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Review of Research on Active Thermal Control Technologies for Power Modules
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Yigeng HUANGFU, Shaolin SONG, Xiaopeng WANG, Fan LI, Ziyu GAN
Journal of Power Supply | 2024, 22(3) : 118 - 126
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Journal of Power Supply | 2024, 22(3): 118-126
Thermal Management and Junction Temperature Monitoring
Review of Research on Active Thermal Control Technologies for Power Modules
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Yigeng HUANGFU, Shaolin SONG, Xiaopeng WANG, Fan LI, Ziyu GAN
Affiliations
  • School of Automation Northwestern Polytechnical University Xi'an 710072 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.118
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Power semiconductor devices are the core of electric energy conversion and electric drive based on the power electronics technology, which have broad application prospects in new energy generation, transportation, aerospace and other fields. However, the problems such as degradation, failure and reliability caused by heat generation have become bottlenecks that limit their further development, and it is urgent to explore effective thermal management methods to improve their reliability and service life. In this paper, based on the introduction of thermal management methods for power modules, the research progress in active thermal management methods is reviewed in detail, and these methods are divided into device-level, system-level and multi-parameter comprehensive methods according to the difference in control parameters. In addition, various methods are analyzed and compared. Finally, the development trend and prospect of technologies for power devices which are related to junction temperature are put forward, providing a reference for the subsequent research and applications.

Power device  /  reliability  /  junction temperature control  /  active thermal control
Yigeng HUANGFU, Shaolin SONG, Xiaopeng WANG, Fan LI, Ziyu GAN. Review of Research on Active Thermal Control Technologies for Power Modules[J]. Journal of Power Supply, 2024 , 22 (3) : 118 -126 . DOI: 10.13234/j.issn.2095-2805.2024.3.118
Year 2024 volume 22 Issue 3
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.118
  • Receive Date:2024-02-06
  • Online Date:2025-07-21
  • Published:2024-05-30
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History
  • Received:2024-02-06
  • Revised:2024-02-13
  • Accepted:2024-02-21
Affiliations
    School of Automation Northwestern Polytechnical University Xi'an 710072 China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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