This study systematically investigates the non-isothermal curing kinetics of bismaleimide resin EC230R using non-isothermal differential scanning calorimetry （DSC） in conjunction with the Flynn-Wall-Ozawa （FWO） model and the Málek method. The FWO analysis reveals that the apparent activation energy of the resin system exhibits a rapid nonlinear rise when the conversion rate exceeds 0.8. This transition indicates a dynamic shift from a chemically controlled reaction phase to a diffusion-controlled phase. Based on Málek kinetic modeling， the global reaction rate equation is derived to construct the rate equation for the isothermal curing process. This model enables the prediction of curing behavior and conversion rate of bismaleimide resin EC230R at different temperatures. Furthermore， the curing process is optimized using the curing kinetics model of bismaleimide resin， and the thermal and mechanical properties of the cured bismaleimide resin EC230R are characterized and verified via non-isothermal scanning， tensile， and flexural testing. The results show that after curing at 250 ℃， the conversion rate increases by 14%， and the glass transition temperature （T_g） of the resin increases by 30%， while the tensile modulus and flexural modulus decrease slightly by 9.8% and 7.2%， respectively. A strong positive correlation is observed among T_g， curing temperature， and conversion rate， suggesting that high-temperature curing enhances thermal resistance by increasing crosslink density. However， excessive crosslinking restricts segmental mobility and reduces packing density， leading to modulus reduction. This study provides critical guidelines and experimental validation for optimizing curing processes and developing high-temperature-resistant structural materials based on bismaleimide resins.