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Optimization Method for Cauer Model Considering Deformation and Offset Characteristics of Dynamic Thermal Diffusion Boundary
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Aoyang LI1, Jinlei XIN2, Mingxing DU  Member, CPSS1
Journal of Power Supply | 2026, 24(6) : 1 - 10
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Journal of Power Supply | 2026, 24(6): 1-10
• Power Semiconductor Devices and Drive Circuits •
Optimization Method for Cauer Model Considering Deformation and Offset Characteristics of Dynamic Thermal Diffusion Boundary
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Aoyang LI1, Jinlei XIN2, Mingxing DU  Member, CPSS1
Affiliations
  • 1.Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin 300384, China
  • 2.Chengdong Power Supply Branch Company, State Grid Tianjin Electric Power Company, Tianjin 300250, China
Published: 2026-06-30 doi: 10.13234/j.issn.2095-2805.2026.6.1
Outline
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At present, most of the traditional Cauer models assume that the shape of the effective thermal conduction surface of each layer in an insulated gate bipolar transistor (IGBT) module is square or circular, which leads to large errors of the calculation results of IGBT module junction temperature. On this basis, the shape of the effective thermal conduction surface of each layer in the IGBT module are studied, and a Cauer model considering the deformation characteristics of thermal diffusion boundary is proposed to make it more suitable for the actual situation. It is found that a phenomenon of offset occurs at the thermal diffusion boundary of the IGBT module. By capturing the diameter of the selected dynamic thermal diffusion boundary and modifying the parameters of the Cauer model which considerers the deformation and offset characteristics of dynamic thermal diffusion boundary, the junction temperature of the IGBT module can be accurately estimated. The correctness and feasibility of the proposed optimization method for Cauer model consideringthe deformation and offset characteristics of dynamic thermal diffusion boundary were verified by simulation and experimental results.

Insulated gate bipolar transistor (IGBT) module  /  shape of effective thermal conduction surface  /  Cauer model  /  thermal boundary offset  /  junction temperature
李澳阳, 信金蕾, 杜明星中国电源学会会员. 计及动态热扩散边界形变和偏移特性的Cauer模型优化方法. 电源学报, 2026 , 24 (6) : 1 -10 . DOI: 10.13234/j.issn.2095-2805.2026.6.1
Aoyang LI, Jinlei XIN, Mingxing DU. Optimization Method for Cauer Model Considering Deformation and Offset Characteristics of Dynamic Thermal Diffusion Boundary[J]. Journal of Power Supply, 2026 , 24 (6) : 1 -10 . DOI: 10.13234/j.issn.2095-2805.2026.6.1
Year 2026 volume 24 Issue 6
26
3
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Article Info
doi: 10.13234/j.issn.2095-2805.2026.6.1
  • Receive Date:2024-04-05
  • Online Date:2026-10-29
  • Published:2026-06-30
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History
  • Received:2024-04-05
  • Revised:2024-07-03
  • Accepted:2024-07-22
Affiliations
    1.Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin 300384, China
    2.Chengdong Power Supply Branch Company, State Grid Tianjin Electric Power Company, Tianjin 300250, China
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表12种不同金属材料的力学参数
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小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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