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Article(id=1239217291460669486, tenantId=1146029695717560320, journalId=1238823019242635269, issueId=1239217289715839002, articleNumber=null, orderNo=null, doi=10.12465/j.issn.0253-4339.2025.05.166, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1726848000000, receivedDateStr=2024-09-21, revisedDate=1732636800000, revisedDateStr=2024-11-27, acceptedDate=1733241600000, acceptedDateStr=2024-12-04, onlineDate=1773382025825, onlineDateStr=2026-03-13, pubDate=1760544000000, pubDateStr=2025-10-16, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1773382025825, onlineIssueDateStr=2026-03-13, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1773382025825, creator=13701087609, updateTime=1773382025825, updator=13701087609, issue=Issue{id=1239217289715839002, tenantId=1146029695717560320, journalId=1238823019242635269, year='2025', volume='46', issue='5', pageStart='1', pageEnd='174', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=1, specialIssue=null, createTime=1773382025412, creator=13701087609, updateTime=1773382179485, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1239217936007753991, tenantId=1146029695717560320, journalId=1238823019242635269, issueId=1239217289715839002, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1239217936007753992, tenantId=1146029695717560320, journalId=1238823019242635269, issueId=1239217289715839002, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=166, endPage=174, ext={EN=ArticleExt(id=1239217291645218863, articleId=1239217291460669486, tenantId=1146029695717560320, journalId=1238823019242635269, language=EN, title=Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks, columnId=null, journalTitle=Journal of Refrigeration, columnName=null, runingTitle=null, highlight=null, articleAbstract=

With the development of computer technology and the application of artificial intelligence, electronic chips are becoming increasingly miniaturized and integrated, leading to a rapid increase in their volumetric heating power, thus affecting their normal operation. To address this problem, a heat sink with an array of finned porous microjets was designed, and HFE-7100, which has good thermal stability and electrical insulation, was selected as the cooling medium. Through a combination of numerical simulations and experimental research, the influence of factors such as the longitudinal aspect ratio of the slotted fins, inlet subcooling, inlet volumetric flow rate, and jet Reynolds number on the heat transfer process of microjet boiling was investigated. The results showed that the optimized structure with an aspect ratio of 0.5 met the requirements of chip cooling and had a better cooling effect. In the single-phase convection heat transfer stage, under the same working condition, the inlet subcooling degree had little effect on heat transfer, and increasing the volume flow rate or jet Reynolds number could strengthen the convection heat transfer, and the maximum heat transfer coefficient could reach 15 724.40 W/(m2·K). However, in the jet boiling stage, the heat flux corresponding to the onset of nucleate boiling (ONB), and it decreased with a decrease in the inlet subcooling degree. Increasing the inlet volume flow rate or jet Reynolds number inhibited the occurrence of boiling, thus weakening the heat transfer. However, compared with the single-phase convective heat transfer stage, the heat transfer coefficient increased by 20.6%.

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Sun Jian, male, Ph.D., professor, School of Materials Science and Engineering, Jingdezhen Ceramic University, 86-13507987465, E-mail: . Research fields: micro-scale heat transfer and new energy technology.
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随着计算机技术发展以及人工智能的应用，电子芯片越发趋向微型化、集成化，导致其单位体积发热量快速增加，从而影响正常运行。针对该问题，设计了一种阵列翅片式多孔微射流热沉，选用热稳定性和电绝缘性好的HFE-7100作为冷却工质，通过数值模拟和实验研究相结合的方法，研究槽式翅片纵宽比、入口过冷度、入口体积流量、射流雷诺数等因素对微射流沸腾传热过程影响。结果表明：优化后纵宽比为0.5的结构在满足芯片冷却要求的同时具有更好的冷却效果。单相对流传热阶段，相同工况下，入口过冷度对换热影响较小，增大体积流量或射流雷诺数可强化对流传热，最大传热系数可达15 724.40 W/（m2·K）。但在射流沸腾阶段，沸腾起始点ONB对应的热流密度随入口过冷度的减小而减小，增大入口体积流量或射流雷诺数会抑制沸腾的发生，从而削弱换热，但相对单相对流传热阶段，传热系数仍提高20.6%。

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孙健，男，博士，教授，景德镇陶瓷大学材料与科学学院，13507987465，E-mail：。研究方向：微尺度传热与新能源技术。
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参数不确定度/%
平均换热系数9.1
射流雷诺数Re′5.0
体积流量qv5.6
换热面平均温度8.6
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参数不确定度/%
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射流雷诺数Re′5.0
体积流量qv5.6
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材料种类密度ρ/（kg/m3）导热系数k′/[W/（m·K）]动力黏度μ/[kg/（m·s）]
HFE-7100（液）1 523.70.065 80.000 731
HFE-7100（气）2.30.006 20.000 106
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材料种类密度ρ/（kg/m3）导热系数k′/[W/（m·K）]动力黏度μ/[kg/（m·s）]
HFE-7100（液）1 523.70.065 80.000 731
HFE-7100（气）2.30.006 20.000 106
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网格数量换热面平均温度/K误差/%换热面平均传热系数/[W/（m2·K）]误差/%
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1 620 000346.420.3319 0881.02
1 830 000347.280.2519 2520.86
2 160 000347.910.1819 3620.57
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网格数量换热面平均温度/K误差/%换热面平均传热系数/[W/（m2·K）]误差/%
1 460 000345.28—18 896—
1 620 000346.420.3319 0881.02
1 830 000347.280.2519 2520.86
2 160 000347.910.1819 3620.57
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多孔微射流热沉沸腾传热特性研究
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孙健 , 叶凡 , 钟超 , 李杰
制冷学报 | 2025,46(5): 166-174
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制冷学报 | 2025, 46(5): 166-174
多孔微射流热沉沸腾传热特性研究
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孙健 , 叶凡, 钟超, 李杰
作者信息
  • 景德镇陶瓷大学材料科学与工程学院　景德镇　333403

通讯作者:

孙健，男，博士，教授，景德镇陶瓷大学材料与科学学院，13507987465，E-mail：。研究方向：微尺度传热与新能源技术。
Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks
Jian Sun , Fan Ye, Chao Zhong, Jie Li
Affiliations
  • School of Materials Science and Engineering, Jingdezhen Ceramic University, Jingdezhen, 333403, China
出版时间: 2025-10-16 doi: 10.12465/j.issn.0253-4339.2025.05.166
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摘要
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随着计算机技术发展以及人工智能的应用，电子芯片越发趋向微型化、集成化，导致其单位体积发热量快速增加，从而影响正常运行。针对该问题，设计了一种阵列翅片式多孔微射流热沉，选用热稳定性和电绝缘性好的HFE-7100作为冷却工质，通过数值模拟和实验研究相结合的方法，研究槽式翅片纵宽比、入口过冷度、入口体积流量、射流雷诺数等因素对微射流沸腾传热过程影响。结果表明：优化后纵宽比为0.5的结构在满足芯片冷却要求的同时具有更好的冷却效果。单相对流传热阶段，相同工况下，入口过冷度对换热影响较小，增大体积流量或射流雷诺数可强化对流传热，最大传热系数可达15 724.40 W/（m2·K）。但在射流沸腾阶段，沸腾起始点ONB对应的热流密度随入口过冷度的减小而减小，增大入口体积流量或射流雷诺数会抑制沸腾的发生，从而削弱换热，但相对单相对流传热阶段，传热系数仍提高20.6%。

沸腾传热  /  微射流  /  电子芯片  /  两相流  /  强化传热

With the development of computer technology and the application of artificial intelligence, electronic chips are becoming increasingly miniaturized and integrated, leading to a rapid increase in their volumetric heating power, thus affecting their normal operation. To address this problem, a heat sink with an array of finned porous microjets was designed, and HFE-7100, which has good thermal stability and electrical insulation, was selected as the cooling medium. Through a combination of numerical simulations and experimental research, the influence of factors such as the longitudinal aspect ratio of the slotted fins, inlet subcooling, inlet volumetric flow rate, and jet Reynolds number on the heat transfer process of microjet boiling was investigated. The results showed that the optimized structure with an aspect ratio of 0.5 met the requirements of chip cooling and had a better cooling effect. In the single-phase convection heat transfer stage, under the same working condition, the inlet subcooling degree had little effect on heat transfer, and increasing the volume flow rate or jet Reynolds number could strengthen the convection heat transfer, and the maximum heat transfer coefficient could reach 15 724.40 W/(m2·K). However, in the jet boiling stage, the heat flux corresponding to the onset of nucleate boiling (ONB), and it decreased with a decrease in the inlet subcooling degree. Increasing the inlet volume flow rate or jet Reynolds number inhibited the occurrence of boiling, thus weakening the heat transfer. However, compared with the single-phase convective heat transfer stage, the heat transfer coefficient increased by 20.6%.

boiling heat transfer  /  microjets  /  electronic chips  /  two-phase flow  /  heat transfer enhancement
孙健, 叶凡, 钟超, 李杰. 多孔微射流热沉沸腾传热特性研究. 制冷学报, 2025 , 46 (5) : 166 -174 . DOI: 10.12465/j.issn.0253-4339.2025.05.166
Jian Sun, Fan Ye, Chao Zhong, Jie Li. Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks[J]. Journal of Refrigeration, 2025 , 46 (5) : 166 -174 . DOI: 10.12465/j.issn.0253-4339.2025.05.166
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随着信息技术的发展，电子芯片需求与技术要求不断提高，持续朝着大功率、微型化和高度集成方向发展，在性能提升的同时热功耗也不断增加。且因高温导致的热失效，已成为影响电子产品寿命的主要原因。因此，探索高效的芯片散热技术成为研究热点。
现阶段，传统的冷却技术如空气冷却和单相液体冷却等已无法满足散热需求[1]。射流沸腾冷却因良好的传热性能得到广泛关注。目前针对射流沸腾冷却主要研究射流速度[2-3]、入口过冷度[4-5]、强化表面结构[6]等。E. A. Browne等[7]使用R134a作为冷却介质，实验研究了交叉流动面积和针翅形状对微针翅射流冲击单相撞击点传热系数的影响。研究结果显示，增大传热面积对整体传热效率有显著的提升作用。R. Jenkins等[8]将阵列式射流热沉的线性微槽和径向微槽表面与无槽道平面进行对比分析，研究发现，径向微槽表面比无槽道平面的热通量提升了2.3倍，最高达到380 W/cm2，线性微槽表面比无槽道平面的热通量提升了2倍。
近年来，一些学者将微通道与之结合，取得了较好的进展。汤凯等[9]提出一种射流沸腾耦合微通道热沉，以氨为工质，通过实验验证，提出的“四周针肋+中心多圆锥”热沉在热点区域752 W/cm2的热负载下，仍可维持加热面温度低于57.1 ℃。张超等[10]提出一种具有顶部浸入式阵列射流柱与底部微针肋阵列结构耦合的微射流沸腾传热系统。结果表明，激光刻蚀比电刷镀形成的微纳复合结构传热效果更好。
本文在上述研究的基础上，提出一种冲击射流耦合沸腾冷却的新型散热方式，利用热性能稳定、电绝缘性好的HFE-7100作为冷却工质，对其传热特性进行研究。
1 实验系统与方法
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1.1 实验系统
实验系统如图1所示。实验过程中，微型水泵提供动力，将工质从储液罐泵入管道，经过过滤器过滤后，由转子流量计测得流量，随后进入热沉换热后通过冷凝管道返回储液罐，循环往复。
阵列式多孔微射流热沉是该实验系统的核心部件，如图2所示，其主体材料为铜，由6×6的射流孔和方形矩阵肋通道构成。射流室的入口直径为8.5 mm，射流孔的直径为1 mm，方形矩阵的长宽均为31 mm。各部分由螺丝钉通过四周预留的螺丝孔固定，并在四周缝隙处涂抹密封胶保证热沉的密闭性。
1.2 实验数据处理
入口流速uin（m/s）：
热源输出的总热量Q（W）：
平均对流传热系数：
工质过冷度ΔTsub（K）：
换热面过热度ΔTsat（K）：
射流雷诺数Re′：
此外，在相变系统中一般采用沸腾数Bo来衡量不同热通量与流量条件下的沸腾强度，计算式如下：
1.3 实验不确定度分析
实验过程中的误差主要包括直接测量误差和间接测量误差。直接测量误差主要受实验仪器的测量精度影响，其不确定度如下：研究显示，热电偶测温时，在将温度数据转换成电信号时，存在非线性问题，一定程度上影响了测温精度[11]，本文所用T型热电偶测温不确定度为±0.5 ℃，数据采集仪的测量不确定度为±（0.000 5%示数+0.000 5%量程），转子流量计的测量不确定度为±5%，压差计的测量不确定度为±1.5%，直流稳压电源的不确定度为电压±0.01 V、电流±0.001 A，恒温水箱的不确定度为±1 ℃。
间接测量对换热面平均温度Tw、平均对流传热系数等影响较大，其不确定度计算如下：
主要物理量的最大不确定度如表1所示。
2 物理模型
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多孔微射流热沉主要由射流室、射流管、冲击室、导热基底板和阵列排布的正方体肋片构成。热沉几何模型如图3所示，模型的流体入口直径Lz1= 8.5 mm，入口通道的长度为4 mm，射流室的长、宽、高分别为Lx==31 mm、Ly=31 mm、Lz=10 mm，射流孔直径d=1 mm，射流管高Lz2=1 mm，方形流体出口边长Lz3=2 mm，出口长度Ly1=4 mm，冷却工质从入口处流入后，通过射流孔高速冲击在冲击块表面，最后从两端出口流出。
3 数学描述
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3.1 数学模型
为简化计算，对整个传热过程作如下假设：
1）工质在热沉内的流动为稳态湍流运动。
2）HFE-7100液体和HFE-7100蒸气均为不可压缩牛顿流体且物性参数为常数。
3）假设热沉各处壁面绝热，且亲疏水性保持一致。
连续性方程：
动量守恒方程：
能量守恒方程：
速度滑移方程：
第二相体积分数方程：
本研究中选用Mixture模型，配合Lee模型描述相变的传热传质过程。根据Lee模型，若控制单元体内的温度高于饱和温度则开始发生相变：
式中：αl、αv分别为液相、气相的热扩散率；βs、βc为传质系数。根据邱国栋等[12]的研究所得方法，确定其合适的取值。在相变过程中，气液两相会发生传热传质，质量源项SM（kg/（m3·s））和能量源项SE（W/m3）之间的关系如下：
湍流模型选择Realizable k-ε模型，该模型可以更好地模拟圆柱射流[13]。在Realizable k-ε模型中针对湍流动能k（J/m3）和耗散率ε的输运方程如下：
3.2 边界条件
入口边界条件为速度入口，出口边界条件为压力出口，出口静压力设为0 Pa。
绝热边界条件：
固体加热面条件：
3.3 工质物性参数
表2所示为毕胜山等[14-15]通过瞬态热线法和表面光散射法测得的HFE-7100的气相、液相物性参数，工质沸点为61 ℃。
4 数值模拟
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4.1 网格划分及数值方法设置
由于该多孔微射流热沉模型具有高度对称性，为节省计算资源，选取1/2进行数值模拟。采用控制体积法将控制方程离散化，使用ICEM软件绘制网格。为了提高计算精度，对射流孔与近壁面处网格加密，如图4所示。
使用SIMPLEC算法离散求解压力与速度耦合方程，使用二阶格式求解其他变量，其中能量项的收敛判断标准为10-6，其他项标准设置为10-3，当满足以上条件时，视为计算收敛。
4.2 网格无关性验证及误差说明
为节省计算资源与时间，确定合适的网格数量。选择换热面平均温度以及平均传热系数的数值模拟数据来进行网格无关性验证。结果如表3所示，在网格数为1 830 000时，换热面平均温度以及平均传热系数的误差均小于1%，满足计算需求。
此外，实验数据与仿真数据间的误差，可能是数值模拟过程中网格划分与边界条件选择导致。数值模拟是基于假设条件下得到的结果，若假设存在绝热壁面，忽略了体积力等因素的影响。然而，这些假设在实验过程中无法复制。
5 结果与分析
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5.1 翅片纵宽比的影响
图5所示为翅片纵宽比（HL/W）分别为0.1（N）和0.5（M）模型图。其中翅片纵向高度HL分别为0.3 mm和1.5 mm，翅片宽度W为3 mm。图6所示为N、M型结构在加热面热流密度q为50 W/cm2、入口过冷度ΔTsub为30 ℃、体积流量qv为0.5 L/min工况下，模拟所得的被冷却表面的温度云图。由图5可知，2种结构虽都满足芯片工作温度要求，但M结构的低温区分布更广、温度更低、温度均匀性更好。总体上看，与传统射流换热的低温区集中在中间，高温区分布于角落不同[16]，该温度分布呈现出“米”字状低温区。这是由于在两相流换热时，沸腾传热吸收大量潜热，迅速降低换热面温度，而在四周角落因射流产生了较大的滞止涡流区，削弱了对流传热，促进气泡成核，增强沸腾传热。
图7所示为2种结构的气相体积云图。由图7可知，气体多集中于四周区，成核点大多分布于槽道、四角区。这是因为高速射流冲击导致边界层变薄，增强了换热能力，此时温度低于气泡成核温度。而槽道区因流速低、温度升高满足了成核条件，且槽道中的扰动，促使了气泡脱离。在四周区，当单相对流传热主导时，射流滞止区的温度最高。当沸腾传热主导时，热沉四角温度骤降，甚至低于射流中心区。此外，翅片纵宽比为0.5时增大了传热面积，提供了更多的成核点，且槽道的加深加剧了内部扰动，强化了沸腾传热，导致M结构的气相分布更多。
图8所示为N和M 2种结构在射流雷诺数为2 000时y/d=11.5（y=11.5处取平行于x轴的截面）处截面流场图。由图8可知，射流孔喷出的高速射流冲击换热面后，向四周扩散并形成相反的涡流，增强了内部扰动，同时将翅片四周的气泡裹挟着脱离壁面，使更多的成核点被过热工质填充，增加了气泡成核量，加强了沸腾传热。此外，M结构具有更大的翅片纵宽比，更深的槽道，导致槽道内的涡流流量更大，更多工质裹挟着气泡流出，提高了换热效果。因此后续的数值模拟，均采用M结构进行。
5.2 入口过冷度的影响
图9所示为体积流量qv为0.5 L/min，工质入口温度为20、30、40 ℃3种工况下，实验与模拟所得换热面的沸腾曲线以及传热系数与热流密度关系。由图9（a）可知，不同入口过冷度下的结果基本一致。在热流密度相同时，壁面过热度随入口温度的增大而增大。随着壁面过热度的增大，沸腾曲线出现拐点，且呈现S状的回折。这是因为相变吸收大量潜热，增强了换热效果，使换热面温度迅速下降。
由图9（b）可知，数值模拟所得沸腾起始点ONB（onset nucleate boiling）对应的热流密度分别为12.5、14.5、18.7 W/cm2，实验测量所得ONB对应的热流密度分别为14.7、17.0、19.1 W/cm2，二者最大误差为14.97%，原因可能如前文误差说明所述。通过对比ONB点的热流密度与过热度随入口过冷度的变化可知，热流密度和过热度随着入口过冷度的降低而降低，说明入口过冷度的增加会延迟沸腾，从气泡动力学的角度分析，增加入口过冷度会抑制气泡成核，从而抑制沸腾的发生。当热流密度低于沸腾起始热流密度时，单相射流为主导，对流传热系数受壁面过热度和热流密度影响很小。在ONB点之后，工质发生相变吸收大量潜热，产生气泡，传热系数迅速升高。
5.3 入口体积流量的影响
图10所示为ΔTsub为31 ℃，入口体积流量qv为0.2、0.5、0.8 L/min 3种工况时，实验与模拟所得换热面的沸腾曲线以及传热系数与热流密度关系。由图10（a）可知，在ONB点前，壁面过热度和热流密度呈正相关的线性变化。此时以射流换热为主，热流密度随入口体积流量的增大而增大，增大体积流量可以改善换热效果。随着壁面过热度的增大，进入冲击沸腾传热阶段，在相同流量时，曲线斜率随过热度的增加明显增大，而当过热度相同时，曲线斜率与流量的增加成反比。此外，热流密度的增幅随着壁面过热度的增加逐渐变小，不同体积流量的曲线逐渐接近，说明较高的热流密度下，体积流量对沸腾传热的影响减弱。
由图10（b）可知，ONB点之前，当热流密度相同时，换热面平均传热系数随着体积流量的增大而增大，且最大单相对流传热系数为15 724.4 W/（m2·K），与实验所得数据最大差值为14.74%，造成误差的原因与图9中的分析一致。进入两相冲击沸腾阶段后，相变吸收大量潜热导致传热系数显著提升，此外相变后的沸腾曲线出现了交叉现象，且体积流量越小，平均传热系数越高。这是因为增大体积流量抑制了气泡的成核，削弱了沸腾传热。
5.4 沸腾数以及射流雷诺数的影响
图11所示为传热系数随沸腾数Bo的变化。由图11可知，不同质量流速下传热系数均随Bo的增大而增大，并呈现出2种不同的增长趋势。当进入沸腾阶段，曲线变化剧烈，斜率明显变陡。且最大Bo为0.11，最大传热系数可达21 752.6 W/（m2·K），模拟数值与实验结果相差12.6%。
图12所示为2种热流密度下传热系数随射流雷诺数Re′的变化。由图12可知，在低热流密度q1为10 W/cm2时，当Re′从250增至958，换热面平均传热系数从10 335.16 W/（m2·K）增至14 186.3 W/（m2·K），与实验结果趋势一致。此时冲击射流冷却起主导作用，高速冲击使边界层变薄，增强了传热效果。当热流密度q2为50 W/cm2时，在相同的Re′范围内，换热面平均传热系数分别从24 887.3 W/cm2降至17 614.2 W/cm2，与实验结果相差较小。导致上述结果的原因如下：1）在该Re′范围内，冲击沸腾主导的停滞区传热减小，与此同时，蒸气质量的增加和液膜厚度的减少，加强了槽道沸腾传热[17]，使槽道区分布的热量较多，导致槽道中发生部分干涸，削弱了传热效果。2）在射流沸腾传热阶段，单相对流和核态沸腾共同作用，在增大单相对流的同时，抑制了沸腾，从而削弱了整体换热能力。
6 结论
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本文构建了一种多孔微射流热沉，通过数值模拟方法，以HFE-7100为冷却工质，通过改变翅片纵宽比来优化热沉，并与实验相结合，研究了不同入口过冷度、入口体积流量、射流雷诺数、热流密度等对其沸腾传热过程的影响，实验结果与数值结果吻合，验证了数值模拟的可靠性。得到结论如下：
1）在加热面热流密度为0、入口过冷度为30 ℃、体积流量为0.5 L/min工况下，优化后翅片纵宽比为0.5的M结构，具有更好的换热效果。
2）单相对流传热阶段，在相同工况下，入口过冷度对换热影响不显著，增大体积流量或射流雷诺数强化了对流传热，最大传热系数可达15 724.40 W/（m2·K）。但在射流沸腾阶段，增加入口过冷度会推迟ONB的出现，入口体积流量的增大会抑制沸腾的发生，削弱换热，但与单相对流传热阶段相比，传热系数仍提高20.6%。
文献
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2025年第46卷第5期
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doi: 10.12465/j.issn.0253-4339.2025.05.166
  • 接收时间：2024-09-21
  • 首发时间：2026-03-13
  • 出版时间：2025-10-16
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  • 收稿日期：2024-09-21
  • 修回日期：2024-11-27
  • 录用日期：2024-12-04
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    景德镇陶瓷大学材料科学与工程学院　景德镇　333403

通讯作者:

孙健，男，博士，教授，景德镇陶瓷大学材料与科学学院，13507987465，E-mail：。研究方向：微尺度传热与新能源技术。
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2种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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