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In the development of technologies for power electronic devices used in automobiles, the power modules are developing towards the direction of miniaturization and high power density. As a result, the high-frequency switching of power devices used in automobiles will increase the fatigue failure risk of bonding wires. To improve the strength and reliability of bonding, the action mechanism of bonding parameters at different stages was revealed from the perspective of the bonding principle at first, and the optimization intervals for different parameters were obtained using single-factor experiments. Subsequently, a systematic investigation of the influence of wire bonding materials on bonding reliability was conducted through numerical simulations and aging tests. Results indicate that compared with Al bonding wires, Cu bonding wires exhibited higher maximum temperatures and higher maximum equivalent stress. However, due to material properties, Cu bonding wires only achieved half the maximum plastic strain of Al bonding wires. Based on power cycling tests, the lifetime of Cu bonding wires was approximately four times that of Al bonding wires. Moreover, Cu bonding wires exhibited a higher degree of variability in bonding quality, with the phenomenon of stepwise signal escalation due to the detachment of a single wire serving as an early warning signal for potential failures in daily operations.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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