Figs. 1a and
b show the voltage distribution of Li||Li cells in the electrolytes with or without 1 mmol/L CuPc additive under a current density of 1 mA/cm
2 and a capacity of 1 mAh/cm
2. The voltage profile of the cell without CuPc additive shows obvious fluctuation and high overpotentials, which may be attributed to the exposure of Li metal caused by SEI fragmentation, and rapid uneven growth of Li dendrites. On the contrary, the cell with CuPc additive is able to achieve an excellent stability over 500 h with a low overpotential of ~20 mV. The impact of the concentrations of CuPc additive on the Li depostion behavior has also investigated. As displayed in Fig. S1 (Supporting information), at a low concentration of 0.5 mmol/L CuPc, the cell shows a steady voltage profile over 240 h, while the cell with 2 mmol/L CuPc shows obvious voltage fluctuations after about 150 h, as like the control cell withou CuPc. These results suggest that a reasonable concentration of CuPc additive is needed for better performance of Li||Li cells. In addition, Pc molecule without a metal center is also investigated as the additive for Li||Li cells. As shown in Fig. S2 (Supporting information), Pc additive can also induce steady voltage of Li||Li cell during cycling, indicating the positive role of Pc molecule in regulating Li deposition behavior. On the other hand, the overpotential value (~25 mV) of the cell with 1 mmol/L Pc is a little higher than that of the cell with 1 mmol/L CuPc, suggesting the exsitence of Cu center further contribute to the regulation of Li deposition bahavior. When tested under a higher capacity of 3 mAh/cm
2 (Fig. S3 in Supporting information), or a higher current density of 4 mA/cm
2 (Fig. S4 in Supporting information), the cells with CuPc additive deliver excellent stability with low overpotentials. The plating/stripping tests are further investigated at different current densities ranging from 1 mA/cm
2 to 4 mA/cm
2 with the capacity of 1 mAh/cm
2 (
Fig. 1c). As seen, the much lower overpotentials indicate the better rate capability of the cell with CuPc additive.
Fig. 1d shows electrochemical impedance spectroscopy (EIS) profiles of Li||Li cells before and after 25 cycles at 1 mA/cm
2 (1 mAh/cm
2). The impedances of the cell containing CuPc additive are much lower than that of the control cell, which proves the improved Li/electrolyte interfacial affinity and faster kinetic bahavior of Li
+ ions. In addition, the exchange current density (
I0) in Li||Li cells with CuPc additive were calculated as 1.06 mA/cm
2 from Tafel plots (Fig. S5 in Supporting information), higher than that of the cell without CuPc (0.812 mA/cm
2). This implies the better charge transfer capability across a smooth and flat surface of Li anode at the presence of CuPc. Moreover, the transfer number of Li
+ ions is assessed by using the potentiostatic polarization (Fig. S6 in Supporting information) and EIS measurements (Fig. S7 in Supporting information). The value in the cell with CuPc additive is calculated as 0.78, which is higher than that for the cell without CuPc additive (0.72). It is probably because of the complexation between Li
+ ions and the lithiophilic N elements in CuPc. As a result, CuPc molecules are likely adsorbed on Li anode surface as a coating layer, which can not only promote the Li
+ ion transfer, but also reduce the direct contact between Li anode and the solvents and inhibit the growth of dendrites. Therefore, a stable SEI film can be produced to enable excellent cycle stability of Li||Li cells.