Home Journals Articles Updates About
CN
image
收藏切换
3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module
收藏切换
PDF
Siyuan WANG1, Yuxi LIANG2, Peng SUN2, Mingrui ZOU2, Jiakun GONG2, Zheng ZENG2
Journal of Power Supply | 2024, 22(3) : 87 - 92
Less
收藏切换
Journal of Power Supply | 2024, 22(3): 87-92
• Packaging Design and Optimization •
3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module
Full
Siyuan WANG1, Yuxi LIANG2, Peng SUN2, Mingrui ZOU2, Jiakun GONG2, Zheng ZENG2
Affiliations
  • 1 CQU-UC Joint Co-Op Institute, Chongqing University Chongqing 400044 China
  • 2 School of Electrical Engineering Chongqing University Chongqing 400044 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.87
Outline
收藏切换

The bidirectional switch is extensively applied in the fields such as state-solid breakers and photovoltaic inverters, and increasing attention is paid to the bidirectional switch of SiC power modules owing to its low power loss and high switching frequency. However, due to the traditional packaging methods for Si power modules, the bidirectional switch of the SiC power module is challenged by the issue of high switching speed. Aimed at the low-inductance packaging requirement, a chip-on-chip 3D packaging method is proposed for the bidirectional switch of the SiC power module. The circuit topology and geometric structure of the 3D packaging are given, and the communication loop and parasitic inductance of the 3D packaging are analyzed. In addition, the process was designed for the 3D packaging, and a prototype of the bidirectional switch of the SiC power module was fabricated. Experimental results of a double-pulse test verified the feasibility and effectiveness of the proposed 3D packaging for the bidirectional switch of the SiC power module.

Bidirectional switch  /  SiC power module  /  low parasitic inductance  /  3D packaging
Siyuan WANG, Yuxi LIANG, Peng SUN, Mingrui ZOU, Jiakun GONG, Zheng ZENG. 3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module[J]. Journal of Power Supply, 2024 , 22 (3) : 87 -92 . DOI: 10.13234/j.issn.2095-2805.2024.3.87
Funding
Less
  • National Natural Science Foundation of China(52177169)
Appendix
Less
Year 2024 volume 22 Issue 3
PDF
271
98
Cite this Article
BibTeX
Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.87
  • Receive Date：2024-02-03
  • Online Date：2025-07-21
  • Published：2024-05-30
Article Data
Affiliations
History
  • Received：2024-02-03
  • Revised：2024-02-14
  • Accepted：2024-02-23
Funding
National Natural Science Foundation of China(52177169)
Affiliations
    1 CQU-UC Joint Co-Op Institute, Chongqing University Chongqing 400044 China
    2 School of Electrical Engineering Chongqing University Chongqing 400044 China
References
Share
https://castjournals.cast.org.cn/joweb/dyxb/EN/10.13234/j.issn.2095-2805.2024.3.87
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT
Links
Articles
Latest Articles
Most Read
Collections
Updates
Events
News
Multimedia
About
About Us
Contact
No. 86 Xueyuan South Road, Haidian District, Beijing
100081
010-62199257
qkjq@cast.org.cn

Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House