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3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module
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Siyuan WANG1, Yuxi LIANG2, Peng SUN2, Mingrui ZOU2, Jiakun GONG2, Zheng ZENG2
Journal of Power Supply | 2024, 22(3) : 87 - 92
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Journal of Power Supply | 2024, 22(3): 87-92
• Packaging Design and Optimization •
3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module
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Siyuan WANG1, Yuxi LIANG2, Peng SUN2, Mingrui ZOU2, Jiakun GONG2, Zheng ZENG2
Affiliations
  • 1 CQU-UC Joint Co-Op Institute, Chongqing University Chongqing 400044 China
  • 2 School of Electrical Engineering Chongqing University Chongqing 400044 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.87
Outline
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The bidirectional switch is extensively applied in the fields such as state-solid breakers and photovoltaic inverters, and increasing attention is paid to the bidirectional switch of SiC power modules owing to its low power loss and high switching frequency. However, due to the traditional packaging methods for Si power modules, the bidirectional switch of the SiC power module is challenged by the issue of high switching speed. Aimed at the low-inductance packaging requirement, a chip-on-chip 3D packaging method is proposed for the bidirectional switch of the SiC power module. The circuit topology and geometric structure of the 3D packaging are given, and the communication loop and parasitic inductance of the 3D packaging are analyzed. In addition, the process was designed for the 3D packaging, and a prototype of the bidirectional switch of the SiC power module was fabricated. Experimental results of a double-pulse test verified the feasibility and effectiveness of the proposed 3D packaging for the bidirectional switch of the SiC power module.

Bidirectional switch  /  SiC power module  /  low parasitic inductance  /  3D packaging
Siyuan WANG, Yuxi LIANG, Peng SUN, Mingrui ZOU, Jiakun GONG, Zheng ZENG. 3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module[J]. Journal of Power Supply, 2024 , 22 (3) : 87 -92 . DOI: 10.13234/j.issn.2095-2805.2024.3.87
Funding
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  • National Natural Science Foundation of China(52177169)
Appendix
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Year 2024 volume 22 Issue 3
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268
97
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.87
  • Receive Date：2024-02-03
  • Online Date：2025-07-21
  • Published：2024-05-30
Article Data
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History
  • Received：2024-02-03
  • Revised：2024-02-14
  • Accepted：2024-02-23
Funding
National Natural Science Foundation of China(52177169)
Affiliations
    1 CQU-UC Joint Co-Op Institute, Chongqing University Chongqing 400044 China
    2 School of Electrical Engineering Chongqing University Chongqing 400044 China
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