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Article(id=1149773875640229898, tenantId=1146029695717560320, journalId=1146123166801305609, issueId=1149773869357167407, articleNumber=null, orderNo=null, doi=10.12404/j.issn.1671-1815.2405066, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1720195200000, receivedDateStr=2024-07-06, revisedDate=1738944000000, revisedDateStr=2025-02-08, acceptedDate=null, acceptedDateStr=null, onlineDate=1752057053717, onlineDateStr=2025-07-09, pubDate=1746633600000, pubDateStr=2025-05-08, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1752057053717, onlineIssueDateStr=2025-07-09, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1752057053717, creator=13701087609, updateTime=1752057053717, updator=13701087609, issue=Issue{id=1149773869357167407, tenantId=1146029695717560320, journalId=1146123166801305609, year='2025', volume='25', issue='13', pageStart='5273', pageEnd='5704', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=0, createTime=1752057052207, creator=13701087609, updateTime=1768456769392, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1218559268744253990, tenantId=1146029695717560320, journalId=1146123166801305609, issueId=1149773869357167407, language=EN, specialIssueTitle=, coverIllustrator=, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1218559268744253991, tenantId=1146029695717560320, journalId=1146123166801305609, issueId=1149773869357167407, language=CN, specialIssueTitle=, coverIllustrator=, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=5415, endPage=5421, ext={EN=ArticleExt(id=1149773875866722318, articleId=1149773875640229898, tenantId=1146029695717560320, journalId=1146123166801305609, language=EN, title=Thermal Performance of Phase Change Material Energy Storage Structures for Electronic Devices, columnId=1156262732765717457, journalTitle=Science Technology and Engineering, columnName=Papers·Mechanical and Instrumental Industry, runingTitle=null, highlight=null, articleAbstract=

Aiming at the problem that it is difficult to directly use external heat sink to dissipate heat for high-power electronic devices with short-time operation in external insulation condition, the phase-change material with low melting point and high volume enthalpy value was adopted to optimize the design of energy storage structure and realize temperature control for electronic devices. Firstly, based on the constraints of electronic device volume, weight, external environment, thermal power, working time, etc., combined with the thermal performance of phase change materials, an integrated design of heat dissipation structure was carried out. Secondly, according to the characteristics of phase change material(PCM), an equivalent specific heat capacity thermal analysis method based on temperature feedback was proposed. Finally, the thermal conductivity of three PCM including paraffin, carbon composite and liquid metal, was analyzed by numerical simulation, and the heat dissipation performance of the three PCM in specificenergy-storage structures was evaluated by using heat source temperature rise and temperature equalization as indicators, and an optimal phase-change energy-storage structure of the electronic devices was determined. The results show that the PCM can significantly control the temperature rise in a certain period of time, which meets the temperature control requirements of electronic devices in small volume and external adiabatic environment. The volume enthalpy of PCM represents the energy storage capacity per unit volume of PCM. The higher the volume enthalpy, the smaller the volume of PCM required. Liquid metal can obtain better thermal properties because of its large enthalpy and high thermal conductivity.

, correspAuthors=Gong-li TAN, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, authorCompany=null, fund=null, authors=null, authorsList=Gong-li TAN, Lin-wei GU, Juan ZHAI, Xue-kai ZHU, Zhi-qiang DAI), CN=ArticleExt(id=1149773899342242346, articleId=1149773875640229898, tenantId=1146029695717560320, journalId=1146123166801305609, language=CN, title=电子设备相变材料储能结构热性能, columnId=1156262732954461139, journalTitle=科学技术与工程, columnName=论文·机械、仪表工业, runingTitle=null, highlight=null, articleAbstract=

针对短时工作且外部绝热的高功率电子设备难以直接利用外部热沉散热的问题,采用低熔点、高体积焓值的相变材料进行储能结构优化设计,实现电子设备的温度控制。首先,基于电子设备体积、重量、外部环境、热功率、工作时间等约束条件,结合相变材料热性能进行散热结构一体化设计;其次,根据相变材料的性能特点,提出一种基于温度反馈的等效比热容热分析方法;最后,结合实例对石蜡、烯炭复合材料和液态金属3种相变材料的导热性能进行数值模拟分析,以热源温升和均温性为指标,评估3种相变材料在储能结构中的散热性能,确定电子设备的最佳相变储能结构。研究结果表明:相变材料在一定时间内能显著控制温升,满足小体积、外部绝热环境电子设备的温控要求;相变材料的体积焓值表征单位体积相变材料储能能力,体积焓值越高,所需相变材料的体积就越小;液态金属因体积焓值大,导热系数高,热性能更好。

, correspAuthors=谭公礼, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=dhzqHcPOyHdf7UUsuV9KPA==, magXml=uWCBlTiJhujJ0BB6HS78HQ==, pdfUrl=null, pdf=PoF8t5qnbdgV/n1xSWTmvQ==, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=hCXYs3V8/pYPyUAbbeh1nw==, mapNumber=null, authorCompany=null, fund=null, authors=

谭公礼(1988—),男,汉族,江西南昌人,硕士,高级工程师。研究方向:电子设备结构热设计及流体力学。E-mail:。

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谭公礼(1988—),男,汉族,江西南昌人,硕士,高级工程师。研究方向:电子设备结构热设计及流体力学。E-mail:。

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谭公礼(1988—),男,汉族,江西南昌人,硕士,高级工程师。研究方向:电子设备结构热设计及流体力学。E-mail:。

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companyName=null, departmentName=null, remark=2 扬州大学广陵学院, 扬州 225000)])], figs=[ArticleFig(id=1175114509384560733, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Fig.1, caption=Thermal analysis calculation flow of phase change energy storage structure, figureFileSmall=Pqb+c+bhqs/aZ8jiBwIZHw==, figureFileBig=yOsGCGeO6fPIZgh0LPmGag==, tableContent=null), ArticleFig(id=1175114509434892382, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=CN, label=图1, caption=相变储能结构热分析计算流程, figureFileSmall=Pqb+c+bhqs/aZ8jiBwIZHw==, figureFileBig=yOsGCGeO6fPIZgh0LPmGag==, tableContent=null), ArticleFig(id=1175114509497806943, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Fig.2, caption=Parameter setting of transient thermal simulation for phase change energy storage structure, figureFileSmall=aE0IJVp+UJuZyvGHDDjEzQ==, 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caption=相变储能结构热分析数值模拟模型, figureFileSmall=djP8u5fjKyaXPQvPpT8NxA==, figureFileBig=tabXbsh5Jv4Bby2kTGLZXw==, tableContent=null), ArticleFig(id=1175114510210838631, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Fig.6, caption=Temperature distribution of phase change energy storage structure of 3 kinds of PCM, figureFileSmall=KBF/so0BjCHtvyZDPptHQA==, figureFileBig=K538Co6zCA8rVKn4bau1lA==, tableContent=null), ArticleFig(id=1175114510298919016, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=CN, label=图6, caption=3种相变材料的相变储能结构温度分布, figureFileSmall=KBF/so0BjCHtvyZDPptHQA==, figureFileBig=K538Co6zCA8rVKn4bau1lA==, tableContent=null), ArticleFig(id=1175114510403776617, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Fig.7, caption=Comparison of temperature change of three phase change energy storage structures, figureFileSmall=NhD/nUFKQT9V3FcVaEXBcA==, figureFileBig=CIpl8HRDTQ2+IJiuYWjAAA==, tableContent=null), ArticleFig(id=1175114510542188650, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=CN, label=图7, caption=3种相变储能结构温度变化对比, figureFileSmall=NhD/nUFKQT9V3FcVaEXBcA==, figureFileBig=CIpl8HRDTQ2+IJiuYWjAAA==, tableContent=null), ArticleFig(id=1175114510638657643, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Table 1, caption=

Phase change material parameter

, figureFileSmall=null, figureFileBig=null, tableContent=
相变材料
名称		 石蜡
C20H42		 烯炭复合
相变材
GEPCM-50		 液态金属
相变材料
LMS-SM77419
熔点/℃ 45 50 60
固体密度/(g·cm-3) 0.80 1.05 7.70
比热容/[J·(kg·K)-1] 2.0 2.9 200.0
热导率/[W·(m·K)-1] 0.15 19.00 22.00
熔化热/(J·g-1) 247 200 31
), ArticleFig(id=1175114510693183596, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=CN, label=表1, caption=

相变材料参数

, figureFileSmall=null, figureFileBig=null, tableContent=
相变材料
名称		 石蜡
C20H42		 烯炭复合
相变材
GEPCM-50		 液态金属
相变材料
LMS-SM77419
熔点/℃ 45 50 60
固体密度/(g·cm-3) 0.80 1.05 7.70
比热容/[J·(kg·K)-1] 2.0 2.9 200.0
热导率/[W·(m·K)-1] 0.15 19.00 22.00
熔化热/(J·g-1) 247 200 31
), ArticleFig(id=1175114510764486765, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Table 2, caption=

Calculation results of equivalent specific heat capacity of PCM

, figureFileSmall=null, figureFileBig=null, tableContent=
相变材
料种类		 体积焓值
ργ/(J·cm-3)		 体积/
cm3		 质量/g 等效比热容/
[J·(kg·K)-1]
石蜡 197.6 303 243 4 942
烯炭复合材料 210 285.7 300 4 002
液态金属 238.7 251.4 1 935 800
), ArticleFig(id=1175114510819012718, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=CN, label=表2, caption=

相变材料等效比热容计算结果

, figureFileSmall=null, figureFileBig=null, tableContent=
相变材
料种类		 体积焓值
ργ/(J·cm-3)		 体积/
cm3		 质量/g 等效比热容/
[J·(kg·K)-1]
石蜡 197.6 303 243 4 942
烯炭复合材料 210 285.7 300 4 002
液态金属 238.7 251.4 1 935 800
), ArticleFig(id=1175114510932258927, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=EN, label=Table 3, caption=

Thermal properties of phase change materials

, figureFileSmall=null, figureFileBig=null, tableContent=
相变材
料种类		 体积焓值ργ/
(J·cm-3)		 体积/
cm3		 热源
温升/℃		 热源均
温性/℃
石蜡 197.6 303.1 75.0 7.2
烯炭复合材料 210.0 285.7 36.0 1.0
液态金属 238.7 251.4 33.0 0.7
), ArticleFig(id=1175114511007756400, tenantId=1146029695717560320, journalId=1146123166801305609, articleId=1149773875640229898, language=CN, label=表3, caption=

相变材料热性能

, figureFileSmall=null, figureFileBig=null, tableContent=
相变材
料种类		 体积焓值ργ/
(J·cm-3)		 体积/
cm3		 热源
温升/℃		 热源均
温性/℃
石蜡 197.6 303.1 75.0 7.2
烯炭复合材料 210.0 285.7 36.0 1.0
液态金属 238.7 251.4 33.0 0.7
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电子设备相变材料储能结构热性能
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谭公礼 1 , 顾林卫 1 , 翟娟 2 , 朱学凯 1 , 戴志强 1
科学技术与工程 | 论文·机械、仪表工业 2025,25(13): 5415-5421
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科学技术与工程 | 论文·机械、仪表工业 2025, 25(13): 5415-5421
电子设备相变材料储能结构热性能
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谭公礼1 , 顾林卫1, 翟娟2, 朱学凯1, 戴志强1
作者信息
  • 1 中国船舶集团公司有限公司第七二三研究所, 扬州 225101
  • 2 扬州大学广陵学院, 扬州 225000

    • 谭公礼(1988—),男,汉族,江西南昌人,硕士,高级工程师。研究方向:电子设备结构热设计及流体力学。E-mail:。

Thermal Performance of Phase Change Material Energy Storage Structures for Electronic Devices
Gong-li TAN1 , Lin-wei GU1, Juan ZHAI2, Xue-kai ZHU1, Zhi-qiang DAI1
Affiliations
  • 1 The 723 Institute of CSSC, Yangzhou 225101, China
  • 2 College of Guangling, Yangzhou University, Yangzhou 225000, China
出版时间: 2025-05-08 doi: 10.12404/j.issn.1671-1815.2405066
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摘要
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针对短时工作且外部绝热的高功率电子设备难以直接利用外部热沉散热的问题,采用低熔点、高体积焓值的相变材料进行储能结构优化设计,实现电子设备的温度控制。首先,基于电子设备体积、重量、外部环境、热功率、工作时间等约束条件,结合相变材料热性能进行散热结构一体化设计;其次,根据相变材料的性能特点,提出一种基于温度反馈的等效比热容热分析方法;最后,结合实例对石蜡、烯炭复合材料和液态金属3种相变材料的导热性能进行数值模拟分析,以热源温升和均温性为指标,评估3种相变材料在储能结构中的散热性能,确定电子设备的最佳相变储能结构。研究结果表明:相变材料在一定时间内能显著控制温升,满足小体积、外部绝热环境电子设备的温控要求;相变材料的体积焓值表征单位体积相变材料储能能力,体积焓值越高,所需相变材料的体积就越小;液态金属因体积焓值大,导热系数高,热性能更好。

体积焓值  /  石蜡  /  烯炭复合材料  /  液态金属  /  等效比热容  /  数值模拟

Aiming at the problem that it is difficult to directly use external heat sink to dissipate heat for high-power electronic devices with short-time operation in external insulation condition, the phase-change material with low melting point and high volume enthalpy value was adopted to optimize the design of energy storage structure and realize temperature control for electronic devices. Firstly, based on the constraints of electronic device volume, weight, external environment, thermal power, working time, etc., combined with the thermal performance of phase change materials, an integrated design of heat dissipation structure was carried out. Secondly, according to the characteristics of phase change material(PCM), an equivalent specific heat capacity thermal analysis method based on temperature feedback was proposed. Finally, the thermal conductivity of three PCM including paraffin, carbon composite and liquid metal, was analyzed by numerical simulation, and the heat dissipation performance of the three PCM in specificenergy-storage structures was evaluated by using heat source temperature rise and temperature equalization as indicators, and an optimal phase-change energy-storage structure of the electronic devices was determined. The results show that the PCM can significantly control the temperature rise in a certain period of time, which meets the temperature control requirements of electronic devices in small volume and external adiabatic environment. The volume enthalpy of PCM represents the energy storage capacity per unit volume of PCM. The higher the volume enthalpy, the smaller the volume of PCM required. Liquid metal can obtain better thermal properties because of its large enthalpy and high thermal conductivity.

volumetric enthalpy  /  paraffin  /  ene carbon composite material  /  liquid metal  /  equivalent specific heat capacity  /  numerical simulation
谭公礼, 顾林卫, 翟娟, 朱学凯, 戴志强. 电子设备相变材料储能结构热性能. 科学技术与工程, 2025 , 25 (13) : 5415 -5421 . DOI: 10.12404/j.issn.1671-1815.2405066
Gong-li TAN, Lin-wei GU, Juan ZHAI, Xue-kai ZHU, Zhi-qiang DAI. Thermal Performance of Phase Change Material Energy Storage Structures for Electronic Devices[J]. Science Technology and Engineering, 2025 , 25 (13) : 5415 -5421 . DOI: 10.12404/j.issn.1671-1815.2405066
正文
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航天、航空等电子设备产生的热量通常通过热传导转移至外壳,然后再通过对流换热转移至外界空气。然而由于高空的空气稀薄或者热防护、隔离等原因,难以将热量直接传递至外部环境[1-2]。随着电子芯片小型化、集成化发展,伴随着芯片功率密度和热量的显著增加,如何在外部绝热条件下有效散热,保证电子器件稳定可靠运行,对热控制提出了日益严峻的考验[3]。外部散热条件不佳,难以对外直接散热,只能通过设备内部进行热控,在设备工作时间内,吸纳电子器件工作时产生的热量。因设备本体材料吸纳能力有限,可以采用相变材料进行储能结构设计,利用相变材料的巨大潜热值,吸收电子设备产生的热量[4-5]。
相变材料(phase change material,PCM)较早已开始应用于电子器件散热,近年来,相变材料的种类越来越多,基于温度和体积限制,相变材料向着高导热系数、高体积焓值的方向发展。高导热系数可加快热量的传导,使得相变材料利用更充分,温度均匀性更好。高体积焓值可以节约相变材料的体积,在同等体积下能储存更多热量。相变材料应用于电子设备散热需结合电子设备组成、热耗等进行相变材料与高导热金属材料结构一体化设计。刘家良等[6]针对智能手机中高功率5G芯片及大容量锂离子电池的散热问题,提出用石蜡/石墨配比作为5G芯片及锂离子电池的相变冷却介质。甄华龙等[7]基于变密度法的拓扑优化方法对二维相变储能单元的翅片进行优化设计,并采用数值模拟方法分析了相变储能单元的蓄放热特性。殷健宝等[8]为强化翅片管式储能系统的传热速率和相变材料域的温度均匀性,采用月桂酸为相变材料,对比研究了拓扑优化的强化导热效果和温度均匀性。Shanmugasundaram等[9]在空载激光武器热管理平台引入相变材料部件,最高可以节约36%的系统质量。Yu等[10]建立了树状分形翅片,通过数值模拟对强化结构进行了优化,优化结构相比同体积直翅总融化时间减少26.7%。王坤等[11]针对基于相变材料的防护罩,构建了数值模型,研究了工作环境和初始温度对防护罩工作性能的作用规律。
合理选择相变材料种类及体积,进行相变材料储能结构设计,并通过数值模拟能够快速评估相变储能结构的热符合性。由于相变过程十分复杂,包括聚集状态的变化和比热等特性的变化,相变过程目前暂无十分准确的模型,因此难以准确地对相变过程进行模拟。于静梅等[12]运用数值方法研究插入翅片后相变材料熔化效果,并对比增加翅片数量与改变翅片插入位置后对PCM熔化速率的影响。邹勇等[13]基于FLUENT软件的凝固/熔化模型,以石蜡为相变材料对其熔化过程进行仿真,分析了自然对流、石蜡厚度以及壁温对石蜡相变换热过程的影响。国内外对相变过程仿真研究较多,但是由于
相变过程的复杂性,难以准确模拟,仿真结果与实验结果对比误差在10 ℃左右[14-17]。
此外,相变材料种类繁多,物性参数及热性能均存在较大差异,目前国内外较多学者更多的是集中在对相变材料的制备及物性参数进行研究[18-22],对相变储能结构的优化设计以及热性能、散热效果评价缺乏有效的、系统的研究手段。现提供一种基于等效比热容的相变材料储能结构热分析方法,包括:结构热分析流程、等效比热容及数值模拟计算方法,并结合实例应用该方法对几种相变储能结构进行热性能分析。
1 相变储能结构热分析方法
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1.1 热分析流程
图1所示为相变储能结构热分析计算流程,根据设计输入对相变储能结构进行设计和仿真验证、评估。首先,基于弹载电子设备结构体积、质量、外界换热条件、热功率、工作时间等多参数约束条件,运用相变储能材料等效比热容计算的方法,以尺寸、质量、结构、相变材料种类为参数进行多目标优化, 形成相变热沉材料质量、体积、温度分布等多参数的最佳组合,得到满足散热要求的设备结构型式。具体步骤如下。
步骤1 相变储能材料等效比热容计算方法。相变材料吸收热量的过程是一个复杂的相变过程,结合发热功率、工作时间、相变材料物性参数等参数,假定初始相变材料体积为V1,密度为ρ,对应质量为m1,根据能量守恒计算相变材料的最终温度T2和相变材料的等效比热容。
步骤2 相变储能结构瞬态热仿真计算方法。根据计算得到的相变材料的等效比热容,进行相变储能结构瞬态热仿真计算,得到设备结构温度分布,确定相变材料的平均温度T'2。
步骤3 温度反馈修正。对比步骤2计算结果T'2与步骤1计算结果T2,若|T'2-T2|≥2则重复步骤1,重新设定V1进行计算等效比热容以及瞬态热仿真计算。
步骤4 校核仿真计算结果温度分布,是否满足设备工作温度要求。
1.2 相变材料等效比热容计算方法
1.2.1 相变材料体积、质量估算
由于电子设备依靠自身比热容吸收的热量与相变材料潜热相比小很多,在估算相变材料质量时,可近似假设设备发热量最终被相变材料吸收储存,根据能量守恒,可近似估算相变材料质量m1,体积V1,计算公式如下。
m1= P τ γ
V1= P τ ρ γ
式中:m1为相变材料质量;ρ为密度;γ为单位质量相变潜热;P为发热功率;τ为工作时间。体积V1与相变材料的属性ργ(单位体积焓值)有关,ργ越大,体积越小。
1.2.2 等效比热容计算
设备外部绝热,设备发热量均被储能结构体吸收,根据能量守恒定律,能量转换公式为
Pτ=C1m1ΔT1+C2m1ΔT2+m1γ+C3m2ΔT3+C4m3ΔT4
式(3)中:P为发热量,W;τ为工作时间,s;m1为相变材料质量, kg;m2为设备框架结构体质量,kg;m3为电子器件质量,kg;ΔT1为相变材料相变温度与起始状态温度差,℃;ΔT2为相变材料最终温度与相变温度温度差,℃;ΔT3为铝合金结构体温升,℃;ΔT4为电子器件温升,℃;C1为相变材料相变前比热容,J/(kg·K);C2为相变材料相变后比热容,J/(kg·K);C3为设备框架结构体材料比热容,J/(kg·K);C4为电子器件比热容,J/(kg·K);γ为相变潜热,J/g。
由于电子器件比热容很小,且质量较小,因此热容可忽略,式(3)可简化为
Pτ=C1m1ΔT1+C2m1ΔT2+m1γ+C3m2ΔT3
式(4)中:
ΔT1=T0-T1
ΔT2=T2-T0
ΔT3=T3-T1
式中:T0为相变材料相变温度,℃;T1为设备起始温度,℃;T2为相变材料最终温度,℃;T3为框架结构体最终温度,℃。由于相变材料的导热性能较差,进行相变材料与框架材料一体化设计,相变材料镶嵌在设备结构体支架中以提高导热效率,因此可近似认为T3=T2。
Pτ=C1m1(T0-T1)+C2m1(T2-T1)+m1γ+C3m2(T2-T1)
通过式(8)可以计算得到相变材料最终温度T2。
根据器件工作温度范围要求,发热功率及工作时间,根据选定的相变材料物性参数C1、C2、γ和最终温度T2,建立等效比热容计算公式为
C'(T2-T1)=C1(T0-T1)+C2(T2-T1)+γ
式(9)中:C'为相变材料等效比热容,J/(kg·K)。
运用式(9)可以计算得到相变材料的等效比热容。
1.3 瞬态数值模拟计算方法
根据等效比热容C',相变材料质量m1,铝合金结构体质量m2,设备结构模型以及热功率分布进行瞬态热仿真计算。
采用FLOEFD流体仿真软件进行瞬态仿真[23],图2所示为某电子设备相变储能结构瞬态热仿真计算参数设置界面。将相变材料等效为固定比热容的单相材料,设置相变材料的物性参数,包括相变材料的等效比热容,采用绝热壁面,设定热源热功率值、起始温度和工作时间及时间步长。
根据热仿真计算结果,对设备结构温度分布进行分析,得到相变材料平均温度T'2。
2 相变储能结构热性能分析
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2.1 相变材料参数
石蜡类相变储能材料具有较大的相变潜热,但是石蜡热导率低,热传导能力很差,在实际运用中往往只有靠近热源的部分相变材料能够发生相变吸热,温度均匀性差,相变材料利用率十分低下,导致热源温度高[24]。为了解决石蜡导热系数低的问题,一方面采用肋片式相变储能结构加强热传导[25],另一方面在石蜡中添加热传导系数较高的粉末颗粒,提高石蜡导热系数。
烯炭类相变复合材料以孔隙率为20%的烯炭材料为骨架,50 ℃相变石蜡为填充材料,通过物理吸附相互结合,该相变复合材料具有很高的结构稳定性以及导热率,相变潜热略低于石蜡[26]。但是由于密度较低,在体积限制严苛的使用场合,相变材料质量有限,相变材料储能量有限。
液态金属相变材料主要利用低熔点金属固液相变过程来储存大量潜热热量,液体金属热导率是石蜡等传统相变材料的10倍以上,相变均温性好。液态金属密度大,单位体积热焓高,适用于紧凑型、微小型散热空间。
如表1所示为3种典型的相变材料参数。
2.2 等效比热容计算结果
选取一种小型电子设备,结构紧凑,对体积敏感度更高,所能填充相变材料体积有限。如图3所示为该电子设备相变储能结构示意图,印制电路板(printed circuit board,PCB)上发热芯片通过导热衬垫与散热壳体(设备框架结构)接触,散热壳体中封装有相变材料,相变材料体积有限。热源散热路径如图4所示,芯片产生的热量通过导热衬垫、壳体传导至相变储能材料,最终被相变材料吸收存储。
针对表1中3种相变材料,取工作时间为10 min,发热功率为100 W,采用1.2节等效比热容计算方法,进行相变材料质量参数以及等效比热容计算,计算结果如表2所示。
表2中ργ为相变材料单位体积焓值,可表征相变材料的储能能力,体积焓值越高,所需相变材料的体积就越小。从计算结果可看出,液态金属相变材料的体积焓值最大,所需体积最小。石蜡相变材料体积焓值最小,体积占用最大。烯炭相变复合材料体积居于两者之间。
3 数值模拟与分析
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3.1 数值模拟结果
小型电子设备相变储能结构仿真模型如图5所示,采用了肋片结构强化换热,设备外表面绝热,芯片产生的热量最终储存在相变材料中[27-29]。
根据表2相变材料等效比热容计算结果中3种相变材料的等效比热容,运用1.3节瞬态数值模拟计算方法,分别对3种相变材料的储能结构进行瞬态数值模拟,设置起始温度为40 ℃,工作时间为600 s,得到3种相变储能结构的温度分布如图6所示。
如图6(a)所示,石蜡相变储能结构工作600 s后,热源最高温度达到115 ℃,但是由于石蜡导热系数低,远离热源位置的相变材料温度只有67 ℃,传热温差大,相变材料没有充分利用。
如图6(b)所示,烯炭复合材料相变储能结构工作600 s后,热源最高温度达到83.3 ℃,远离热源的相变材料温度73 ℃,相变材料温度较均匀。
如图6(c)所示,液态金属相变储能结构工作600 s后,热源最高温度只有76 ℃,远离热源的相变材料温度67 ℃,相变材料温度均匀性最好。
3种相变材料储能结构芯片热源温度变化如图7所示,可知石蜡相变储能结构温升比较快,烯炭复合材料、液态金属相变储能结构由于导热系数较高,吸收热量较充分,因此温升速度较缓慢。
3.2 储能结构热性能对比与评价分析
对于电子器件散热,热源最高温度控制以及热源间均温性大小是表征散热效果的两个重要指标[30-31]。对于体积限制严苛的相变材料,最好的散热效果是以最小的体积占比取得最小的热源温升以及更好的均温性。
根据数值模拟结果得到相变材料热性能对比数据如表3相变材料热性能所示。
从表3相变材料热性能中数据结果可知,石蜡、复合相变材料、液体金属3种相变材料结构热源温升分别为:75、36、33 ℃,均温性分布为7.2、1、0.7 ℃。液体金属储能结构以最小的体积获得最小的温升及最好的均温性,散热效果最好。
4 结论
收起
基于电子设备体积、质量、换热环境、热功率、工作时间等约束条件,提出一种基于温度反馈的等效比热容相变储能结构热分析计算方法,并结合实例对石蜡、烯炭复合材料和液态金属3种相变材料储能结构散热效果进行评估,得出以下结论。
(1)相变材料在一定时间内能显著控制温升,满足小体积、外部绝热环境电子设备散热要求。
(2)相变材料体积焓值越高,表明单位体积相变材料储能能力越高,储存同等热能所需相变体积的体积越小。
(3)相变材料的导热系数对储能结构导热性能影响巨大,导热系数越高,温度均匀性越好。
(4)对于体积受制严重、体积敏感度高的相变储能结构场合,采用液态金属可有效节约体积,并能取得更好的热性能:温升小,均温性好。
基金
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  • 国家自然科学基金重点项目(11832012)
文献
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2025年第25卷第13期
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doi: 10.12404/j.issn.1671-1815.2405066
  • 接收时间：2024-07-06
  • 首发时间：2025-07-09
  • 出版时间：2025-05-08
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  • 收稿日期：2024-07-06
  • 修回日期：2025-02-08
基金
国家自然科学基金重点项目(11832012)
作者信息
    1 中国船舶集团公司有限公司第七二三研究所, 扬州 225101
    2 扬州大学广陵学院, 扬州 225000
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2种不同金属材料的力学参数
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Number of
species		 占总种数比例
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total species (%)		 属
Genus		 种数
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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