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Research on Power Module Integration of TEC Temperature Control
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Jiajun YANG1, 2, 3, Tongjian LIU4, Puqi NING  Member, CPSS1, 2, 3, Xin YAN4, Xiaoshuang HUI1, 2, 3, Yuhui KANG1, 2, 3
Journal of Power Supply | 2026, 24(7) : 20 - 28
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Journal of Power Supply | 2026, 24(7): 20-28
• Power Semiconductor Devices and Drive Circuits •
Research on Power Module Integration of TEC Temperature Control
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Jiajun YANG1, 2, 3, Tongjian LIU4, Puqi NING  Member, CPSS1, 2, 3, Xin YAN4, Xiaoshuang HUI1, 2, 3, Yuhui KANG1, 2, 3
Affiliations
  • 1.Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
  • 2.University of Chinese Academy of Sciences, Beijing 100049, China
  • 3.Key Laboratory of Power Electronics and Electric Drive, Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
  • 4.School of Information Science and Engineering, Northeastern University, Shenyang 110819, China
Published: 2026-07-30 doi: 10.13234/j.issn.2095-2805.2026.7.20
Outline
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The power module is a critical component of the powertrain system in electric vehicles, and its development is driven by the trends of high-frequency operation, miniaturization, high power density and high integration, which brings increasingly severe challenges to thermal management. Thermoelectric cooler (TEC) has attracted widespread attention for its compact structure, high reliability and rapid cooling performance. A temperature feedback control strategy based on thermoelectric cooling is proposed, with phase change materials (PCM) adopted as the interface layers at both cold and hot ends of TEC. Combined with simulation and experimental verification, the layout design of transverse and longitudinal heat transfer paths from the chip to the heat sink is investigated. Compared with the non-TEC cooling scheme, the proposed integrated TEC-based thermal management method reduces the maximum temperature of the SiC chip from 77.6 ℃ to 60.0 ℃, achieving effective thermal regulation and precise temperature feedback control. An efficient thermal management solution for high-power-density SiC power modules is provided and its application potential in electric vehicle power systems is exhibited.

Power module  /  thermoelectric cooler (TEC)  /  thermal management  /  temperature control
杨嘉俊, 刘同健, 宁圃奇中国电源学会会员, 闫欣, 回晓双, 康玉慧. 功率模块集成TEC温度控制研究. 电源学报, 2026 , 24 (7) : 20 -28 . DOI: 10.13234/j.issn.2095-2805.2026.7.20
Jiajun YANG, Tongjian LIU, Puqi NING, Xin YAN, Xiaoshuang HUI, Yuhui KANG. Research on Power Module Integration of TEC Temperature Control[J]. Journal of Power Supply, 2026 , 24 (7) : 20 -28 . DOI: 10.13234/j.issn.2095-2805.2026.7.20
Funding
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  • National Key Research and Development Program of China(2021YFB2500600)
Appendix
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Year 2026 volume 24 Issue 7
37
8
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Article Info
doi: 10.13234/j.issn.2095-2805.2026.7.20
  • Receive Date：2025-11-20
  • Online Date：2026-10-29
  • Published：2026-07-30
Article Data
Affiliations
History
  • Received：2025-11-20
  • Revised：2026-01-07
  • Accepted：2026-01-26
Funding
National Key Research and Development Program of China(2021YFB2500600)
Affiliations
    1.Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
    2.University of Chinese Academy of Sciences, Beijing 100049, China
    3.Key Laboratory of Power Electronics and Electric Drive, Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
    4.School of Information Science and Engineering, Northeastern University, Shenyang 110819, China
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