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Investigation on Reliability of High-temperature Gate Oxide in SIC MOSFET
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Jianjun LIU1, 2, Hong CHEN2, Jieqin DING3, Yun BAI2, Jilong HAO2, Zhonglin HAN2
Journal of Power Supply | 2024, 22(1) : 147 - 152
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Journal of Power Supply | 2024, 22(1): 147-152
Power Semiconductor Devices
Investigation on Reliability of High-temperature Gate Oxide in SIC MOSFET
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Jianjun LIU1, 2, Hong CHEN2, Jieqin DING3, Yun BAI2, Jilong HAO2, Zhonglin HAN2
Affiliations
  • 1 School of Microelectronics University of Chinese Academy of Sciences Beijing 100049 China
  • 2 Institute of Microelectronics Chinese Academy of Sciences Beijing 100029 China
  • 3 Semiconductor Co., Ltd Zhuzhou CRRC Times Semiconductor Co., Ltd Zhuzhou 412001 China
Published: 2024-01-30 doi: 10.13234/j.issn.2095-2805.2024.1.147
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Silicon carbide (SiC) is a promising wide-bandgap semiconductor material owing to its excellent electrical and thermal characteristics. Power metal-oxide-semiconductor field-effect transistors (MOSFETs) based on SiC are suitable for high-power fields, and their high-temperature gate oxide reliability is one of the most concerned characteristics. In this paper, the high-temperature gate oxide reliability of self-developed SiC MOSFETs is compared with that of the foreign SiC MOSFETs of the same specification by positive and negative high-temperature gate bias (HTGB) tests. The negative HTGB test results show that the deviation of threshold voltage of self-developed SiC MOSFETs is almost equal to that of the foreign SiC MOSFETs, and the maximum discrepancy between them is about 4.52%. However, the positive HTGB test results show that the deviation of threshold voltage of self-developed SiC MOSFETs is smaller than that of the foreign SiC MOSFETs, with a maximum discrepancy of 11%. The reason for the better performance of self-developed devices is that an appropriate amount of nitrogen is added to the SiC/SiO2 interface, which can passivate interface defects and reduce the generation of fast interface states, so that the total interface state density is minimized.

Silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET)  /  reliability  /  gate oxide  /  high-temperature gate bias (HTGB)
Jianjun LIU, Hong CHEN, Jieqin DING, Yun BAI, Jilong HAO, Zhonglin HAN. Investigation on Reliability of High-temperature Gate Oxide in SIC MOSFET[J]. Journal of Power Supply, 2024 , 22 (1) : 147 -152 . DOI: 10.13234/j.issn.2095-2805.2024.1.147
  • National Key Research and Development Program of China(2016YFB0400404)
Year 2024 volume 22 Issue 1
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.1.147
  • Receive Date:2021-03-23
  • Online Date:2025-07-21
  • Published:2024-01-30
Article Data
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History
  • Received:2021-03-23
  • Revised:2021-05-24
  • Accepted:2021-06-02
Funding
National Key Research and Development Program of China(2016YFB0400404)
Affiliations
    1 School of Microelectronics University of Chinese Academy of Sciences Beijing 100049 China
    2 Institute of Microelectronics Chinese Academy of Sciences Beijing 100029 China
    3 Semiconductor Co., Ltd Zhuzhou CRRC Times Semiconductor Co., Ltd Zhuzhou 412001 China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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