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Article(id=1239136721678430609, tenantId=1146029695717560320, journalId=1238841944844054536, issueId=1239136718008414574, articleNumber=null, orderNo=null, doi=10.12347/j.ycyk.20241217003, pmid=null, cstr=32406.14.ycyk.20241217003, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1734364800000, receivedDateStr=2024-12-17, revisedDate=1740326400000, revisedDateStr=2025-02-24, acceptedDate=null, acceptedDateStr=null, onlineDate=1773362816494, onlineDateStr=2026-03-13, pubDate=1752508800000, pubDateStr=2025-07-15, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1773362816494, onlineIssueDateStr=2026-03-13, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1773362816494, creator=13701087609, updateTime=1773362816494, updator=13701087609, issue=Issue{id=1239136718008414574, tenantId=1146029695717560320, journalId=1238841944844054536, year='2025', volume='46', issue='4', pageStart='1', pageEnd='148', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1773362815620, creator=13701087609, updateTime=1773393299751, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1239264577775522632, tenantId=1146029695717560320, journalId=1238841944844054536, issueId=1239136718008414574, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1239264577775522633, tenantId=1146029695717560320, journalId=1238841944844054536, issueId=1239136718008414574, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=40, endPage=50, ext={EN=ArticleExt(id=1239136721904923034, articleId=1239136721678430609, tenantId=1146029695717560320, journalId=1238841944844054536, language=EN, title=Integrated Design and Verification of A Multi-Functional General-Purpose Comprehensive RF Microsystem for Communication, Navigation and Reconnaissance, columnId=1239136720231395698, journalTitle=Journal of Telemetry, Tracking and Command, columnName=Microwave and Millimeter Wave Technology, runingTitle=null, highlight=null, articleAbstract=

Based on the requirements of multi-application function fusion, integration, and reconfigurability of integrated electronic equipment, this paper designs a comprehensive RF(Radio Frequency) microsystem for communication, navigation, reconnaissance, and other applications to achieve multiple functions such as telemetry, safety control, and data link. Based on the RF digital integration design method, we aim to achieve high-density integration of 8 heterogeneous chips across 5 process nodes, addressing issues such as wiring difficulties, limited isolation space resources, and difficulties in integrating heterogeneous chips. Adopting BGA1369 packaging, the packaging size is 37.5 mm × 37.5 mm × 3.97 mm. To meet the high reliability requirements of universal applications, establish a reliability assessment system for electricity, heat, and power, and achieve batch unmanned aging and life testing. Developing an operating system based on IP software-defined application method to meet the demand for multifunctional communication, navigation and reconnaissance. This system can achieve reconfigurable applications in different RF digital integration scenarios such as handheld telemetry terminals and flight communication systems, and meet the application requirements for convenient development.

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围绕综合电子装备的多应用功能融合、集成和可重构的需求，针对通信、导航、侦察等应用场景，为实现遥测、安控、数据链等多种功能，本文设计了一款面向通导侦多功能通用的综合射频微系统。针对布线困难、隔离空间资源紧张、异质异构芯片集成困难等问题，基于射频数字一体化融合设计方法，实现5种工艺节点共8颗异构芯片的一体化高密度集成；采用BGA1369封装，封装尺寸为37.5 mm×37.5 mm×3.97 mm。针对通用化应用的高可靠需求，建立电、热、力可靠性考核体系，实现批量化无人值守老炼与寿命试验。针对通导侦多功能通用的需求，开发基于IP化软件定义应用方式实现可重构应用的操作系统，可满足在手持遥测终端、飞行通信系统等不同射频数字一体化场景下的应用可重构，满足便捷开发的应用需求。

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王璇　1996年生，硕士，工程师。

刘峰　1983年生，博士研究生，高级工程师。

张金箭　1987年生，博士，高级工程师。

王国军　1997年生，硕士，助理工程师。

阎郁　1985年生，硕士，高级工程师。

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王璇　1996年生，硕士，工程师。

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王璇　1996年生，硕士，工程师。

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刘峰　1983年生，博士研究生，高级工程师。

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刘峰　1983年生，博士研究生，高级工程师。

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张金箭　1987年生，博士，高级工程师。

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张金箭　1987年生，博士，高级工程师。

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王国军　1997年生，硕士，助理工程师。

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王国军　1997年生，硕士，助理工程师。

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阎郁　1985年生，硕士，高级工程师。

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阎郁　1985年生，硕士，高级工程师。

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IEEE Transactions on Reliability, 2011, 60(4): 721-728., articleTitle=Burn-in for systems operating in a shock environment, refAbstract=null), Reference(id=1239263362798907973, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, doi=null, pmid=null, pmcid=null, year=2011, volume=28, issue=1, pageStart=56, pageEnd=61, url=null, language=null, rfNumber=[20], rfOrder=30, authorNames=王伟明, journalName=航天器环境工程, refType=null, unstructuredReference=王伟明. 塑封微电路老炼研究综述[J]. 航天器环境工程, 2011, 28(1): 56-61., articleTitle=塑封微电路老炼研究综述, refAbstract=null), Reference(id=1239263362861822537, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, doi=null, pmid=null, pmcid=null, year=2011, volume=28, issue=1, pageStart=56, pageEnd=61, url=null, language=null, rfNumber=[20], rfOrder=31, authorNames=WANG Weiming, journalName=Spacecraft Environment Engineering, refType=null, unstructuredReference=WANG Weiming. 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figureFileSmall=+fIqBxV9s3ntkjfdgIvE/g==, figureFileBig=5zgKGGduxUM2us03j0vpEQ==, tableContent=null), ArticleFig(id=1239263356155130104, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=图2, caption=微系统内部架构, figureFileSmall=+fIqBxV9s3ntkjfdgIvE/g==, figureFileBig=5zgKGGduxUM2us03j0vpEQ==, tableContent=null), ArticleFig(id=1239263356289347838, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Fig. 3, caption=Simulation optimization results of RF channel return loss and insertion loss, figureFileSmall=9NSWpp2vJEIGuu5gnyVpgA==, figureFileBig=xSbcUQjPN7t0HuIfo8VsxQ==, tableContent=null), ArticleFig(id=1239263356377428230, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=图3, caption=射频通道回波损耗和插入损耗仿真优化结果, figureFileSmall=9NSWpp2vJEIGuu5gnyVpgA==, figureFileBig=xSbcUQjPN7t0HuIfo8VsxQ==, tableContent=null), 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language=CN, label=图5, caption=微系统内部组成, figureFileSmall=jVDL2oMDV8ea5McG7E4FMg==, figureFileBig=Fhq5oVu069lDINRFN5TCGw==, tableContent=null), ArticleFig(id=1239263356872356131, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Fig. 6, caption=Quality consistency inspection and simulation design of microsystems, figureFileSmall=/TMKPyrY4u0RDiz0n/dVGw==, figureFileBig=zWVJ33UzfS/66HzQZ5iUgQ==, tableContent=null), ArticleFig(id=1239263356960436519, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=图6, caption=微系统的质量一致性检验与仿真设计, figureFileSmall=/TMKPyrY4u0RDiz0n/dVGw==, figureFileBig=zWVJ33UzfS/66HzQZ5iUgQ==, tableContent=null), ArticleFig(id=1239263357035933994, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Fig. 7, caption=Integrated RF microsystem thermal design and simulation results, 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articleId=1239136721678430609, language=CN, label=图10, caption=微系统老炼过程, figureFileSmall=uMNYXVVPievlZASyAVYCGg==, figureFileBig=ZOqfIzcnxxKjZCj+Ci8Fag==, tableContent=null), ArticleFig(id=1239263357698634062, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Fig. 11, caption=Block diagram of handheld telemetry terminal based on this microsystem, figureFileSmall=XTptMgtcbE29AYrYACZF6A==, figureFileBig=4/CNEnbl+hdsbrsK9uVDiw==, tableContent=null), ArticleFig(id=1239263357778325843, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=图11, caption=基于本微系统的手持遥测终端框图, figureFileSmall=XTptMgtcbE29AYrYACZF6A==, figureFileBig=4/CNEnbl+hdsbrsK9uVDiw==, tableContent=null), ArticleFig(id=1239263357862211929, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Fig. 12, caption=GMSK I-channel Q-channel demodulation waveform, figureFileSmall=cSOYaKzs7xgc0sxLG/1LSw==, figureFileBig=tkJBkwj8ChhqY6KEPppjhg==, tableContent=null), ArticleFig(id=1239263357929320795, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=图12, caption=GMSK I路Q路解调波形, figureFileSmall=cSOYaKzs7xgc0sxLG/1LSw==, figureFileBig=tkJBkwj8ChhqY6KEPppjhg==, tableContent=null), ArticleFig(id=1239263357996429662, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Fig. 13, caption=GMSK capture waveforms, figureFileSmall=YXpo44YbbwpAkikQSkYiNA==, figureFileBig=c/IBBCmLiAGaN/iWh7J6IQ==, tableContent=null), ArticleFig(id=1239263358042567012, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=图13, caption=GMSK捕获波形, figureFileSmall=YXpo44YbbwpAkikQSkYiNA==, figureFileBig=c/IBBCmLiAGaN/iWh7J6IQ==, tableContent=null), ArticleFig(id=1239263358130647403, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 1, caption=

Composition and performance indicators of internal units in microsystems

, figureFileSmall=null, figureFileBig=null, tableContent=
单元名称性能指标
模拟/射频单元1.4收4发射频信号通道，每通道有独立本振
2.射频频率：40 MHz~6 GHz
3.最大带宽：100 MHz
4.乒乓跳频切换时间≤20 μs
可编程处理单元1.集成350 k可编程逻辑资源和4核ARM Cortex-A7处理器
2.最大主频为800 MHz
3.单核运算能力为1.9 DMIPS/MHz
存储单元1.片内集成配置存储器和DDR3(第三代双倍数据率同步动态随机存取存储器)
2.DDR3存储器为4 Gb，最高1 066 MT/s
3.Nor Flash为512 Mb，最高166 MHz
对外接口1.SPI(串行外设接口)总线，≤50 MHz，2组
2.I2C(集成电路总线)，≤400 kbps，2组
3.UART(通用异步收发器)串口通信，≤921.6 kbps，2组
4.CAN总线，≤1 Mbps，2组
5.通用SerDes(串行器/解串器)总线，≤12.5 Gbps，4×4 Lanes
6.GigE(千兆以太网)控制器，支持RGMII(精简吉比特介质独立接口)和SGMII(串行吉比特介质独立接口)，2组
7.USB(通用串行总线)，≤12 Mbps，2组
), ArticleFig(id=1239263358285836654, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表1, caption=

微系统内部单元组成与性能指标

, figureFileSmall=null, figureFileBig=null, tableContent=
单元名称性能指标
模拟/射频单元1.4收4发射频信号通道，每通道有独立本振
2.射频频率：40 MHz~6 GHz
3.最大带宽：100 MHz
4.乒乓跳频切换时间≤20 μs
可编程处理单元1.集成350 k可编程逻辑资源和4核ARM Cortex-A7处理器
2.最大主频为800 MHz
3.单核运算能力为1.9 DMIPS/MHz
存储单元1.片内集成配置存储器和DDR3(第三代双倍数据率同步动态随机存取存储器)
2.DDR3存储器为4 Gb，最高1 066 MT/s
3.Nor Flash为512 Mb，最高166 MHz
对外接口1.SPI(串行外设接口)总线，≤50 MHz，2组
2.I2C(集成电路总线)，≤400 kbps，2组
3.UART(通用异步收发器)串口通信，≤921.6 kbps，2组
4.CAN总线，≤1 Mbps，2组
5.通用SerDes(串行器/解串器)总线，≤12.5 Gbps，4×4 Lanes
6.GigE(千兆以太网)控制器，支持RGMII(精简吉比特介质独立接口)和SGMII(串行吉比特介质独立接口)，2组
7.USB(通用串行总线)，≤12 Mbps，2组
), ArticleFig(id=1239263358365528433, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 2, caption=

Simulation results of isolation between RF transceiver channels

, figureFileSmall=null, figureFileBig=null, tableContent=
射频收发通道典型频率的通道间隔离度(dB)
800 MHz2.4 GHz5.5 GHz7.5 GHz
RX1至RX296.9790.6378.275.64
TX1至TX2105.5596.682.8677.58
RX1至TX187.6779.4173.4270.81
RX2至TX287.4179.0574.1171.39
), ArticleFig(id=1239263358420054391, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表2, caption=

射频收发通道间隔离度仿真结果

, figureFileSmall=null, figureFileBig=null, tableContent=
射频收发通道典型频率的通道间隔离度(dB)
800 MHz2.4 GHz5.5 GHz7.5 GHz
RX1至RX296.9790.6378.275.64
TX1至TX2105.5596.682.8677.58
RX1至TX187.6779.4173.4270.81
RX2至TX287.4179.0574.1171.39
), ArticleFig(id=1239263358499746173, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 3, caption=

Quality consistency inspection of microsystems

, figureFileSmall=null, figureFileBig=null, tableContent=
A组检验
分组测试项目
A1分组25 ℃下静态测试
A2分组85 ℃下静态测试
A3分组-40 ℃下静态测试
A4分组25 ℃下动态测试
A5分组85 ℃下动态测试
A6分组-40 ℃下动态测试
B组检验
试验项目方法条件
外形尺寸2016——
焊球共面性GJB7677-2012
可焊性GJB7677-2012——
X射线2012判据：按GJB4027A-2006工作项目1103中2.3
ESD(静电放电)终点电测试30151 000 V
C组检验
试验项目方法条件
稳态寿命终点电测试1005试验条件D，85 ℃，1 000 h；或方法1005表1等效条件
D组检验
试验项目方法条件
物理尺寸2016——
焊球共面性GJB7677-2012
焊球拉脱力GJB7677-2012条件A
焊球剪切力GJB7677-2012条件A
高温贮存GB/T 4937125 ℃，100 h
终点电测试SJ/T 10745-1996
热冲击1011条件B，100次
温度循环1010条件B，100次
目检按方法1004/1010的目检判据
终点电测试
强加速稳态湿热GB/T 4937.4100 ℃/85%RH，96 h
目检终点电测试按方法1004，1010
盐雾1009条件A(24 h)
易燃性GB/T 5169.5-2008不进行预处理，施加试验火焰持续时间10 s
), ArticleFig(id=1239263358587826560, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表3, caption=

微系统的质量一致性检验

, figureFileSmall=null, figureFileBig=null, tableContent=
A组检验
分组测试项目
A1分组25 ℃下静态测试
A2分组85 ℃下静态测试
A3分组-40 ℃下静态测试
A4分组25 ℃下动态测试
A5分组85 ℃下动态测试
A6分组-40 ℃下动态测试
B组检验
试验项目方法条件
外形尺寸2016——
焊球共面性GJB7677-2012
可焊性GJB7677-2012——
X射线2012判据：按GJB4027A-2006工作项目1103中2.3
ESD(静电放电)终点电测试30151 000 V
C组检验
试验项目方法条件
稳态寿命终点电测试1005试验条件D，85 ℃，1 000 h；或方法1005表1等效条件
D组检验
试验项目方法条件
物理尺寸2016——
焊球共面性GJB7677-2012
焊球拉脱力GJB7677-2012条件A
焊球剪切力GJB7677-2012条件A
高温贮存GB/T 4937125 ℃，100 h
终点电测试SJ/T 10745-1996
热冲击1011条件B，100次
温度循环1010条件B，100次
目检按方法1004/1010的目检判据
终点电测试
强加速稳态湿热GB/T 4937.4100 ℃/85%RH，96 h
目检终点电测试按方法1004，1010
盐雾1009条件A(24 h)
易燃性GB/T 5169.5-2008不进行预处理，施加试验火焰持续时间10 s
), ArticleFig(id=1239263358726238602, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 4, caption=

Typical simulation results of thermal resistance in microsystems

, figureFileSmall=null, figureFileBig=null, tableContent=
热阻Rja(℃/W)Rjb(℃/W)Rjc(℃/W)
数值8.832.511.02
), ArticleFig(id=1239263358810124693, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表4, caption=

微系统热阻典型仿真结果

, figureFileSmall=null, figureFileBig=null, tableContent=
热阻Rja(℃/W)Rjb(℃/W)Rjc(℃/W)
数值8.832.511.02
), ArticleFig(id=1239263358877233565, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 5, caption=

Microsystem testing

, figureFileSmall=null, figureFileBig=null, tableContent=
序号试验方法与条件
1温度循环GJB548C，1010；-65 ℃~+150 ℃，100次
2机械冲击GJB548C，2002；条件B，Y1方向
3HASTGB/T 4937.4；130 ℃/85%RH96 h
4高低温工作-40 ℃~+85 ℃
5焊球剪切GJB7677；条件A，拉脱力≥3.5 N
6焊球拉脱GJB7677；条件A，拉脱力≥3.5 N
7焊球共面性GJB7677；共面度≤0.25 mm
), ArticleFig(id=1239263358969508256, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表5, caption=

微系统试验

, figureFileSmall=null, figureFileBig=null, tableContent=
序号试验方法与条件
1温度循环GJB548C，1010；-65 ℃~+150 ℃，100次
2机械冲击GJB548C，2002；条件B，Y1方向
3HASTGB/T 4937.4；130 ℃/85%RH96 h
4高低温工作-40 ℃~+85 ℃
5焊球剪切GJB7677；条件A，拉脱力≥3.5 N
6焊球拉脱GJB7677；条件A，拉脱力≥3.5 N
7焊球共面性GJB7677；共面度≤0.25 mm
), ArticleFig(id=1239263359065977254, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 6, caption=

Software repository

, figureFileSmall=null, figureFileBig=null, tableContent=
序号内容
1PS(处理器系统)DDR3配置与读写驱动
2PS Flash配置与读写驱动
3PS网口配置驱动
4GTX(显卡)接口Aurora(极光高速串口通信协议)回环测试
5EMMC(嵌入式多媒体卡)读写驱动
6SFP(小型可插拔收发器)+光口收发驱动
7PCIE接口收发驱动
8射频芯片LVCMOS(低压互补金属氧化物半导体)+LVDS(低电压差分信号)接口配置
9射频芯片FDD(频分双工)+FDD独立模式(TDD，测试驱动开发)配置
10射频发射载波泄漏/镜像抑制校准，以及使用内部Flash存储与调用相关参数
11射频收发单本振跳频/双本振乒乓跳频演示
), ArticleFig(id=1239263359162446252, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表6, caption=

软件资源库

, figureFileSmall=null, figureFileBig=null, tableContent=
序号内容
1PS(处理器系统)DDR3配置与读写驱动
2PS Flash配置与读写驱动
3PS网口配置驱动
4GTX(显卡)接口Aurora(极光高速串口通信协议)回环测试
5EMMC(嵌入式多媒体卡)读写驱动
6SFP(小型可插拔收发器)+光口收发驱动
7PCIE接口收发驱动
8射频芯片LVCMOS(低压互补金属氧化物半导体)+LVDS(低电压差分信号)接口配置
9射频芯片FDD(频分双工)+FDD独立模式(TDD，测试驱动开发)配置
10射频发射载波泄漏/镜像抑制校准，以及使用内部Flash存储与调用相关参数
11射频收发单本振跳频/双本振乒乓跳频演示
), ArticleFig(id=1239263359254720945, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=EN, label=Table 7, caption=

Functional implementation of microsystems

, figureFileSmall=null, figureFileBig=null, tableContent=
功能微系统实现方式
与上位机软件通信1.通过PS接口出千兆网，实现与上位机软件的命令状态交互，同时将解调数据进行上报；
2.通过PS端串口实现debug信息的监测打印。
信号处理1.通过AD/DA进行射频信号收发；
2.通过PL(可编程逻辑)端逻辑资源进行信号调制和解调模块设计。
板载自管理1.通过Flash实现应用的开机自启动；
2.通过PS和PL的中断和高速接口实现数据的内部互传。
), ArticleFig(id=1239263359409910201, tenantId=1146029695717560320, journalId=1238841944844054536, articleId=1239136721678430609, language=CN, label=表7, caption=

微系统的功能实现

, figureFileSmall=null, figureFileBig=null, tableContent=
功能微系统实现方式
与上位机软件通信1.通过PS接口出千兆网，实现与上位机软件的命令状态交互，同时将解调数据进行上报；
2.通过PS端串口实现debug信息的监测打印。
信号处理1.通过AD/DA进行射频信号收发；
2.通过PL(可编程逻辑)端逻辑资源进行信号调制和解调模块设计。
板载自管理1.通过Flash实现应用的开机自启动；
2.通过PS和PL的中断和高速接口实现数据的内部互传。
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面向通导侦多功能通用的综合射频微系统集成设计与验证
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王璇 , 刘峰 , 张金箭 , 王国军 , 阎郁
遥测遥控 | 微波毫米波技术 2025,46(4): 40-50
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遥测遥控 | 微波毫米波技术 2025, 46(4): 40-50
面向通导侦多功能通用的综合射频微系统集成设计与验证
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王璇, 刘峰, 张金箭, 王国军, 阎郁
作者信息
  • 北京遥测技术研究所 北京 100076

    • 王璇　1996年生，硕士，工程师。

    刘峰　1983年生，博士研究生，高级工程师。

    张金箭　1987年生，博士，高级工程师。

    王国军　1997年生，硕士，助理工程师。

    阎郁　1985年生，硕士，高级工程师。

Integrated Design and Verification of A Multi-Functional General-Purpose Comprehensive RF Microsystem for Communication, Navigation and Reconnaissance
Xuan WANG, Feng LIU, Jinjian ZHANG, Guojun WANG, Yu YAN
Affiliations
  • Beijing Research Institute of Telemetry, Beijing 100076, China
出版时间: 2025-07-15 doi: 10.12347/j.ycyk.20241217003
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摘要
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围绕综合电子装备的多应用功能融合、集成和可重构的需求，针对通信、导航、侦察等应用场景，为实现遥测、安控、数据链等多种功能，本文设计了一款面向通导侦多功能通用的综合射频微系统。针对布线困难、隔离空间资源紧张、异质异构芯片集成困难等问题，基于射频数字一体化融合设计方法，实现5种工艺节点共8颗异构芯片的一体化高密度集成；采用BGA1369封装，封装尺寸为37.5 mm×37.5 mm×3.97 mm。针对通用化应用的高可靠需求，建立电、热、力可靠性考核体系，实现批量化无人值守老炼与寿命试验。针对通导侦多功能通用的需求，开发基于IP化软件定义应用方式实现可重构应用的操作系统，可满足在手持遥测终端、飞行通信系统等不同射频数字一体化场景下的应用可重构，满足便捷开发的应用需求。

微系统  /  异构芯片  /  高密度集成  /  可重构  /  射频  /  通信  /  导航  /  侦察

Based on the requirements of multi-application function fusion, integration, and reconfigurability of integrated electronic equipment, this paper designs a comprehensive RF(Radio Frequency) microsystem for communication, navigation, reconnaissance, and other applications to achieve multiple functions such as telemetry, safety control, and data link. Based on the RF digital integration design method, we aim to achieve high-density integration of 8 heterogeneous chips across 5 process nodes, addressing issues such as wiring difficulties, limited isolation space resources, and difficulties in integrating heterogeneous chips. Adopting BGA1369 packaging, the packaging size is 37.5 mm × 37.5 mm × 3.97 mm. To meet the high reliability requirements of universal applications, establish a reliability assessment system for electricity, heat, and power, and achieve batch unmanned aging and life testing. Developing an operating system based on IP software-defined application method to meet the demand for multifunctional communication, navigation and reconnaissance. This system can achieve reconfigurable applications in different RF digital integration scenarios such as handheld telemetry terminals and flight communication systems, and meet the application requirements for convenient development.

Microsystem  /  Heterogeneous chips  /  High density integration  /  Reconfigurable  /  RF  /  Communication  /  Navigation  /  Reconnaissance
王璇, 刘峰, 张金箭, 王国军, 阎郁. 面向通导侦多功能通用的综合射频微系统集成设计与验证. 遥测遥控, 2025 , 46 (4) : 40 -50 . DOI: 10.12347/j.ycyk.20241217003
Xuan WANG, Feng LIU, Jinjian ZHANG, Guojun WANG, Yu YAN. Integrated Design and Verification of A Multi-Functional General-Purpose Comprehensive RF Microsystem for Communication, Navigation and Reconnaissance[J]. Journal of Telemetry, Tracking and Command, 2025 , 46 (4) : 40 -50 . DOI: 10.12347/j.ycyk.20241217003
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0　引言
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随着现代信息化作战理念的不断发展，以及武器装备软硬件集成设计技术、多功能综合射频一体化融合技术的发展，综合电子装备需求向多应用功能融合、集成和可重构趋势发展，电气电子设备向系列化、模块化、通用化趋势发展[1]。国内外先进通信、导航、侦察等电子装备需要处理的信息日益庞大，包括系统控制、传感器信息获取、数据链路系统、任务规划和编队信息，同时还需要与地面完成信息交互、与指挥中心进行通信。伴随着任务的复杂性激增，电子装备上各设备由简单协同向一体化方向发展。随着作战理念的发展和现代战争复杂对抗环境的需要，电子装备上需要装载更多更为复杂的电子系统，但由于内部空间限制，难以装载更多的作战载荷，成为制约通信、导航、侦察等电子装备发展的因素之一。因此，急需新的集成化设计方法，对多应用功能进行一体化集成[2]。现代战争威胁的复杂性和应对威胁反应的高速性要求电子装备具备灵活机动的功能和参数重构能力，具有更快的综合控制能力和综合信息处理能力。为应对未知战场突发对抗，需要改变原有离散的电气结构和单一化设计能力，以具备更快的应对速度。
20世纪90年代末，美国国防部高级研究计划局(DARPA)提出采用异构集成技术将微电子器件、光电子器件和微机械系统(MEMS)器件集成，形成微型化异构集成电路[3,4]。通过三维异质异构集成技术，将射频、基带、处理、存储等多种功能垂直堆叠，在丰富系统功能的同时还缩小了尺寸[5]。而随着异质异构先进集成技术和以硅通孔(TSV)为代表的垂直互连技术的突破，以片上系统(SoC)和系统级封装(SiP)[6]技术为代表的第四代微波集成电路得到了快速发展[7-9]。微系统技术着眼于多功能裸芯的片内高密度集成，是实现集成电路小型化、突破摩尔定律极限的重要途径[10]。
我国多功能综合射频技术研究虽处于起步阶段，但已在船舶和飞机上得到应用，在导弹武器平台处于推广应用阶段。近年来，在航天领域已开启多个弹(箭)载综合射频设备的项目研制，但目前相关研究主要集中于从单机设备层面上实现多功能的综合集成，由于受限于国产化芯片研制瓶颈，国内在芯片化通用平台方面仍缺少相关产品研制。
面向通导侦多功能通用的综合射频微系统在设计与验证上面临诸多挑战。一方面，在元器件选型全国产化的前提下，要充分涵盖通信、导航、侦察等多领域产品所需的硬件架构和软件资源；另一方面，综合射频微系统内部需一体化集成多种工艺节点的异构芯片，引入了更多更高密度的射频和高速数字信号，导致微系统内布线困难、隔离空间资源紧张等问题更加严重。因此，射频数字等敏感信号的一体化融合、异构芯片的高密度集成、高速射频数字混合IC有机基板的布线设计以及微系统可靠性验证都尤为重要，相关设计流程如图1所示。
针对上述应用需求，本文设计了一款面向通导侦多功能通用的综合射频微系统，以下简称本微系统。首先从当前通信、导航、侦察等应用需求出发，明确了综合射频微系统的集成设计方案，随后通过可靠性仿真设计与可靠性试验验证该方案的可行性，最后通过手持遥测终端和飞行通信系统2个实际产品的应用验证，证明本微系统满足通导侦多功能通用需求。
1　综合射频微系统集成设计
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1.1　微系统架构设计
如图2所示，本微系统内部集成PSoC(可编程系统级芯片)、射频收发器芯片组和各类存储器等共8颗异质异构芯片，支持用户根据设计需求实现可编程的基带数据处理、总线调度等功能，支持4收4发的独立射频收发通道，并支持多种对外接口。其性能指标见表1。
其中，射频收发器芯片与PSoC芯片通过SPI、LVDS(低电压差分信号)进行相互通信和数据传输，PSoC芯片的GPIO(通用输入/输出口)、I2C、UART以及各个bank(存储单元)的I/O信号则通过微系统封装管脚引出至封装外部。大容量DDR存储器的集成减少缩短了信号的传输路径，改善了信号的性能，部分电源的合并等设计缩减了微系统面积，有利于系统的小型化和通用化，支持微系统在不同射频数字一体化场景下的产品化应用。
1.2　微系统封装设计与仿真
1.2.1　微系统基板布线设计与仿真分析
随着射频技术的广泛应用和发展，综合射频封装已呈现出更高密度功能集成、更高功率、更高频率和更低成本的发展要求。对于传统射频封装，先进射频封装面临布线、信号完整性和工艺等多方面的挑战[10,11]。
本微系统采用12层布线的ABF(Ajinomoto Build-up Film，味之素堆积膜)基板设计，基板包括6片FC(Flip-Chip，倒装芯片)，2片SMT(表面贴装技术)芯片以及78颗阻容元件。全部芯片均采用倒装互连工艺，确保更高的集成密度和更短的互连布线长度，避免传统键合线在传输延迟、阻抗不连续和非屏蔽串扰等方面的影响。
本微系统将核心器件的互联走线在微系统内实现，整板I/O较传统高速射频数字混合PCB(印刷电路板)减少1/3，并将大量并行等长复杂布线集成在微系统内，突破20 μm线宽/间距、每平方毫米5个内部凸点设计能力。而在内部互联走线设计时，需要在有限的紧凑空间内，重点考虑射频通道损耗和隔离度，尤其是射频发射信号对接收信号的干扰影响。因此，相关仿真分析是设计优化中的重点和难点。
射频走线的回波损耗和插入损耗仿真结果如图3所示，发现射频通道在高频段的回波损耗较差，在6 GHz左右回波损耗仅有-15 dB。通过分析发现是由于core(核心)层的过孔和底部焊盘阻抗不连续导致的。通过调整过孔core层和焊盘层的反焊盘，TX(发送)和RX(接收)通道的回波损耗整体提升5 dB以上，插入损耗小于0.5 dB。
结合仿真结果进行优化设计后，射频收发芯片组全频段通道隔离度优于70 dB，如表2所示。射频通道的插入损耗、回波损耗和隔离度等均可满足实际应用需求。
1.2.2　微系统封装结构设计与仿真分析
依据通导侦多功能通用需求，开展封装结构设计。本微系统采用定制散热盖加基板设计。封装侧面结构如图4所示。在芯片顶部填充导热胶，并设计铜质散热盖，散热盖局部下沉，保证散热路径最优化设计，且确保较薄的射频芯片也能有良好的散热接触。芯片均采用FC安装方式，并从芯片四周引出I/O，大幅缩短互联长度，减小RC延迟，有效提高电性能、散热能力与可靠性。
本微系统采用BGA1369封装，封装尺寸为37.5 mm×37.5 mm×3.97 mm。如图5所示，本微系统实现了CMOS 28 nm、RF CMOS 55 nm、CMOS DRAM 38 nm 和IPD(集成产品开发)工艺等5种工艺节点共8颗异构芯片以及78颗无源阻容的一体化高密度集成，较传统PCB板的面积减小了70%，有利于系统的小型化、通用化设计。
如表3和图6所示，在进行微系统仿真设计时，坚持“可靠性是设计出来的”原则，将可靠性作为仿真设计的源头，在初始仿真设计中就做好质量把控。根据微系统质量一致性检验的要求，进行电、热、力仿真设计。本微系统的信号完整性与电源完整性仿真均满足应用需求，可靠性仿真设计在第2章节进行详细描述。
2　微系统可靠性设计
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2.1　可靠性仿真设计
2.1.1　微系统热学仿真设计
本微系统在有限空间内集成了射频收发器芯片组和PSoC芯片等多个大功耗器件，芯片的热功耗密度很大，热设计的成败直接决定了该微系统是否可以正常并可靠地工作。通过基板选型、架构设计、布线设计和封装设计，并辅助进行仿真优化和散热设计，可以确保微系统内部元器件可靠、稳定地工作[12-15]。如图7所示，本微系统在环境温度25 ℃、20%最大功耗、JEDEC(固态技术协会联合电子器件工程委员会标准)自然对流条件下进行热学仿真设计。
根据JEDEC标准，本项目Rja分析所用PCB为2s2p(两层信号层两层电源层)结构，厚度1.6 mm，各向异性等效导热系数分别为25/25/0.38(W/m·K)。热阻的典型仿真结果如表4所示。
2.1.2　微系统力学仿真设计
本微系统布局紧凑，封装互联结构复杂，为保证电路在不同应用场景下的正常运行，需对电路进行机械应力仿真分析；另外，需对冷热环境下的疲劳进行仿真分析，对系统的寿命进行预测，为系统的长期可靠性提供理论依据。
如图8所示，本微系统在-40 ℃、25 ℃及85 ℃下，应力值偏小，失效风险较低；在室温下翘曲为-83.05 μm，高温下翘曲为+25.60 μm，远低于标准要求，翘曲超规格风险小；通过恒定加速度分析得到微系统在X、Y、Z三个方向上的最大应力分别为2.258 8 MPa、3.167 MPa、16.086 MPa，可在确定应力强度情况下，为筛选试验提供参考。
2.2　微系统可靠性试验
针对通用化应用的高可靠需求，根据GJB7400对N1级产品的检验要求，本微系统建立了电、热、力可靠性考核体系。针对其中具有代表性且易失效的试验项目，完成可靠性摸底试验。为进一步评估本微系统在使用寿命内的可靠性与质量水平，设计并完成批量化无人值守老炼与寿命试验。
2.2.1　可靠性试验
本微系统采用混合异构集成技术，实现了多种工艺集成，为保证其高质量批产应用，可靠性试验尤为重要。本微系统已通过表5中全部试验。
2.2.2　无人值守老炼技术
本微系统内部工艺结构复杂，且信号数量庞大。当前，老炼与寿命试验仍是确保塑封微电路(PEM，Plastic Encapsulated Microcircuit)高质量与高可靠性的重要手段之一[16-19]。而本微系统的老炼与寿命试验存在时间长、无人值守、数据记录复杂、28 nm CMOS工艺的PSoC芯片对结温准确性要求高等问题。
传统温箱老炼与寿命试验的方案存在温控不准确、温差大、系统复杂庞大、接线难度大、线缆和外围电路寿命要求高、功耗大等诸多缺点[20]。本微系统采用了精准温控TDBI(Test During Burn-In，老化中测试)无温箱老炼技术，可实现故障监测与全周期数据自动记录，支持无人值守。如图9所示，在试验过程中使用温控Socket(插座)，仅需加热待测件(DUT，Device Under Test)，其他部件均在常温下工作，可延长系统寿命。
本微系统的老炼工装基于PMBus总线技术，实现多工位独立遥控开关，独立自动加热/风冷闭环控制(控温精度达±1 ℃)，每工位11路电源V/I监控，过压过流过温保护以及自动化数据记录功能，保障试验过程安全有效。单个微系统最大加热功率为15 W。
如图10所示，在老炼过程中，对微系统多路电源电压/电流、微系统壳温/结温进行监测，在15 min内可达到从20 ℃到85 ℃的快速升温要求，温升比常规的温箱要快很多，有效节省了试验时长，且在160 h内可持续精准控温85±1 ℃。在测试过程中还可实现故障监测与全周期数据自动记录。
综上所述，精准温控TDBI无温箱老炼技术具有长寿命、独立断电保护、精准温控、低能耗、测试便捷、全周期数据自动记录、温升快等优点，满足批量化无人值守老炼的需求。
3　基于微系统的产品化验证应用
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与传统的PCB板级设计相比，本设计归总通信、导航、侦察等相关产品共性需求，完成综合射频微系统的研制，基于IP化软件定义应用的方式实现应用可重构。本微系统的可重构软件资源库如表6所示。根据不同的应用需求，可通过软件定义选取所需的通信接口协议和存储资源接口，并调用相应的IP核，选用所需的射频收发通道，实现多种场景下的应用可重构，满足便捷开发的应用需求。相应软件均已通过测试验证，满足通用化应用要求。
以导航应用为例，通过调用RS422、RS232、UART和PCIE(外设组件互连扩展)接口，Flash与EMMC存储资源，射频收发接收1、3通道与本振1、3通道，可实现所需的导航功能。本文以手持遥测终端、飞行通信系统的应用验证为例进行详细介绍。
3.1　手持遥测终端应用验证
如表7所示，基于本微系统可实现软件通信、信号处理、板载自管理等功能。
如图11所示，基于本微系统，可实现手持遥测终端单数据流的遥测左右旋信号的接收、分集合成、解调处理等功能。
在2 300 MHz频点、码率20 Mbps的试验条件下，信号体制为PCM-FM(脉冲编码调制-调频)，进行自闭环验证。基于本微系统可实现该遥测体制的无丢帧无误码收发。
3.2　飞行通信系统应用验证
在某飞行通信系统应用验证中，本微系统通过串口接收上位机注入的组网参数并存储起来；通过内部逻辑资源完成信号调制和解调；通过处理器资源管理L波段的射频信号收发，分别基于FDD和TDD模式完成了相应验证。
如图12所示，在FDD模式下，通过自发自收回环方式确认接收解调情况，抓取解调信号波形和捕获峰值结果正常。如图13所示，解调后的数据捕获成功，验证通过。
由测试图可知，基于本微系统实现了该飞行通信系统的基带数据处理和射频信号收发功能。
4　结束语
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面向综合电子装备的多应用功能融合、集成和可重构的需求，本文设计了一款面向通导侦多功能通用的综合射频微系统。针对布线困难、隔离空间资源紧张、异质异构芯片集成困难等问题，进行一体化集成设计，实现了5种工艺节点共8颗异构芯片以及78颗无源阻容元件的一体化高密度集成；基于高密度混合信号基板设计方法，突破20 μm线宽/间距、每平方毫米5个内部凸点设计；采用BGA1369封装，封装尺寸为37.5 mm×37.5 mm×3.97 mm，面积较传统PCB方案减小70%。针对通用化应用的高可靠需求，建立电、热、力可靠性考核体系，完成可靠性摸底试验；可实现批量化无人值守老炼与寿命试验。针对通导侦多功能通用的需求，基于IP化软件定义应用的方式实现应用可重构，可满足在手持遥测终端、飞行通信系统等不同射频数字一体化场景下便捷开发的应用需求。
基金
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  • 中国航天科技集团有限公司第九研究院青年拔尖人才自筹基金项目
文献
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2025年第46卷第4期
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doi: 10.12347/j.ycyk.20241217003
  • 接收时间：2024-12-17
  • 首发时间：2026-03-13
  • 出版时间：2025-07-15
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  • 收稿日期：2024-12-17
  • 修回日期：2025-02-24
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中国航天科技集团有限公司第九研究院青年拔尖人才自筹基金项目
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    北京遥测技术研究所 北京 100076
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2种不同金属材料的力学参数
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total species (%)		 属
Genus		 种数
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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