Home Journals Articles Updates About
CN
image
收藏切换
Editorial for the Special Issue on High Reliability Power Device Packaging and Assistant Technology in EV Application
收藏切换
PDF
Yunhui MEI1, Puqi NING2, Guangyin LEI3, Zheng ZENG4
Journal of Power Supply | 2024, 22(3) : 15 - 21
Less
收藏切换
Journal of Power Supply | 2024, 22(3): 15-21
• High Reliability Power Device Packaging and Assistant Technology in EV Application •
Editorial for the Special Issue on High Reliability Power Device Packaging and Assistant Technology in EV Application
Full
Yunhui MEI1, Puqi NING2, Guangyin LEI3, Zheng ZENG4
Affiliations
  • 1 Tiangong University Tianjin 300387 China
  • 2 Institute of Electrical Engineering, Chinese Academy of Sciences Beijing 100190 China
  • 3 Fudan University Shanghai 200433 China
  • 4 Chongqing University Chongqing 400044 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.15
Outline
收藏切换

The advancements in research on automotive power device packaging have significantly improved the dynamic performance and driving range of electric vehicles, making them more efficient and reliable. With the continuous optimization of automotive power device packaging, the electric vehicle industry is expected to embrace a broader market prospect and development space. In recent years, power device packaging modeling, packaging structure and optimization, thermal management and junction temperature monitoring, gate drive and applications, reliability analysis, and online monitoring have become current research hotspots and have received sustained attention from both the academic and industrial sectors. To promote discussions on the challenges and hot issues related to automotive power devices packaging and their applications, a special issue titled "High Reliability Power Device Packaging and Assistant Technology in EV Application" has been launched in the Journal of Power Supply.

Automotive power device packaging  /  packaging assistant technology  /  high reliability  /  editorial comment
Yunhui MEI, Puqi NING, Guangyin LEI, Zheng ZENG. Editorial for the Special Issue on High Reliability Power Device Packaging and Assistant Technology in EV Application[J]. Journal of Power Supply, 2024 , 22 (3) : 15 -21 . DOI: 10.13234/j.issn.2095-2805.2024.3.15
Appendix
Less
Year 2024 volume 22 Issue 3
PDF
356
135
Cite this Article
BibTeX
Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.15
  • Online Date：2025-07-21
  • Published：2024-05-30
Article Data
Affiliations
History
Affiliations
    1 Tiangong University Tianjin 300387 China
    2 Institute of Electrical Engineering, Chinese Academy of Sciences Beijing 100190 China
    3 Fudan University Shanghai 200433 China
    4 Chongqing University Chongqing 400044 China
References
Share
https://castjournals.cast.org.cn/joweb/dyxb/EN/10.13234/j.issn.2095-2805.2024.3.15
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT
Links
Articles
Latest Articles
Most Read
Collections
Updates
Events
News
Multimedia
About
About Us
Contact
No. 86 Xueyuan South Road, Haidian District, Beijing
100081
010-62199257
qkjq@cast.org.cn

Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House