2025-10-05
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  • Received：2025-01-21
Affiliations
    School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
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https://castjournals.cast.org.cn/joweb/dzyjycl/EN/10.14106/j.cnki.1001-2028.2025.0036
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表12种不同金属材料的力学参数
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Family		 属数
Number of
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Number of
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Percentage of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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