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Research on Transient Thermal Structure Function Modeling of SiC Devices Based on Improved Wiener Filtering Deconvolution
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Longnü LI1, Zhanpeng LIU1, Gaojia ZHU1, Songmao ZHANG1, 2, Yunhui MEI  Senior Member, CPSS1
Journal of Power Supply | 2026, 24(1) : 1 - 9
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Journal of Power Supply | 2026, 24(1): 1-9
• Power Semiconductor Devices and Drive Circuits •
Research on Transient Thermal Structure Function Modeling of SiC Devices Based on Improved Wiener Filtering Deconvolution
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Longnü LI1, Zhanpeng LIU1, Gaojia ZHU1, Songmao ZHANG1, 2, Yunhui MEI  Senior Member, CPSS1
Affiliations
  • 1.School of Electrical Engineering, Tiangong University, Tianjin 300387, China
  • 2.The Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China
Published: 2026-01-30 doi: 10.13234/j.issn.2095-2805.2026.1.1
Outline
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The thermal characteristic modeling of silicon carbide (SiC) power devices is a key aspect in their design and development. The structure function method is crucial for characterizing the devices’ thermal characteristics, focusing on acquiring the time-constant spectrum of input data via deconvolution algorithms. However, the environmental noise inevitably affects actual tests, thereby demanding more sophisticated deconvolution algorithms for the structure function. Therefore, a deconvolution structure function algorithm based on improved Wiener filtering is proposed, effectively addressing the noise problem in the measurement data during the transient thermal analysis. First, a structure function model based on Wiener filtering deconvolution is put forward, and the algorithm’s effectiveness is validated through analyzing the TDIM-Master benchmark problem. Second, different levels of noise are added to the benchmark problem to explore the signal quality and peak thermal resistance of the time-constant spectrum across various noise conditions. The accuracy and superiority of the improved method when dealing with noises are verified through a comparison with the conventional algorithm. Finally, the transient thermal resistance of two different types of SiC power devices were measured under conditions with or without thermal silicone grease, and the structure function analysis was also performed, thus verifying the stability and applicability of the proposed algorithm under real measurement environment.

Structure function  /  SiC power device  /  transient thermal characteristic  /  Wiener filtering deconvolution  /  noise suppression
李龙女, 刘展鹏, 朱高嘉, 章松茂, 梅云辉中国电源学会高级会员. 基于改进维纳滤波反卷积的SiC器件瞬态热结构函数建模研究. 电源学报, 2026 , 24 (1) : 1 -9 . DOI: 10.13234/j.issn.2095-2805.2026.1.1
Longnü LI, Zhanpeng LIU, Gaojia ZHU, Songmao ZHANG, Yunhui MEI. Research on Transient Thermal Structure Function Modeling of SiC Devices Based on Improved Wiener Filtering Deconvolution[J]. Journal of Power Supply, 2026 , 24 (1) : 1 -9 . DOI: 10.13234/j.issn.2095-2805.2026.1.1
Funding
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  • Key Laboratory of Engineering Dielectrics and Its Application (Harbin University of Science and Technology), Ministry of Education(KFZ202603)
  • National Natural Science Foundation of China(52177189)
  • “Chunhui Plan” Collaborative Research Project of Ministry of Education of China(HZKY20220604)
  • Tianjin Municipal Science and Technology Bureau(24JCZXJC00130)
Appendix
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Year 2026 volume 24 Issue 1
68
14
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Article Info
doi: 10.13234/j.issn.2095-2805.2026.1.1
  • Receive Date：2025-01-10
  • Online Date：2026-10-26
  • Published：2026-01-30
Article Data
Affiliations
History
  • Received：2025-01-10
  • Revised：2025-03-08
  • Accepted：2025-03-20
Funding
Key Laboratory of Engineering Dielectrics and Its Application (Harbin University of Science and Technology), Ministry of Education(KFZ202603)
National Natural Science Foundation of China(52177189)
“Chunhui Plan” Collaborative Research Project of Ministry of Education of China(HZKY20220604)
Tianjin Municipal Science and Technology Bureau(24JCZXJC00130)
Affiliations
    1.School of Electrical Engineering, Tiangong University, Tianjin 300387, China
    2.The Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China
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