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Influence of surface treatment on microstructure of 2024 aluminum alloy hot compression bonding interface
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Xiaopeng ZHANG1, 2, Xuewen CHEN1, Jianqiang WANG2, Zheng ZHOU1, Shengqing WU2, Mingyue SUN2
Journal of Materials Engineering | 2026, 54(3) : 161 - 169
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Journal of Materials Engineering | 2026, 54(3): 161-169
• RESEARCH ARTICLE •
Influence of surface treatment on microstructure of 2024 aluminum alloy hot compression bonding interface
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Xiaopeng ZHANG1, 2, Xuewen CHEN1, Jianqiang WANG2, Zheng ZHOU1, Shengqing WU2, Mingyue SUN2
Affiliations
  • 1.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,Henan,China
  • 2.Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China
Published: 2026-03-20 doi: 10.11868/j.issn.1001-4381.2023.000819
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Three different surface treatments—sandpaper polishing, chemical cleaning, and electrolytic polishing combined with chemical cleaning are employed to conduct hot compression bonding tests on 2024 aluminum alloy. The interface microstructure and the interface healing effect under different surface treatment conditions are investigated using characterization techniques such as OM,SEM, and EBSD. The results reveal that under the three surface treatment conditions, the types of interfacial oxide elements are identical, while variations exist in the quantity and size of the oxides. After holding for 4 h, second-phase particles within the matrix precipitate extensively along grain boundaries and at the bonding interface. For the sandpaper-polished specimen, oxides and second-phase particles at the interface account for approximately 32% of the interface area; this proportion is about 42% for the chemically cleaned specimen, and roughly 28% for the specimen subjected to electrolytic polishing combined with chemical cleaning. Interface healing is achieved through the synergistic action of discontinuous dynamic recrystallization and continuous dynamic recrystallization. Based on the microstructural characteristics of the bonding interface, the interface healing rate is utilized to evaluate the degree of interface healing. After statistical calculations, the order of the interface healing rate is as follows: electrolytic polishing combined with chemical cleaning>sandpaper polishing>chemical cleaning.

2024 aluminum alloy  /  hot compression bonding  /  surface treatment  /  oxides  /  interface bonding ratio
张晓鹏, 陈学文, 汪建强, 周正, 吴升清, 孙明月. 表面处理对2024铝合金热变形连接界面微观组织的影响. 材料工程, 2026 , 54 (3) : 161 -169 . DOI: 10.11868/j.issn.1001-4381.2023.000819
Xiaopeng ZHANG, Xuewen CHEN, Jianqiang WANG, Zheng ZHOU, Shengqing WU, Mingyue SUN. Influence of surface treatment on microstructure of 2024 aluminum alloy hot compression bonding interface[J]. Journal of Materials Engineering, 2026 , 54 (3) : 161 -169 . DOI: 10.11868/j.issn.1001-4381.2023.000819
Year 2026 volume 54 Issue 3
43
20
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Article Info
doi: 10.11868/j.issn.1001-4381.2023.000819
  • Receive Date:2023-12-05
  • Online Date:2026-10-27
  • Published:2026-03-20
Article Data
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History
  • Received:2023-12-05
  • Accepted:2024-01-08
Funding
Affiliations
    1.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,Henan,China
    2.Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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