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Research status and prospects of immiscible nano-multilayer films in Cu/refractory metal systems: from microscopic interface design to macroscopic joining manufacturing
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Hong LI1, Tian JIN1, Rui PAN1, Huaping XIONG2, Yipeng WANG1, Erika HODÚLOVÁ3
Journal of Materials Engineering | 2026, 54(8) : 53 - 68
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Journal of Materials Engineering | 2026, 54(8): 53-68
Research status and prospects of immiscible nano-multilayer films in Cu/refractory metal systems: from microscopic interface design to macroscopic joining manufacturing
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Hong LI1, Tian JIN1, Rui PAN1, Huaping XIONG2, Yipeng WANG1, Erika HODÚLOVÁ3
Affiliations
  • 1.College of Materials Science and Technology,Beijing University of Technology,Beijing 100124,China
  • 2.AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China
  • 3.Institute of Materials and Machine Mechanics,Slovak Academy of Sciences,Bratislava 84513,Slovakia
Published: 2026-08-20 doi: 10.11868/j.issn.1001-4381.2026.000268
Outline
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As modern high-end manufacturing increasingly trends towards miniaturization and multifunctionality, achieving high-quality joining of dissimilar materials has encountered severe technical bottlenecks. Addressing this challenge, nano-multilayer films have emerged as a highly promising technological pathway for realizing low-temperature, highly reliable bonding, owing to their pronounced size effects and high-density interfacial structures. This review focuses on immiscible nano-multilayer films of the Cu/X (X=W, V, Mo, Ta, Nb) refractory metal systems, systematically elucidating the thermal stability evolution mechanisms governed by interfacial microstructures, as well as the intrinsic mechanisms that modulate mechanical properties and irradiation responses. Furthermore, it summarizes the recent research progress on their applications as high-performance brazing fillers or interlayers in brazing and diffusion bonding, highlighting their critical roles in mitigating residual stress in joints and suppressing the formation of brittle intermetallic compounds. Finally, it points out that future research should focus on the multi-scale computational modeling of spatial interfacial transport mechanisms and interfacial evolution mechanisms under multi-field coupling. Overcoming the high-temperature thermal stability bottleneck of this system is also identified as a key direction to advance its engineering applications.

refractory metal  /  nano-multilayer film  /  elemental diffusion  /  interfacial structure  /  residual stress  /  thermal stability
李红, 金天, 潘瑞, 熊华平, 王义朋, HODÚLOVÁ Erika. Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望:从微观界面设计到宏观连接制造. 材料工程, 2026 , 54 (8) : 53 -68 . DOI: 10.11868/j.issn.1001-4381.2026.000268
Hong LI, Tian JIN, Rui PAN, Huaping XIONG, Yipeng WANG, Erika HODÚLOVÁ. Research status and prospects of immiscible nano-multilayer films in Cu/refractory metal systems: from microscopic interface design to macroscopic joining manufacturing[J]. Journal of Materials Engineering, 2026 , 54 (8) : 53 -68 . DOI: 10.11868/j.issn.1001-4381.2026.000268
Year 2026 volume 54 Issue 8
65
28
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Article Info
doi: 10.11868/j.issn.1001-4381.2026.000268
  • Receive Date:2026-05-06
  • Online Date:2026-10-28
  • Published:2026-08-20
Article Data
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  • Received:2026-05-06
  • Accepted:2026-06-08
Funding
Affiliations
    1.College of Materials Science and Technology,Beijing University of Technology,Beijing 100124,China
    2.AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China
    3.Institute of Materials and Machine Mechanics,Slovak Academy of Sciences,Bratislava 84513,Slovakia
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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