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Microstructure of DD15/SC-4 dual-alloy hot isostatic pressure diffusion bonding joint
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Haoming LIU1, fangzheng DING2, Kanghe JIANG3, Jian LIU1, Shizhong LIU1, Zichao PENG1, Xuqing WANG1
Journal of Materials Engineering | 2026, 54(2) : 222 - 233
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Journal of Materials Engineering | 2026, 54(2): 222-233
• RESEARCH ARTICLE •
Microstructure of DD15/SC-4 dual-alloy hot isostatic pressure diffusion bonding joint
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Haoming LIU1, fangzheng DING2, Kanghe JIANG3, Jian LIU1, Shizhong LIU1, Zichao PENG1, Xuqing WANG1
Affiliations
  • 1.Key Laboratory of Advanced High Temperature Structural Materials,AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China
  • 2.Army Unit 93160,Beijing 101300,China
  • 3.AECC Hunan Aviation Powerplant Research Institute,Zhuzhou 412002,Hunan,China
Published: 2026-02-20 doi: 10.11868/j.issn.1001-4381.2024.000755
Outline
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The hot isostatic pressing (HIP) technique is employed to create a diffusion-bonded joint between DD15 alloy and SC-4 alloy. This study systematically examines the impact of HIP temperature and nickel electrodeposited coating on the microstructure and elemental diffusion characteristics at the diffusion-bonded joint. The results reveal that HIP diffusion bonding effectively achieves a reliable bond between DD15 and SC-4. Both sides of the bonding interface exhibit distinct element diffusion zones and microstructure affected zones, accompanied by the precipitation of large γ' phases, carbides, and oxides in proximity to the interface. In the DD15 alloy, recrystallization occurs in a region approximately 10-20 μm from the surface. Carbides and large-sized γ' phases are present within this region. In the range of 20-140 μm away from the interface, the γ' phases undergo coarsening. For the SC-4 alloy, carbide redissolution occurs within 30 μm from the interface, and large γ' phases are observed in the vicinity of the interface.As the HIP temperature increases, the microstructure of DD15 within the heat-affected zone remains relatively unchanged, whereas the prominent γ' phase in SC-4 diminishes, and the size of carbides and oxides at the bonding interface augments. The influence of nickel plating is evident, with various shapes of γ' phases (long strip-shaped γ' phase, large γ' phase (>2 μm), fine γ' phase (200-500 nm)) emerging near the connection interface, accompanied by the disappearance of carbides and oxides. Notably, the large γ' phases in SC-4 also vanish under this condition.

DD15  /  SC-4  /  hot isostatic pressure diffusion bonding  /  microstructure  /  dual-alloy diffusion joint
刘浩铭, 丁方政, 蒋康河, 刘健, 刘世忠, 彭子超, 王旭青. DD15/SC-4双合金热等静压扩散连接接头微观组织. 材料工程, 2026 , 54 (2) : 222 -233 . DOI: 10.11868/j.issn.1001-4381.2024.000755
Haoming LIU, fangzheng DING, Kanghe JIANG, Jian LIU, Shizhong LIU, Zichao PENG, Xuqing WANG. Microstructure of DD15/SC-4 dual-alloy hot isostatic pressure diffusion bonding joint[J]. Journal of Materials Engineering, 2026 , 54 (2) : 222 -233 . DOI: 10.11868/j.issn.1001-4381.2024.000755
Year 2026 volume 54 Issue 2
70
32
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Article Info
doi: 10.11868/j.issn.1001-4381.2024.000755
  • Receive Date:2024-11-06
  • Online Date:2026-10-27
  • Published:2026-02-20
Article Data
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History
  • Received:2024-11-06
  • Accepted:2025-02-22
Funding
Affiliations
    1.Key Laboratory of Advanced High Temperature Structural Materials,AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China
    2.Army Unit 93160,Beijing 101300,China
    3.AECC Hunan Aviation Powerplant Research Institute,Zhuzhou 412002,Hunan,China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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