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Low Temperature Co-fired Ceramics（LTCC）technology is recognized as one of the most promising three-dimensional packaging technologies. As the pastes used in LTCC technology evolve from gold to silver and copper，electroless Ni/Pd/Au（ENEPIG）plating has become a crucial step to prevent post-sintering oxidation or electromigration failures of embedded circuits. Based on this context，this study comprehensively reviews the corrosion mechanisms of LTCC substrates in acidic/alkaline environments. Typical corrosion behaviors and failure cases are analyzed to reveal their common degradation patterns. The intrinsic relationships among the composition，structure，and corrosion resistance of LTCC sintering additive glasses under diverse corrosive conditions are systematically summarized. Furthermore，design principles for sintering additive glasses applicable to electroless-plated LTCC substrates are discussed，providing theoretical guidance for developing low-cost and high-reliability LTCC materials.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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