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With the widespread applications of insulated gate bipolar transistors (IGBTs) in power electronic systems, the accurate acquisition of junction temperature which affects their reliability has become crucial. However, one of the main forms of module failure is the aging of the solder layer, which can have a significant impact on the junction temperature. To accurately estimate the junction temperature, the advantages of two traditional thermal network models (i.e., Cauer and Foster) are combined in this paper, and an interface method for the two models is studied, so that the combination is completed. The aging of the chip solder layer is taken into account, and a hybrid thermal network model is proposed. Finally, through the comparison of finite element simulation and experimental test with the calculation results of the hybrid thermal network model, it is verified that the hybrid thermal network model can achieve an accurate junction temperature estimation, providing a basis for monitoring the operating status of the module.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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