Epoxy resin (EP) possesses advantages such as low cost, high mechanical strength, robust chemical resistance, and excellent electrical insulation properties, making it extensively utilized in various epoxy cast electrical equipment like dry transformers and reactors. Nonetheless, the three-dimensional cross-linked network of resins exhibits non-melting characteristics, posing challenges in the degradation and recycling of retired epoxy electrical equipment. Nowadays, researchers have achieved epoxy resin recycling by incorporating dynamic covalent bonds into the epoxy resin crosslinking network to develop degradable Vitrimer epoxy resin materials. However, when applied to complex environments like high temperature, humidity, and intense electric fields, the internal crosslinking network of epoxy Vitrimers material may deteriorate, impacting its operational longevity. Therefore, besides ensuring favorable electrical, mechanical, and thermal properties, the enduring reliable performance of Vitrimer resin cannot be disregarded. This paper prepared dual-dynamic bonds Vitrimer resin with varying disulfide bond contents. The micromorphology, electrical characteristics, mechanical properties, dynamic thermodynamic properties, and degradation properties of Vitrimer resin at diverse aging stages were regularly investigated and the life evaluation model is constructed at last.
Firstly, dual dynamic crosslinked Vitrimer resin basded on ester bonds and varied disulfide bonds were prepared with 3,3’-dithiodipropionic acid (DTDPA) and hexahydro-4-methylphthalic anhydride (MHHPA) as the curing agent, with Triethanolamine acting as the catalyst. Subsequently, the accelerated thermo-oxygen aging tests were carried out, during which the microscopic morphology, electrical properties, bending characteristics, dynamic thermodynamic attributes, and degradation properties of vitrimer resin were periodically evaluated. Experiment results revealed alterations in the resin's microstructure under hot oxygen aging, leading to random internal cross-linked network fractures that generate abundant free radicals, ultimately causing resin failure. The resin's bending strength diminishes, rigidity increases, toughness notably decreases, and the bending fracture transitions to a brittle fracture pattern. As aging progresses, a denser cross-linked network forms on the resin's surface, elevating Tg. The integration of disulfide bonds makes the resin system more susceptible to oxidation and molecular chain breakage, resulting in reduced breakdown voltage, heightened dielectric loss factor, and increased insulation deterioration. Throughout the aging process, the degradation rate of Vitrimer resin in glycol solution decreases due to surface ester bond reduction and oxide layer formation, while the destruction of the disulfide crosslinking network prevents resin degradation in dithiothreitol solution. Lastly, a life evaluation model for the dual dynamic crosslinked Vitrimer resin was formulated based on the results of bending strength and TGA tests.
The dual dynamic crosslinked Vitrimer resin has excellent comprehensive properties and can realize the recycling of decommissioned epoxy electrical equipment. In this paper, the effect of thermal oxygen aging on the properties of dual dynamic crosslinked degradable resin was studied, which laid the experimental and theoretical foundation for the long-term service of vitrification epoxy resin in electrical equipment.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |