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Estimation of IGBT Loss and Junction Temperature Based on Thermal Coupling Analysis
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Liutao XIONG1, 2, Guoli LI1, 3, 4, Zehui SUN1, 2
Journal of Power Supply | 2025, 23(4) : 306 - 315
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Journal of Power Supply | 2025, 23(4): 306-315
• Power Semiconductor Devices •
Estimation of IGBT Loss and Junction Temperature Based on Thermal Coupling Analysis
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Liutao XIONG1, 2, Guoli LI1, 3, 4, Zehui SUN1, 2
Affiliations
  • 1.School of Electrical Engineering and Automation, Anhui University, Hefei 230601, China
  • 2.Collaborative Innovation Center of Industrial Energy-Saving and Power Quality Control, Anhui University, Hefei 230601, China
  • 3.Power Quality Engineering Research Center of Ministry of Education, Anhui University, Hefei 230601, China
  • 4.Anhui Key Laboratory of Industrial Energy-Saving and Safety, Anhui University, Hefei 230601, China
Published: 2025-07-30 doi: 10.13234/j.issn.2095-2805.2025.4.306
Outline
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The IGBT module of a motor controller is one of the important components for realizing electric energy conversion and motor control. This module usually works under complex conditions, and its reliability is crucial for the stability of the whole electric drive system. In general, the IGBT loss is directly calculated using the method of manual formulas, which ignores the influence of temperature rise on the IGBT module. Aimed at this problem, a method of thermal coupling analysis is proposed. First, a loss calculation model of IGBT module is established. On the basis, a thermal network model is built for the estimation of junction temperature, and the temperature rise estimation result is further used to correct the loss calculation model. A simulation model of the motor controller is constructed, and the junction temperature and loss of IGBT are simulated. In addition, the effectiveness of the proposed thermal coupling analysis method was verified by the results of a temperature rise experiment conducted on the motor controller.

Motor controller  /  IGBT  /  temperature rise prediction  /  loss calculation
熊刘涛, 李国丽, 孙泽辉. 基于热耦合分析的IGBT损耗与结温估算研究. 电源学报, 2025 , 23 (4) : 306 -315 . DOI: 10.13234/j.issn.2095-2805.2025.4.306
Liutao XIONG, Guoli LI, Zehui SUN. Estimation of IGBT Loss and Junction Temperature Based on Thermal Coupling Analysis[J]. Journal of Power Supply, 2025 , 23 (4) : 306 -315 . DOI: 10.13234/j.issn.2095-2805.2025.4.306
Funding
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  • National Key Research and Development Program of China(2018YFB0104900)
Appendix
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Year 2025 volume 23 Issue 4
70
19
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Article Info
doi: 10.13234/j.issn.2095-2805.2025.4.306
  • Receive Date：2022-05-27
  • Online Date：2026-10-26
  • Published：2025-07-30
Article Data
Affiliations
History
  • Received：2022-05-27
  • Revised：2022-07-19
  • Accepted：2022-08-15
Funding
National Key Research and Development Program of China(2018YFB0104900)
Affiliations
    1.School of Electrical Engineering and Automation, Anhui University, Hefei 230601, China
    2.Collaborative Innovation Center of Industrial Energy-Saving and Power Quality Control, Anhui University, Hefei 230601, China
    3.Power Quality Engineering Research Center of Ministry of Education, Anhui University, Hefei 230601, China
    4.Anhui Key Laboratory of Industrial Energy-Saving and Safety, Anhui University, Hefei 230601, China
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