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Article(id=1236276111940833500, tenantId=1146029695717560320, journalId=1235980550691926019, issueId=1236276104999268557, articleNumber=null, orderNo=null, doi=10.3969/j.issn.0253-6099.2025.04.031, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1738425600000, receivedDateStr=2025-02-02, revisedDate=null, revisedDateStr=null, acceptedDate=null, acceptedDateStr=null, onlineDate=1772680793985, onlineDateStr=2026-03-05, pubDate=1753977600000, pubDateStr=2025-08-01, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1772680793985, onlineIssueDateStr=2026-03-05, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1772680793985, creator=13701087609, updateTime=1772680793985, updator=13701087609, issue=Issue{id=1236276104999268557, tenantId=1146029695717560320, journalId=1235980550691926019, year='2025', volume='45', issue='4', pageStart='1', pageEnd='200', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=1, specialIssue=null, createTime=1772680792331, creator=13701087609, updateTime=1772681498687, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1236279067746562719, tenantId=1146029695717560320, journalId=1235980550691926019, issueId=1236276104999268557, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1236279067746562720, tenantId=1146029695717560320, journalId=1235980550691926019, issueId=1236276104999268557, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=168, endPage=174, ext={EN=ArticleExt(id=1236276112360263923, articleId=1236276111940833500, tenantId=1146029695717560320, journalId=1235980550691926019, language=EN, title=Additive Manufacturing of Complex Shaped SiCp/Al Composite by Photocuring Process, columnId=1236276108207902848, journalTitle=Mining and Metallurgical Engineering, columnName=MATERIALS, runingTitle=null, highlight=null, articleAbstract=

The additive manufacturing of SiCp/Al606 by photocuring process was studied, and the effects of resin monomer and solid volume fraction on the stability, rheological properties and photocuring performance of SiCp/Al6061 slurry, as well as the compactness and microstructure of sintered product were explored. The results show that as photosensitive resins of PEG200DA and PEG400DA mixed at an appropriate ratio of 1∶1, the prepared slurry with content of 52.5%, viscosity of 5.05 Pa·s (shear rate of 10 s－1) and single-layer curing thickness of 100.3 μm can meet the requirements for photocuring in additive manufacturing. The SiCp/Al component manufactured by photocuring process can have a complete structure and good interlayer bonding, and the sintered product with no cracks and obvious necking presents relatively high compactness (94.07%).

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采用光固化技术增材制造SiCp/Al6061，研究了树脂单体和固相体积分数对SiCp/Al6061浆料稳定性、流变性能、光固化性能以及烧结体致密度与微观组织的影响。结果表明，适宜的浆料体系为混合光敏树脂体系PEG200DA/PEG400DA（1∶1）；采用该光敏树脂体系制备固含量为52.5%的浆料，黏度为5.05 Pa·s（剪切速率10 s－1）、单层固化厚度为100.3 μm，满足光固化增材制造的要求。光固化增材制造的SiCp/Al零件坯体形状完整、层间结合好，烧结体无开裂现象，烧结颈明显，致密度较高（94.07%）。

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王小锋（1980—），男，湖北天门人，博士，教授，主要从事增材制造和金属基复合材料等方面的研究。E-mail：
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乔聪卓（1999—），男，河北邢台人，硕士研究生，主要研究方向为铝基复合材料增材制造。E-mail：

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乔聪卓（1999—），男，河北邢台人，硕士研究生，主要研究方向为铝基复合材料增材制造。E-mail：

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乔聪卓（1999—），男，河北邢台人，硕士研究生，主要研究方向为铝基复合材料增材制造。E-mail：

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（a）沉降实验结果（固相体积分数20%）；（b）黏度曲线（固相体积分数50%）

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（a）PEG400DA；（b）PEG200DA/PEG400DA（1∶1）；（c）PEG200DA；（d）PS-PCL

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（a）复杂蜂窝方块坯体；（b）复杂形状SiCp/Al零件；（c）SiCp/Al零件表面形貌；（d）坯体，PEG200DA/PEG400DA（1∶1）-52.5%层间距；（e）PEG200DA/PEG400DA（1∶1）-52.5%体系零件金相组织；（f）PEG200DA/PEG400DA（1∶1）-52.5%体系零件断口形貌；（g）坯体，PEG400DA-52.5%层间距；（h）PEG400DA-52.5%体系零件金相组织；（i）PEG400DA-52.5%体系零件断口形貌

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Chemical composition of Al 6061 alloy powder

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MgSiCuZnMnTiFeCrAl
1.00.60.20.250.150.150.70.1余量
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6061铝合金粉末化学组成（质量分数）

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MgSiCuZnMnTiFeCrAl
1.00.60.20.250.150.150.70.1余量
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复杂形状SiCp/Al复合材料的光固化增材制造
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乔聪卓 , 刘子瑞 , 徐麒凯 , 王日初 , 彭超群 , 王小锋
矿冶工程杂志 | 材料 2025,45(4): 168-174
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矿冶工程杂志 | 材料 2025, 45(4): 168-174
复杂形状SiCp/Al复合材料的光固化增材制造
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乔聪卓 , 刘子瑞, 徐麒凯, 王日初, 彭超群, 王小锋
作者信息
  • 中南大学　材料科学与工程学院，湖南　长沙　410083

    • 乔聪卓（1999—），男，河北邢台人，硕士研究生，主要研究方向为铝基复合材料增材制造。E-mail：

通讯作者:

王小锋（1980—），男，湖北天门人，博士，教授，主要从事增材制造和金属基复合材料等方面的研究。E-mail：
Additive Manufacturing of Complex Shaped SiCp/Al Composite by Photocuring Process
Congzhuo QIAO , Zirui LIU, Qikai XU, Richu WANG, Chaoqun PENG, Xiaofeng WANG
Affiliations
  • School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
出版时间: 2025-08-01 doi: 10.3969/j.issn.0253-6099.2025.04.031
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摘要
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采用光固化技术增材制造SiCp/Al6061，研究了树脂单体和固相体积分数对SiCp/Al6061浆料稳定性、流变性能、光固化性能以及烧结体致密度与微观组织的影响。结果表明，适宜的浆料体系为混合光敏树脂体系PEG200DA/PEG400DA（1∶1）；采用该光敏树脂体系制备固含量为52.5%的浆料，黏度为5.05 Pa·s（剪切速率10 s－1）、单层固化厚度为100.3 μm，满足光固化增材制造的要求。光固化增材制造的SiCp/Al零件坯体形状完整、层间结合好，烧结体无开裂现象，烧结颈明显，致密度较高（94.07%）。

浆料  /  6061铝合金  /  碳化硅颗粒  /  增材制造  /  光固化  /  立体光刻

The additive manufacturing of SiCp/Al606 by photocuring process was studied, and the effects of resin monomer and solid volume fraction on the stability, rheological properties and photocuring performance of SiCp/Al6061 slurry, as well as the compactness and microstructure of sintered product were explored. The results show that as photosensitive resins of PEG200DA and PEG400DA mixed at an appropriate ratio of 1∶1, the prepared slurry with content of 52.5%, viscosity of 5.05 Pa·s (shear rate of 10 s－1) and single-layer curing thickness of 100.3 μm can meet the requirements for photocuring in additive manufacturing. The SiCp/Al component manufactured by photocuring process can have a complete structure and good interlayer bonding, and the sintered product with no cracks and obvious necking presents relatively high compactness (94.07%).

slurry  /  6061 aluminum alloy  /  silicon carbide particle  /  additive manufacturing  /  photocuring  /  stereolithograpy
乔聪卓, 刘子瑞, 徐麒凯, 王日初, 彭超群, 王小锋. 复杂形状SiCp/Al复合材料的光固化增材制造. 矿冶工程杂志, 2025 , 45 (4) : 168 -174 . DOI: 10.3969/j.issn.0253-6099.2025.04.031
Congzhuo QIAO, Zirui LIU, Qikai XU, Richu WANG, Chaoqun PENG, Xiaofeng WANG. Additive Manufacturing of Complex Shaped SiCp/Al Composite by Photocuring Process[J]. Mining and Metallurgical Engineering, 2025 , 45 (4) : 168 -174 . DOI: 10.3969/j.issn.0253-6099.2025.04.031
正文
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碳化硅颗粒增强铝基复合材料（SiCp/Al）因其高比强度、高比刚度、优异的热物理性能、良好的尺寸稳定性和气密性、耐摩擦磨损性能[1]，广泛应用于航空航天、电子封装、汽车、医疗、核电等领域[2-3]。然而，传统制备方法如搅拌铸造法、挤压铸造法和粉末冶金法等均难以实现复杂形状SiCp/Al零件的近净成形[4]。
增材制造技术因其独特的逐层叠加制造原理，具有制备复杂形状零部件的优势。目前，用于SiCp/Al的增材制造成形技术主要为粉末床熔融（powder based fusion，PBF）和直接能量沉积（direct energy deposition，DED）。文献[5]采用选择性激光熔化技术成功制备了质量分数15%的SiCp/AlSi10Mg零件。文献[6]采用激光熔覆技术成功制备了SiCp/Al-12Si零件。文献[7]采用激光沉积技术成功制备了SiCp/Al（6061）零件。上述粉末床熔融和直接能量沉积技术制备SiCp/Al零件的方法具有制备零件致密度高、可制备复杂形状零件、制备零件性能优异的优点，但是仍存在局限，例如设备成本高[5]、碳化硅颗粒与Al基体反应剧烈[6]、SiCp/Al零件表面粗糙[7]。相较于上述增材制造技术，光固化增材制造技术具有能耗低、设备成本低的优点，可制造尺寸精度高、表面质量好的零部件[8]。然而，采用光固化增材制造技术制备SiCp/Al复合材料的研究鲜见报道。本文采用光固化增材制造技术制备复杂形状SiCp/Al复合材料，研究了光敏树脂单体对浆料稳定性、黏度、光固化性能的影响，制备了SiCp/Al浆料，探讨了光敏树脂种类和固相体积分数对浆料黏度、光固化性能以及烧结体微观组织结构和致密度的影响规律。
1　实验
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1.1　实验材料与试剂
实验原料6061铝合金粉末D50=1.78 μm，化学组成如表1所示；SiC粉末D50=17.17 μm，纯度大于99.5%。
光敏树脂单体HDDA（1，6-己二醇二丙烯酸酯）、TMPTA（三羟甲基丙烷三丙烯酸酯）均购自上海佑季化学材料有限公司。光敏树脂单体PEG200DA（聚乙二醇200二丙烯酸酯）、PEG400DA（聚乙二醇400二丙烯酸酯）均购自沙多玛（广州）化学有限公司。光敏树脂单体PS-PCL为课题组自制单体。光引发剂TPO（2，4，6-三甲基苯甲酰基二苯基氧化膦）购自阿拉丁试剂（上海）有限公司。上述化学试剂均为分析纯。
1.2　实验方法
将光敏树脂单体、光引发剂和6061铝合金粉末、SiC粉末混合制备浆料，采用立体光刻技术（stereo lithography，SLA）光固化成形SiCp/Al坯体，坯体经过脱脂和烧结后获得SiCp/Al零件。具体操作如下：首先将6061铝合金粉末与SiC粉末以球磨方式均匀混合，球磨时间48 h，球磨速度800 r/min。之后将光敏树脂单体与光引发剂TPO（用量为光敏树脂单体质量的1.5%）加入球磨机中，在真空条件下以800 r/min转速搅拌6 h得到均匀稳定的光敏树脂。之后将光敏树脂与SiCp/Al复合粉末加入球磨机中，在真空条件下以1 200 r/min转速搅拌3 h，获得成分均匀的SiCp/Al浆料。采用自制的SLA设备成形坯体，所用设备配置了波长355 nm、功率3 W的高分辨率紫外光发射器，坯体的单层打印厚度设置为30 μm。
将成形坯体放入高温气氛管式炉中进行脱脂和烧结，具体工艺为：脱脂过程中升温速率为1 ℃/min，分别在180、400、490 ℃下保温2 h进行脱脂。脱脂完成后以1 ℃/min的升温速率从490 ℃升温至630 ℃并保温2 h进行烧结。最后以5 ℃/min的速率冷却至室温。整个烧结过程以500 mL/min的流速向炉内通入高纯氮气作为保护气体。
1.3　性能表征
通过沉降实验对浆料稳定性进行表征[9-10]。采用STA-449C型同步热分析仪分析光敏树脂单体的热分解规律，树脂单体在氮气气氛下进行热分解，升温速率为10 ℃/min，测试温度范围为20～700 ℃。坯体脱脂与烧结在KJ-T1600-L6010LB1高温气氛管式炉中进行。使用安东帕流变仪测量浆料在0.1～1 000 s－1剪切速率下的黏度。根据阿基米德排水法原理测量SiCp/Al烧结完成后零件的密度，并计算零件的致密度。使用DM4M金相显微镜观察烧结样品金相组织。使用Sirion-200场发射扫描电子显微镜观察生坯和烧结试样的微观形貌。
2　结果与讨论
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2.1　光敏树脂优选
SLA技术成形所得SiCp/Al坯体中的有机物难以在脱脂过程中完全去除，其热分解残余物会阻碍零件的烧结致密化，因此应选择热分解后残留物较少的光敏树脂单体制备SiCp/Al浆料。
本文通过TG-DSC实验探究5种光敏树脂单体（TMPTA、HDDA、PEG200DA、PEG400DA、PS-PCL）的热分解规律。图1为5种光敏树脂单体的热分析曲线和纯树脂固化坯体的热分解结果。
由图1（a）～（f）可知，HDDA在氮气气氛下热分解存在2个弱吸热峰，说明HDDA热分解分为2步进行，当升温至热分解温度时，HDDA通过随机链端断裂机制发生分解并生成挥发性降解产物[11]，第1步热分解发生在150～200 ℃，主要为低分子量聚合物的热解；第2步发生在350～480 ℃，对应大分子有机物碳链的热解过程，该过程有机物质量失重比例达到80%～90%[12]。TMPTA的热分析曲线与HDDA的相似，分解过程中有机物的失重主要集中在380～510 ℃，对应交联丙烯酸酯有机部分的热分解[13]。PEG200DA、PEG400DA的DSC曲线峰形相似，有机物的失重主要集中在350～460 ℃，且曲线的峰形较宽，即分解温度跨度大[14]。由于PS-PCL合成成分含PEG200DA，PS-PCL的DSC曲线峰形位置和分解规律与PEG200DA相似[8]。PS-PCL、PEG200DA、PEG400DA、HDDA的TG曲线有机物失重主要阶段基本重合，而TMPTA的失重阶段温度明显高于其他单体。由图1（g）可知，TMPTA有机物残留量明显高于其他光敏树脂单体。由图1（h）可知，TMPTA坯体热分解残留物明显多于其他树脂坯体；PEG200DA、PS-PCL与PEG400DA坯体的热分解残留物较少。在热分解温度为490 ℃时，PEG400DA坯体的热分解残留物最少，约为TMPTA残留物质量的1/3、HDDA残留物质量的1/2。
综上所述，光敏树脂单体PEG400DA、PEG200DA和PS-PCL比TMPTA和HDDA更适合制备SiCp/Al浆料。
根据Stokes公式，不同光敏树脂单体形成的网络结构对粉体颗粒的支撑力不同[15]，导致浆料沉降存在明显差异[16]，且浆料的沉降速率与其黏度成反比[17]。
浆料沉降实验结果及黏度曲线见图2。图2（a）结果显示，光敏树脂单体HDDA配制的浆料以及光敏树脂单体PS-PCL配制的浆料沉降高度基本不变。光敏树脂单体HDDA制备所得SiCp/Al浆料在配制完成后10 min内发生交联聚合反应，因而没有明显的沉降现象，浆料稳定性最差。光敏树脂单体PS-PCL制备所得SiCp/Al浆料呈半固态，使得粉体颗粒不易沉降[8]。两种浆料沉降规律均不符合Stokes公式。其余浆料的沉降规律则符合Stokes公式，其中光敏树脂单体PEG200DA配制的浆料沉降速率最快，PEG400DA配制的浆料沉降速率最慢。
浆料黏度对打印坯体的形状完整性有着重要影响，浆料黏度过高会导致打印坯体形状出现残缺[8]。由图2（b）可知，光敏树脂单体HDDA、PEG200DA、PS-PCL配制的SiCp/Al浆料在剪切速率为10 s－1时黏度小于5 Pa·s；PEG400DA、TMPTA配制的SiCp/Al浆料黏度相对较高，在剪切速率为10 s－1时黏度在10 Pa·s左右。
综上所述，光敏树脂单体TMPTA脱脂完成后残留物较多；光敏树脂HDDA制备的浆料稳定性较差；因此宜选用PEG200DA、PEG400DA以及PS-PCL这3种性能优异的光敏树脂单体制备SiCp/Al浆料。
2.2　固相体积分数对浆料黏度和固化效果的影响
设置浆料固相体积分数分别为50.0%、52.5%、55.0%、57.5%、60.0%，探究SiCp/Al浆料固相体积分数对浆料黏度和固化效果的影响，黏度测试结果如图3所示。PEG400DA体系浆料黏度过高，因此固相体积分数设定值最高为55.0%，并用黏度较低的PEG200DA与其混合得到混合树脂体系PEG200DA/PEG400DA（1∶1）。由图3可知，随着浆料固相体积分数升高，浆料黏度呈现快速上升趋势。这是因为浆料固相体积分数升高，浆料体系中粉体颗粒之间的间隙减小，粉体颗粒移动受到阻碍，导致浆料黏度上升[18]。
PEG200DA、PEG400DA、PEG200DA/PEG400DA（1∶1）体系浆料黏度随着剪切速率升高而降低。初始阶段（剪切速率小于10 s－1），浆料中颗粒由于布朗运动呈现随机分布，且保持热力学平衡状态，颗粒有一定的聚集，使得浆料黏度较高；随着剪切运动的出现，粉体颗粒脱絮凝并形成分层，使得浆料黏度快速降低[19]。剪切速率10～100 s－1时，浆料中流动的粉体颗粒逐渐形成最佳分层排列，浆料黏度趋向稳定。PS-PCL体系浆料黏度随着剪切速率升高整体呈降低趋势，PS-PCL为实验室自制光敏树脂单体，其纯度低于分析纯，初始阶段随着剪切速率升高，不同分子链长的有机物相互交错缠绕使得浆料黏度产生波动。剪切速率10 s－1时，黏度较低的浆料体系分别为：PEG200DA-50.0%（黏度1.34 Pa·s）、PEG200DA-52.5%（黏度2.34 Pa·s）、PEG200DA/PEG400DA（1∶1）-50.0%（黏度1.76 Pa·s）、PEG200DA/PEG400DA（1∶1）-52.5%（黏度5.05 Pa·s）、PS-PCL-50.0%（黏度1.59 Pa·s）、PS-PCL-52.5%（黏度2.72 Pa·s）。
浆料固相体积分数对固化厚度的影响如图4所示。SiCp/Al浆料的固化厚度随着固相体积分数升高而降低。这是由于SiCp/Al浆料中复合粉体颗粒越多，吸收和散射的UV光越强，UV光在浆料中的穿透深度降低[20]，浆料固化厚度随之降低。PEG200DA、PEG200DA/PEG400DA（1∶1）配制的SiCp/Al浆料光固化能力强，在固相体积分数为52.5%时，单层的固化厚度分别为114.3、100.3 μm。光敏树脂PS-PCL配制的浆料光固化能力较差，固相体积分数52.5%时，单层的固化厚度小于80 μm。
2.3　脱脂烧结
图5为4种光敏树脂体系不同固相体积分数的坯体脱脂烧结零件的致密度。PEG400DA体系坯体脱脂烧结后SiCp/Al零件致密度最低，PEG200DA/PEG400DA（1∶1）体系SiCp/Al零件致密度最高，因此，PEG200DA/PEG400DA（1∶1）浆料体系为4种体系中的最优体系。
PEG200DA体系所得零件致密度随着浆料固相体积分数升高呈现先升高再降低的趋势。固相体积分数50.0%～52.5%时，零件致密度随着浆料固相体积分数升高而升高，这是因为此时浆料的黏度小于5 Pa·s（剪切速率为10 s－1），坯体打印过程中浆料可以完全铺平，单层固化没有残缺。随着浆料固相体积分数升高，所得坯体中粉体颗粒间隙减小，有利于烧结阶段零件的致密化[21]。固相体积分数55.0%～60.0%时，随着固相体积分数升高，浆料黏度快速升高导致浆料流动性变差，打印过程中浆料难以铺平，会引入大量孔洞缺陷。同时随着固相体积分数升高，浆料单层固化厚度降低，层与层之间结合变差，坯体在烧结阶段层间难以完全闭合，导致烧结完成后零件致密度降低。PS-PCL体系零件致密度随着浆料固相体积分数升高呈现先升高再降低趋势，固相体积分数50.0%～55.0%时，PS-PCL体系的浆料单层固化厚度大于60 μm，坯体层间结合较好；固相体积分数57.5%～60.0%时，PS-PCL体系的浆料单层固化厚度为40 μm左右，坯体层间结合较差，导致烧结后零件的致密度较低。
混合体系PEG200DA/PEG400DA（1∶1）零件的致密度随着浆料固相体积分数升高呈现先升高再降低的趋势，浆料固相体积分数52.5%时，零件致密度最高，为94.07%。PEG200DA与PEG400DA的分子链长不同，在固化时会交错形成复杂网状结构，从而提高层间结合。PEG400DA体系零件致密度随着浆料固相体积分数升高而降低，因为随着固相体积分数升高，体系浆料黏度增大，浆料在打印过程中的铺平能力变差，光固化成形所得坯体形状容易出现残缺，烧结所得零件致密度较低。
2.4　形貌表征
部分坯体、零件的表面形貌、断口形貌及金相组织见图6。由图6（a）、（b）可知，采用SLA技术可以制备形状复杂且精度较高的SiCp/Al零件。由图6（c）可知，SiC颗粒在铝基体中分布均匀，没有出现团聚现象；SiCp/Al零件表面存在一些细小孔洞。由图6（d）、（g）可知，PEG200DA/PEG400DA（1∶1）-52.5%体系制备的坯体层间结合较好，层间距小于7 μm；PEG400DA-52.5%体系制备的坯体层间结合较差，层间距达到40 μm以上。由图6（e）可知，PEG200DA/PEG400DA（1∶1）-52.5%体系零件孔隙较少。由图6（h）可知，PEG400DA-52.5%体系零件孔隙较多，增强相SiC颗粒周围存在一些细小孔隙，这是由于烧结过程中SiC颗粒与Al基体之间润湿性差以及热膨胀系数差异较大形成的缺陷[21]。零件表面存在的一些连续分布的孔隙是由于打印过程中浆料黏度过高，单层没有铺平形成的缺陷[22]。由图6（f）、（i）可知，PEG200DA/PEG400DA（1∶1）-52.5%体系零件中粉体颗粒之间存在明显烧结颈[23]；而PEG400DA-52.5%体系零件断口处粉体颗粒仍保持球状，粉体颗粒之间没有明显的烧结颈。
综上所述，PEG200DA/PEG400DA（1∶1）-52.5%体系制备的零件烧结致密度高于其他烧结样品，微观形貌分析结果也印证了PEG200DA/PEG400DA（1∶1）混合体系在SiCp/Al光固化成形和脱脂烧结过程中的优势。
3　结论
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1）6种光敏树脂体系中：TMPTA热分解残留量明显高于其他光敏树脂；HDDA配制的SiCp/Al浆料稳定性差，易发生反应；PEG400DA的浆料黏度较高，成形坯体易缺损；PEG200DA的浆料稳定性相对较差，易发生沉降；PS-PCL的浆料光固化性能较差，单层固化厚度低；PEG200DA/PEG400DA（1∶1）为最优树脂体系，采用其制备的SiCp/Al浆料，稳定性好、光固化性能优异且热分解有机物残留量低。
2）采用PEG200DA/PEG400DA（1∶1）体系制备SiCp/Al浆料，适宜的固相体积分数为52.5%。该浆料黏度低，剪切速率10 s－1时黏度为5.05 Pa·s；且其单层固化厚度较高，达到100.3 μm。采用该浆料光固化增材制造的SiCp/Al坯体层间结合良好，层间距宽度小于7 μm；SiCp/Al烧结体组织均匀、孔隙较少，致密度达到94.07%。
基金
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  • 福建省重大科技专项(2023HZ021005)
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参考文献 引证文献
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2025年第45卷第4期
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doi: 10.3969/j.issn.0253-6099.2025.04.031
  • 接收时间：2025-02-02
  • 首发时间：2026-03-05
  • 出版时间：2025-08-01
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  • 收稿日期：2025-02-02
基金
福建省重大科技专项(2023HZ021005)
作者信息
    中南大学　材料科学与工程学院，湖南　长沙　410083

通讯作者:

王小锋（1980—），男，湖北天门人，博士，教授，主要从事增材制造和金属基复合材料等方面的研究。E-mail：
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2种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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