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Slurry preparation and forming process optimization of silicon nitride ceramic with digital light processing technology
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Zhicong LUO1, 2, Xiating ZHANG1, 2, Jiamin WU1, 2, 3, Lin GUO1, 2, Yusheng SHI1, 2
Journal of Materials Engineering | 2026, 54(2) : 91 - 100
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Journal of Materials Engineering | 2026, 54(2): 91-100
• CERAMIC ADDITIVE MANUFACTURING AND ITS APPLICATIONS •
Slurry preparation and forming process optimization of silicon nitride ceramic with digital light processing technology
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Zhicong LUO1, 2, Xiating ZHANG1, 2, Jiamin WU1, 2, 3, Lin GUO1, 2, Yusheng SHI1, 2
Affiliations
  • 1.State Key Laboratory of Materials Processing and Die & Mould Technology,School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China
  • 2.Engineering Research Center of Ceramic Materials for Additive Manufacturing,Ministry of Education,Wuhan 430074,China
  • 3.Wenzhou Key Laboratory of Microwave Communication Materials and Devices,Wenzhou Advanced Manufacturing Institute of HUST,Wenzhou 325035,Zhejiang,China
Published: 2026-02-20 doi: 10.11868/j.issn.1001-4381.2025.000545
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Digital light processing (DLP) technology has attracted significant attention for its ability to quickly form complex structure porous silicon nitride (Si3N4) ceramics without the need for molds. However, challenges still exist regarding the rheological properties, stability, and curing performance of the Si3N4 ceramic slurry. This paper successfully enhances the rheology and curing performance of Si3N4 slurries by optimizing the multi-component photosensitive resin, dispersant system, and photocuring forming parameters. The results show that the multi-component resin system consisting of HDDA, TMP3EOTA, and ACMO at 3∶1∶2 mass ratio achieves optimal performance. Compared to the system containing IBOA, ACMO has no strong conjugated groups, and its morpholine ring can stabilize the free radicals of photoinitiators, achieving 95% increase in curing depth of the Si3N4 slurry. After the introduction of the dispersant Solsperse 41000, the stability and rheological properties of the slurry are further improved. As the content of Solsperse 41000 increases, the viscosity of the Si3N4 slurry first decreases and then increases; when the dispersant content reaches 3% of the powder mass, the slurry viscosity drops to its minimum value (0.16 Pa·s). However, the addition of an excessive amount of dispersant will lead to multi-layer adsorption on the powder surface and self-entanglement of the dispersant itself, which impairs the rheological properties of the slurry. Based on the above optimizations, adjusting the laser power and exposure time to 15 mW/cm2 and 7 s, respectively, can simultaneously meet the requirements for both curing depth and forming precision. Finally, Si3N4 ceramic green bodies with complex structures are successfully printed, and a porous Si3N4 ceramic with porosity of 18.76% and flexural strength of 240.28 MPa is ultimately produced. This study provides an experimental basis for the preparation of high-performance porous Si3N4 ceramics.

Si3N4 ceramics  /  DLP technology  /  rheological property  /  curing depth
罗智聪, 张夏婷, 吴甲民, 郭琳, 史玉升. 氮化硅陶瓷浆料的制备及其数字光处理成形工艺优化. 材料工程, 2026 , 54 (2) : 91 -100 . DOI: 10.11868/j.issn.1001-4381.2025.000545
Zhicong LUO, Xiating ZHANG, Jiamin WU, Lin GUO, Yusheng SHI. Slurry preparation and forming process optimization of silicon nitride ceramic with digital light processing technology[J]. Journal of Materials Engineering, 2026 , 54 (2) : 91 -100 . DOI: 10.11868/j.issn.1001-4381.2025.000545
Year 2026 volume 54 Issue 2
72
31
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Article Info
doi: 10.11868/j.issn.1001-4381.2025.000545
  • Receive Date:2025-09-28
  • Online Date:2026-10-27
  • Published:2026-02-20
Article Data
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History
  • Received:2025-09-28
  • Accepted:2025-10-23
Affiliations
    1.State Key Laboratory of Materials Processing and Die & Mould Technology,School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China
    2.Engineering Research Center of Ceramic Materials for Additive Manufacturing,Ministry of Education,Wuhan 430074,China
    3.Wenzhou Key Laboratory of Microwave Communication Materials and Devices,Wenzhou Advanced Manufacturing Institute of HUST,Wenzhou 325035,Zhejiang,China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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