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Preparation of monodisperse micron-sized spherical copper particles based on pulsated orifice ejection method
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Wei DONG1, Cen JIANG1, Fumin XU1, Yang ZHAO2
Journal of Materials Engineering | 2026, 54(3) : 252 - 260
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Journal of Materials Engineering | 2026, 54(3): 252-260
• RESEARCH ARTICLE •
Preparation of monodisperse micron-sized spherical copper particles based on pulsated orifice ejection method
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Wei DONG1, Cen JIANG1, Fumin XU1, Yang ZHAO2
Affiliations
  • 1.School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,Liaoning,China
  • 2.National Key Laboratory for Remanufacturing,Army Academy of Armored Forces,Beijing 100072,China
Published: 2026-03-20 doi: 10.11868/j.issn.1001-4381.2024.000241
Outline
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3D microelectronic packaging imposes extremely stringent requirements on the size and precision of Cu core balls. To obtain Cu core balls that meet these requirements, it is essential to ensure the stability during the droplet jetting process and to precisely control the droplet size as needed. This study employs the pulsated orifice ejection method to prepare monodisperse Cu particles. The key parameters affecting particle size are determined based on the Hagen-Poiseuille law, and the relationship between these key parameters and the stability and size of Cu droplet jetting is investigated in detail. The influence of temperature and differential pressure determines whether droplets can be jetted, while the pulse waveform and the rod distance primarily control the particle size. Orthogonal experiments reveal that the particle size is co-influenced by multiple parameters, among which the voltage of the pulse waveform has the most significant impact, and the the particle size increases with the increase of the voltage. Adjusting the rod distance can regulate the stability of the jetting process. Through the analysis of the jetting window and orthogonal experiments, appropriate key parameters are selected to prepare Cu particles with target sizes of 100 μm and 200 μm. The actual obtained particle sizes are 96.27 μm and 200.69 μm, with standard deviations of approximately 2.67 μm and 2.64 μm, respectively, and sphericity values both exceeding 0.95. The prepared Cu particles exhibit uniform size and high sphericity, meeting the requirements for Cu core balls.

pulsated orifice ejection  /  spherical metallic Cu particle  /  particle size control  /  orthogonal experiment  /  jetting stability
董伟, 江岑, 许富民, 赵阳. 基于脉冲微孔喷射法制备单分散微米级球形铜粒子. 材料工程, 2026 , 54 (3) : 252 -260 . DOI: 10.11868/j.issn.1001-4381.2024.000241
Wei DONG, Cen JIANG, Fumin XU, Yang ZHAO. Preparation of monodisperse micron-sized spherical copper particles based on pulsated orifice ejection method[J]. Journal of Materials Engineering, 2026 , 54 (3) : 252 -260 . DOI: 10.11868/j.issn.1001-4381.2024.000241
Year 2026 volume 54 Issue 3
52
25
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Article Info
doi: 10.11868/j.issn.1001-4381.2024.000241
  • Receive Date:2024-04-02
  • Online Date:2026-10-27
  • Published:2026-03-20
Article Data
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History
  • Received:2024-04-02
  • Accepted:2024-05-16
Funding
Affiliations
    1.School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,Liaoning,China
    2.National Key Laboratory for Remanufacturing,Army Academy of Armored Forces,Beijing 100072,China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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