Meta-aramid (PMIA) is a unique fiber that possesses exceptional insulation strength and thermodynamic stability. It is widely regarded as an ideal material for the development of the next generation of insulation paper. However, its intrinsic thermal conductivity of 0.21 W/(m·K) is relatively low and may not meet the long-term service requirements in high-temperature environments. To enhance the thermal conductivity and insulation of the PMIA paper, AlN and BN fillers are selected for composite doping modification of PMIA paper. The surfaces of the two fillers are coated with polydopamine (PDA) and modified with a KH550 silane coupling agent to improve the dispersibility of the two fillers. By adjusting the doping ratio, AlN-BN/PMIA composite insulation paper with different concentrations was prepared. The microstructure was characterized and the breakdown strength, conductivity, and thermal conductivity were tested. The effect of two different filler ratios on the insulation and thermal conductivity of the material was studied.
Firstly, the surfaces of the two fillers are coated with polydopamine (PDA) and modified with a KH550 silane coupling agent to enhance their dispersibility. By adjusting the doping ratio, AlN-BN/PMIA composite insulation paper with different concentrations is prepared. Secondly, the microstructure of samples is characterized and the breakdown voltage, conductivity, and thermal conductivity are tested. The influence of the ratio of two fillers on the insulation and thermal conductivity of the material was studied. Thirdly, based on density functional theory, band structure calculation and analysis are conducted, and a design concept of a “stepped charge trap” is proposed. In addition, the composite breakdown model is constructed using the phase field method, explaining the inherent mechanism of performance improvement.
According to the test results, adding BN to the AlN filler can further improve the matrix structure and fix the damage caused by the high concentration aggregation of AlN. The surface of the composite material appears relatively dense when the AlN/BN ratio is 3:7, with only a small amount of PMIA fibers and fillers precipitated. At a mass fraction of 40%, the breakdown strength of the composite gradually increases as the BN doping ratio increases. At a ratio of AlN/BN of 3:7, the composite paper exhibits its maximum breakdown strength of 186 kV/mm, which is 66.07% higher than that of the pure PMIA sample. Additionally, the conductivity of the composite is at its lowest value during this ratio. On the other hand, at an AlN/BN ratio of 7:3, the thermal conductivity of the composite is optimal, increasing by 213.6% compared to pure PMIA samples. The high aspect ratio structure of BN links it with AlN fillers to form an “thermal conductivity network”, which increases the thermal conductivity.
Energy band structure analysis based on density functional theory suggests that the wide bandgap properties of AlN and BN result in the formation of “stepped traps” at the PMIA interface. This leads to an increased energy barrier for charge transitions and limits the migration of charge carriers. In addition, a phase field simulation model indicates that the introduction of BN can further homogenize the electric field distribution, reduce the degree of local polarization, and thus enhance the insulation performance of the composite system.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |