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Multi-physical Domain Coupling Analysis of Multi-chip Parallel Controller
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Zhaoran WANG, Wei SHI, Aihua LIAO, Dingyu HU
Journal of Power Supply | 2026, 24(7) : 305 - 314
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Journal of Power Supply | 2026, 24(7): 305-314
• Motor Drives and Control •
Multi-physical Domain Coupling Analysis of Multi-chip Parallel Controller
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Zhaoran WANG, Wei SHI, Aihua LIAO, Dingyu HU
Affiliations
  • School of Urban Rail Transit, Shanghai University of Engineering Science, Shanghai 201620, China
Published: 2026-07-30 doi: 10.13234/j.issn.2095-2805.2026.7.305
Outline
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Silicon carbide devices with multi-chip parallel structure are widely used in motor controllers for new energy vehicles in high frequency and high power density applications. The motor controller is a highly coupled electromagnetic-thermal system. The imbalance of chip temperature and stray inductance in the multi-chip parallel structure aggravates the complexity of the coupling system. In order to reveal the deep coupling mechanism of electromagnetic-thermal and the variation law of electromagnetic-thermal domain in the motor controller, multi-physical field coupling analysis under multi-parallel structure is needed. A multi-physical field coupling analysis method based on parameter transfer is proposed. First, the stray inductance model of chip parallel branch at different temperatures is established by magnetic-thermal coupling analysis. Then, through the electro-thermal coupling analysis, the simulation model of silicon carbide chip losses under different temperatures and stray inductance is established. Finally, loss parameter transfer is used to simulate the temperature of the controller under fluid-solid coupling, and the stray inductance model and loss model at this temperature are updated in real time. The electromagnetic-thermal coupling parameters of the chips under the multi-chip parallel structure during the temperature rise of the controller are studied. The accuracy of the multi-physics coupling analysis method is verified by the temperature rise experiment.

Multi-chip parallel  /  multi-physical domain  /  parameter coupling  /  stray inductance
王钊冉, 师蔚, 廖爱华, 胡定玉. 多芯片并联控制器的多物理场耦合分析. 电源学报, 2026 , 24 (7) : 305 -314 . DOI: 10.13234/j.issn.2095-2805.2026.7.305
Zhaoran WANG, Wei SHI, Aihua LIAO, Dingyu HU. Multi-physical Domain Coupling Analysis of Multi-chip Parallel Controller[J]. Journal of Power Supply, 2026 , 24 (7) : 305 -314 . DOI: 10.13234/j.issn.2095-2805.2026.7.305
  • National Key Research and Development Plan “New Energy Vehicles” Key Special Project(2022YFB2502805)
Year 2026 volume 24 Issue 7
35
5
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Article Info
doi: 10.13234/j.issn.2095-2805.2026.7.305
  • Receive Date:2024-09-09
  • Online Date:2026-10-29
  • Published:2026-07-30
Article Data
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History
  • Received:2024-09-09
  • Revised:2024-11-13
  • Accepted:2024-11-26
Funding
National Key Research and Development Plan “New Energy Vehicles” Key Special Project(2022YFB2502805)
Affiliations
    School of Urban Rail Transit, Shanghai University of Engineering Science, Shanghai 201620, China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
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属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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