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Development of Thermal Simulation System Based on Smoothed Particle Hydrodynamics Algorithm
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Zihou ZHU1, 2, Yizhuo DONG1, 2, Liming CHE1, 2, Cancan LI1, 2, Min LI1, 2, Guangyin LEI1, 2
Journal of Power Supply | 2024, 22(3) : 46 - 53
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Journal of Power Supply | 2024, 22(3): 46-53
• Power Device Modeling •
Development of Thermal Simulation System Based on Smoothed Particle Hydrodynamics Algorithm
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Zihou ZHU1, 2, Yizhuo DONG1, 2, Liming CHE1, 2, Cancan LI1, 2, Min LI1, 2, Guangyin LEI1, 2
Affiliations
  • 1 Institute of Future Lighting, Academy for Engineering & Technology, Fudan University Shanghai 200433 China
  • 2 Research Institute of Fudan University Ningbo 315327 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.46
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As electronic devices continue to miniaturize and integrate, thermal simulation has become a critical factor during the design phase. The conventional finite element method(FEM) used for the thermal simulation of electronics packaging modules faces a trade-off between computational efficiency and accuracy, and it also encounters difficulties in handling problems of large deformation and grid distortion, which will cause errors in the results. In this paper, a thermal simulation system for electronics packaging modules based on the smoothed particle hydrodynamics (SPH) algorithm is proposed. The SPH algorithm is based on the meshless Lagrange numerical method, and it resolves the heat conduction equation by discretizing the simulation object into a set of particles, thus accurately predicting the heat conduction and heat dissipation in electronics packaging modules. Since it does not need to generate a large number of micro-meshes, there is no grid distortion. Compared with FEM, the SPH algorithm achieves an accuracy error between 1% and 2%, thereby improving the simulation efficiency by approximately 30 times. Therefore, this algorithm is highly suitable in simulating the thermal behavior of a dynamical system with a complex structure.

Electronics packaging  /  finite element simulation  /  smoothed particle hydrodynamics(SPH)  /  heat conduction equation
Zihou ZHU, Yizhuo DONG, Liming CHE, Cancan LI, Min LI, Guangyin LEI. Development of Thermal Simulation System Based on Smoothed Particle Hydrodynamics Algorithm[J]. Journal of Power Supply, 2024 , 22 (3) : 46 -53 . DOI: 10.13234/j.issn.2095-2805.2024.3.46
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.46
  • Receive Date：2024-01-31
  • Online Date：2025-07-21
  • Published：2024-05-30
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  • Received：2024-01-31
  • Revised：2024-04-06
  • Accepted：2024-04-20
Affiliations
    1 Institute of Future Lighting, Academy for Engineering & Technology, Fudan University Shanghai 200433 China
    2 Research Institute of Fudan University Ningbo 315327 China
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