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Experimental Study on Deformation Matching Damage Modes of the Array of Bonded Thermal Insulation Tile
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Jiuzhou LIU, Lei SHI, Yongjun WU, Yongpeng DONG, Tengfei XU
Missiles and Space Vehicles | 2025, 48(6) : 86 - 93
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Missiles and Space Vehicles | 2025, 48(6): 86-93
Environment and Test
Experimental Study on Deformation Matching Damage Modes of the Array of Bonded Thermal Insulation Tile
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Jiuzhou LIU, Lei SHI, Yongjun WU, Yongpeng DONG, Tengfei XU
Affiliations
  • Beijing Institute of Aerospace Systems Engineering, Beijing, 100076
Published: 2025-12-25 doi: 10.7654/j.issn.2097-1974.20250613
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Aiming at the deformation matching damage problem of the arrayed bonded thermal insulation tile assembly, this study extracts four typical aircraft skin deformation conditions, combines with Digital Image Correlation (DIC) technology and force-displacement synchronous measurement methods, conducts experiments and obtains quantitative results.​The results show that when the skin is depressed in a large area, the 80% compression of the gap between tiles is the compaction threshold of the filler strip, exceeding this threshold will cause local extrusion damage at the edge of the thermal insulation tile, and this threshold can be used as the safety upper limit for the gap design of thermal insulation tiles. When the discontinuous skin undergoes relative deformation, the thermal insulation tile will flip and become unstable after 60% compression of the gap between tiles, and debonding failure occurs in the bonding layer; the corresponding deformation can guide the skin deformation control of the docking areas such as the cabin door and the airframe. When the skin is locally depressed, debonding failure occurs in the bonding layer and spreads rapidly from the middle of the thermal insulation tile to the edge within 2 seconds. When the skin is locally bulged, debonding damage occurs in the bonding layer and spreads rapidly from the edge of the thermal insulation tile to the center after approximately 10 seconds; the corresponding deformation thresholds can guide the stiffness design of the skin in local areas such as access panels. The results of this study can guide the deformation matching design of thermal insulation tile assemblies, and the experimental scheme can provide references for similar designs and verifications.

array of bonded thermal insulation tile  /  deformation matching  /  damage modes  /  damage mechanisms  /  experimental study
Jiuzhou LIU, Lei SHI, Yongjun WU, Yongpeng DONG, Tengfei XU. Experimental Study on Deformation Matching Damage Modes of the Array of Bonded Thermal Insulation Tile[J]. Missiles and Space Vehicles, 2025 , 48 (6) : 86 -93 . DOI: 10.7654/j.issn.2097-1974.20250613
Year 2025 volume 48 Issue 6
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doi: 10.7654/j.issn.2097-1974.20250613
  • Receive Date:2025-07-07
  • Online Date:2026-01-20
  • Published:2025-12-25
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  • Received:2025-07-07
  • Revised:2025-11-09
Affiliations
    Beijing Institute of Aerospace Systems Engineering, Beijing, 100076
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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