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Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging
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Hu'an HU1, Qiang JIA1, 2, Yishu WANG1, Xiaoliang JI1, Guisheng ZOU3, Fu GUO1, 4
Journal of Power Supply | 2024, 22(3) : 62 - 71
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Journal of Power Supply | 2024, 22(3): 62-71
• Packaging Design and Optimization •
Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging
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Hu'an HU1, Qiang JIA1, 2, Yishu WANG1, Xiaoliang JI1, Guisheng ZOU3, Fu GUO1, 4
Affiliations
  • 1 School of Materials Science and Engineering Beijing University of Technology Beijing 100124 China
  • 2 Chongqing Research Institute Beijing University of Technology Chongqing 400015 China
  • 3 Department of Mechanical Engineering Tsinghua University Beijing 100084 China
  • 4 School of Mechanical and Electrical Engineering Beijing Information Science and Technology University Beijing 100096 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.62
Outline
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As the service environment of power semiconductor devices becomes more and more severe, the third-generation semiconductor represented by silicon carbide (SiC) has become the mainstream of industry applications owing to its excellent high-temperature performance. However, the lack of bounding materials which not only match with SiC chips but also have a low cost and a high melting point has become a bottleneck in the development of the industry. Cu-Sn intermetallic compounds (IMCs) are considered to be ideal bounding materials for SiC chips because of their low cost, good conductivity and characteristics that meet the requirements of low-temperature bonding and high-temperature service. Aimed at the power semiconductor device packaging, the preparation and reliability of Cu-Sn full IMC joints at home and abroad in recent years are analyzed and reviewed, and the problems to be solved at present and the development trend in the future are discussed.

Power device packaging  /  full intermetallic compound (IMC)  /  preparation process  /  reliability
Hu'an HU, Qiang JIA, Yishu WANG, Xiaoliang JI, Guisheng ZOU, Fu GUO. Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging[J]. Journal of Power Supply, 2024 , 22 (3) : 62 -71 . DOI: 10.13234/j.issn.2095-2805.2024.3.62
Funding
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  • Chongqing Natural Science Foundation project(CSTB2023NSCQ-MSX0187)
  • Beijing Natural Science Foundation-Millet Innovation Joint Fund(L233038)
Appendix
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Year 2024 volume 22 Issue 3
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.62
  • Receive Date：2024-01-31
  • Online Date：2025-07-21
  • Published：2024-05-30
Article Data
Affiliations
History
  • Received：2024-01-31
  • Revised：2024-03-01
  • Accepted：2024-03-13
Funding
Chongqing Natural Science Foundation project(CSTB2023NSCQ-MSX0187)
Beijing Natural Science Foundation-Millet Innovation Joint Fund(L233038)
Affiliations
    1 School of Materials Science and Engineering Beijing University of Technology Beijing 100124 China
    2 Chongqing Research Institute Beijing University of Technology Chongqing 400015 China
    3 Department of Mechanical Engineering Tsinghua University Beijing 100084 China
    4 School of Mechanical and Electrical Engineering Beijing Information Science and Technology University Beijing 100096 China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
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Genus		 种数
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Percentage of total
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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