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Outline
Aiming at the contradiction between the high heat flux density heat dissipation requirement and the confined space of chips in the thin electronic devices， this work proposes a solid-state phase transformation thermal control technology based on the structure transformation of the alloys to meet the efficient heat dissipation requirement of chips in confined space. By comparing the thermal response characteristics of sensible thermal energy storage materials and solid-state phase transformation alloys， the effects of the type， the thickness of thermal energy storage materials and the heating power on the temperature rise behavior of the chip are systematically studied. The experiment results show that the Ti-Ni-based solid-state phase transformation alloys with martensite ↔ austenite structure transformation exhibit significant thermal energy storage advantages benefiting from the synergistic effect of structural sensible heat consumption and latent heat absorption of phase transformation. The thermal energy storage capacity per unit volume of the investigative Ti-Ni-based solid-state phase transformation alloys is 285.4 J·cm-3， which is 3.9 times and 2.8 times that of the 6061 aluminum alloys and H62 copper alloys， respectively. The test results of the chip in the working conditions show that the application of Ti-Ni-based solid-state phase transformation alloys can reduce the heating rate of the chip by up to 82%， and the time when the temperature of the chip reaches critical temperature is extended by up to 96% and 73% respectively compared with the architectural systems of aluminum-6061 alloys and copper-H62 alloys. The parametric analysis results indicate that the measured time （） when the temperature of the chip reaches critical temperature using the Ti-Ni-based solid-state phase transformation alloys has a quadratic functional relationship （） with the thickness （h） of the thermal energy storage alloy layers， and shows an exponential attenuation law （） with the heating power （）. The solid-state phase transformation alloys are able to absorb sensible heat through intrinsic specific heat capacity and extend the duration of the slowly rising temperature of the chip through latent heat effect. Both of the two abilities form a dual-mode intelligent thermal control response mechanism of “sensible heat absorption-latent heat buffering” during the heating process. This work confirms that solid-state phase transformation alloys can achieve effective thermal buffering in millimeter-level narrow space， providing a new solution for compact thermal management of miniaturized electronic devices.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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