The junction temperature monitoring of power devices in a solid-state power controller(SSPC) plays a vital role in the SSPC reliability. The thermal model method is widely used owing to its contactless measurement and simplicity. However, the aging of the power chip will lead to the degradation of the thermal path, and the junction-to-case thermal resistance of the device will increase. As a result, the actual junction temperature may far exceed the value estimated by the thermal network model, leading to an optimistic estimation of the device's state-of-health. The failure of the solder layer is considered to be one of the main reasons for the aging failure of SSPC power devices. In this paper, the device's aging state is monitored in real time during the life of SSPC, and the thermal model of the power device is adaptively updated online. The thermal impedance taken as an update basis is calculated by measuring the temperature-sensitive electrical parameters which are not affected by the degradation of the solder layer, and the thermal impedance information is associated with the aging state of the solder layer to update the thermal model. Using the proposed method, the thermal model can be updated in real time without affecting the normal operation of SSPC, and experimental results verified the effectiveness of this method.