Recently published in
NPG Asia Materials, Yan
et al. observed the experimental evidence of significantly slowed hot carrier cooling in a two-dimensional (2D) silicon PnC by using ultrafast transient absorption measurements [
6]. They firstly designed and fabricated 2D silicon structures on the silicon-on-sapphire wafer, where the silicon is an intrinsic monocrystalline thin film with the thickness of 550 nm, epitaxially grown on a thick Sapphire substrate. For comparison, they prepared three samples: (1) the reference, (2)
t = 550 nm,
P = 1160 nm, and
d = 1000 nm, and (3)
t = 550 nm,
P = 1160 nm, and
d = 1060 nm. A titled-view scanning electron microscope (SEM) image and a top-view SEM image of the fabricated 2D structured crystalline silicon sample are shown in
Figs. 1a and
b. The transient absorption (TA) spectra of the three samples as a function wavelength were measured and extracted at different probe wavelengths. As an example, the TA kinetics of the three samples at the same single probe wavelength of 1080 nm are shown in
Fig. 1c, where the dots are for measurements. To do data analysis, commercial Surface Xplorer analysis software is employed to fit the experimental data to assess the hot carrier lifetimes. The fitting results of the three samples are shown in
Fig. 1c using lines. The obtained hot carrier cooling times are 0.45, 0.95 and 15.9 ps for the three samples of (1) the reference, (2)
t = 550 nm,
P = 1160 nm, and
d = 1000 nm, and (3)
t = 550 nm,
P = 1160 nm, and
d = 1030 nm. By comparison, they show that the 2D silicon structure with
d = 1060 nm demonstrates the largest lifetime improvements with tens of times than the other two cases. In order to find the possible reasons, the frequency band structures of the three samples were calculated by using
Comsol Multiphysics software. The results show that a phononic bandgap exists in the sample with
d = 1060 nm (
Fig. 1d) while there are no phononic bandgaps in the other two samples.