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Article(id=1288421785544667678, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1288421735473058437, articleNumber=null, orderNo=null, doi=10.3981/j.issn.1000-7857.2025.08.00025, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1754496000000, receivedDateStr=2025-08-07, revisedDate=1758556800000, revisedDateStr=2025-09-23, acceptedDate=null, acceptedDateStr=null, onlineDate=1785113291392, onlineDateStr=2026-07-27, pubDate=1783872000000, pubDateStr=2026-07-13, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1785113291392, onlineIssueDateStr=2026-07-27, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1785113291392, creator=13701087609, updateTime=1785113291392, updator=13701087609, issue=Issue{id=1288421735473058437, tenantId=1146029695717560320, journalId=1146031591421210625, year='2026', volume='44', issue='13', pageStart='1', pageEnd='188', issueExtLink='null', onlineDate='null', pubDate='1783872000000', pubDateStr='2026-07-13', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=1, specialIssue=null, createTime=1785113279455, creator='13701087609', updateTime=1785113348006, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1288422023114240128, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1288421735473058437, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1288422023118434433, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1288421735473058437, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=170, endPage=183, ext={EN=ArticleExt(id=1288421785783743007, articleId=1288421785544667678, tenantId=1146029695717560320, journalId=1146031591421210625, language=EN, title=NIST's experience and implications in promoting semiconductor industry development, columnId=1150494643415773491, journalTitle=Science & Technology Review, columnName=Policy Forum, runingTitle=null, highlight=null, articleAbstract=

Semiconductor technology is crucial to national economic security and defense capabilities. Facing increasingly fierce global competition, the U.S. government has enacted multiple legislative acts since 2021 with unprecedented intensity to support domestic semiconductor industry development, aiming to restore America's global leadership in semiconductors. The National Institute of Standards and Technology (NIST), serving as the United States' national metrology institute while also functioning as a comprehensive national−level technical research institution, has been designated as the primary implementing agency for the CHIPS and Science Act of 2022 (referred to as the CHIPS Act), playing a critical role in the Act's implementation. This paper systematically analyzes NIST's organizational transformation, project deployment, funding investment, and implementation effectiveness over the three years since the CHIPS Act's implementation, examining NIST's functional expansion from a provider of national measurement standards and reference materials to a core coordinator for semiconductor industry revitalization. The research finds that NIST has fully leveraged its technical advantages in the semiconductor field and industry chain integration capabilities, successfully constructing a comprehensive semiconductor industry support system through systematic planning and coordination of key innovation elements including funding, projects, platforms, and talent. This system encompasses regional innovation ecosystem development, commercialization pathway expansion, and high−level talent cultivation. Through comparative analysis of the U.S. government's innovative practices in supporting NIST, this study reveals the pivotal role of national metrology institutes in modern industrial innovation systems, providing important implications for China's development in related fields.

, authors=Bo HU, Yifan HUANG, Xuan XU, Kenan GONG*, authorsList=Bo HU, Yifan HUANG, Xuan XU, Kenan GONG, authorCompany=null, correspAuthors=Kenan GONG, authorNote=null, correspAuthorsNote=null, copyrightStatement=All rights reserved. Unauthorized reproduction is prohibited., copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1288421789164352036, articleId=1288421785544667678, tenantId=1146029695717560320, journalId=1146031591421210625, language=CN, title=美国国家标准与技术研究院推动半导体产业发展的经验及启示, columnId=1150494643549991220, journalTitle=科技导报, columnName=政策建议, runingTitle=null, highlight=null, articleAbstract=

半导体技术对国家经济安全和国防实力至关重要。面对日益激烈的全球竞争，美国政府自2021年以来接连出台多项法案，以前所未有的力度支持国内半导体产业发展，力图重振美国半导体产业的全球领先地位。美国国家标准与技术研究院（National Institute of Standards and Technology，NIST）作为美国的国家计量院，同时承担着国家级技术研究机构的职能，被指定为《2022年芯片与科学法》（CHIPS and Science Act of 2022）的主要执行机构，在法案实施过程中发挥了关键作用。通过分析NIST在法案实施3年来的组织转型、项目布局、资金投入与实施成效，系统梳理了NIST从国家计量基准和标准物质提供者向半导体产业复兴核心协调者的职能拓展过程。研究发现，NIST充分利用其在半导体领域的技术优势和产业链整合能力，通过系统性规划和协调资金、项目、平台、人才等关键创新要素，成功构建了涵盖区域创新生态建设、转化路径拓展及高水平人才培养的全链条半导体产业支持体系。通过对比分析美国政府对NIST支持模式的创新实践，揭示了国家计量院在现代产业创新体系中的枢纽作用，为中国相关领域发展提供了重要启示。

, authors=胡泊, 黄怡璠, 徐玄, 宫轲楠*, authorsList=胡泊, 黄怡璠, 徐玄, 宫轲楠, authorCompany=null, correspAuthors=宫轲楠, authorNote=

胡泊，工程师，研究方向为质量基础设施，电子信箱：

, correspAuthorsNote=
宫轲楠（通信作者），副研究员，研究方向为质量基础设施理论、技术经济评价，电子信箱：
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胡泊，工程师，研究方向为质量基础设施，电子信箱：

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胡泊，工程师，研究方向为质量基础设施，电子信箱：

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authorId=1288421790103876149, language=EN, stringName=Kenan GONG, firstName=Kenan, middleName=null, lastName=GONG, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=*, address=null, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1288421790275842615, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, authorId=1288421790103876149, language=CN, stringName=宫轲楠, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=*, address=null, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=null)], keywords=[Keyword(id=1288421790384894520, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, orderNo=1, keyword=semiconductor industry), Keyword(id=1288421790460391993, tenantId=1146029695717560320, 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language=CN, orderNo=2, keyword=2022年芯片与科学法), Keyword(id=1288421791030817343, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, orderNo=3, keyword=美国国家标准与技术研究院（NIST）), Keyword(id=1288421791114703424, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, orderNo=4, keyword=战略科技力量), Keyword(id=1288421791206978113, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, orderNo=5, keyword=产业政策)], refs=[Reference(id=1288421794478535248, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=2021, volume=168, issue=null, pageStart=108408, pageEnd=null, url=null, language=null, rfNumber=[1], rfOrder=0, authorNames=Brown R J C, journalName=Measurement, refType=null, unstructuredReference=Brown R J C. Measuring measurement–What is metrology and why does it matter[J]. Measurement, 2021, 168: 108408., articleTitle=Measuring measurement–What is metrology and why does it matter, refAbstract=null), Reference(id=1288421794554032721, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=2025, volume=36, issue=7, pageStart=071001, pageEnd=null, url=null, language=null, rfNumber=[2], rfOrder=1, authorNames=Brown R, Yacoot A, journalName=Measurement Science and Technology, refType=null, unstructuredReference=Brown R, Yacoot A. Reflecting on the role of National Metrology Institutes on the occasion of the 125th anniversary of the National Physical Laboratory[J]. Measurement Science and Technology, 2025, 36(7): 071001., articleTitle=Reflecting on the role of National Metrology Institutes on the occasion of the 125th anniversary of the National Physical Laboratory, refAbstract=null), Reference(id=1288421794616947282, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[3], rfOrder=2, authorNames=null, journalName=null, refType=null, unstructuredReference=Wallard A J. The organization of metrology[C]//Proceedings of the International School of Physics "Enrico Fermi". Bologna: Società Italiana Di Fisica, 2007: 21−33., articleTitle=null, refAbstract=null), Reference(id=1288421794684056147, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[4], rfOrder=3, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. What is a National Measurement Institute[EB/OL]. (2025−01−07) [2025−09−04]. https://www.nist.gov/nmi., articleTitle=null, refAbstract=null), Reference(id=1288421794746970708, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[5], rfOrder=4, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Strategic opportunities for U. S. semiconductor manufacturing: Facilitating U. S. leadership and competitiveness through advancements in measurements and standards[R]. Gaithersburg, MD: NIST, 2022., articleTitle=null, refAbstract=null), Reference(id=1288421794805690965, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[6], rfOrder=5, authorNames=null, journalName=null, refType=null, unstructuredReference=U.S. Congress. CHIPS and Science Act of 2022[A]. Washington, DC: U.S. Government Publishing Office, 2022., articleTitle=null, refAbstract=null), Reference(id=1288421794881188438, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[7], rfOrder=6, authorNames=null, journalName=null, refType=null, unstructuredReference=U.S. Congress. William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021[A]. Washington, DC: U.S. Government Publishing Office, 2021., articleTitle=null, refAbstract=null), Reference(id=1288421794948297303, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[8], rfOrder=7, authorNames=null, journalName=null, refType=null, unstructuredReference=Semiconductor Industry Association. 2024 State of the U. S. semiconductor industry[R]. Washington, DC: SIA, 2024., articleTitle=null, refAbstract=null), Reference(id=1288421795011211864, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[9], rfOrder=8, authorNames=null, journalName=null, refType=null, unstructuredReference=Varas A, Varadarajan R, Goodrich J, et al. Strengthening the global semiconductor value chain in an uncertain era[R]. Boston, MA: BCG, SIA, 2021., articleTitle=null, refAbstract=null), Reference(id=1288421795074126425, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[10], rfOrder=9, authorNames=null, journalName=null, refType=null, unstructuredReference=Sutter K M, Blevins E G, Grossman A B. Semiconductors and the CHIPS act: The global context: R47558[R]. Washington, DC: Congressional Research Service, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421795137040986, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[11], rfOrder=10, authorNames=null, journalName=null, refType=null, unstructuredReference=U.S. Department of Commerce. CHIPS Incentives Program: Facilities for semiconductor materials and manufacturing equipment[A]. Washington, DC: U.S. Department of Commerce, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421795199955547, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[12], rfOrder=11, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Funding updates[EB/OL]. (2023−12−08) [2024−05−16]. https://www.nist.gov/chips/funding-updates., articleTitle=null, refAbstract=null), Reference(id=1288421795267064412, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[13], rfOrder=12, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. CHIPS incentives funding opportunities[EB/OL]. (2023−09−28) [2024−05−13]. https://www.nist.gov/chips/chips-incentives-funding-opportunities., articleTitle=null, refAbstract=null), Reference(id=1288421795329978973, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[14], rfOrder=13, authorNames=null, journalName=null, refType=null, unstructuredReference=National Governors Association. CHIPS and Science Act: Implementation resources[EB/OL]. (2024−12−13) [2025−08−05]. https://www.nga.org/chips-resources/., articleTitle=null, refAbstract=null), Reference(id=1288421795401282142, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[15], rfOrder=14, authorNames=null, journalName=null, refType=null, unstructuredReference=Department of Commerce. A strategy for the CHIPS for America Fund[R]. Washington, DC: DoC, 2022., articleTitle=null, refAbstract=null), Reference(id=1288421795476779615, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[16], rfOrder=15, authorNames=null, journalName=null, refType=null, unstructuredReference=Congressional Research Service. Frequently asked questions: CHIPS Act of 2022 provisions and implementation: R47523[R]. Washington, DC: CRS, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421795556471392, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[17], rfOrder=16, authorNames=null, journalName=null, refType=null, unstructuredReference=The White House. Fact sheet: Two years after the CHIPS and Science Act, Biden-Harris administration celebrates historic achievements in bringing semiconductor supply chains home, creating jobs, supporting innovation, and protecting national security[EB/OL]. (2024−08−09) [2025−08−05]. https://bidenwhitehouse.archives.gov/briefing-room/statements-releases/2024/08/09/fact-sheet-two-years-after-the-chips-and-science-act-biden-harris-administration-celebrates-historic-achievements-in-bringing-semiconductor-supply-chains-home-creating-jobs-supporting-inn/., articleTitle=null, refAbstract=null), Reference(id=1288421795619385953, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[18], rfOrder=17, authorNames=null, journalName=null, refType=null, unstructuredReference=Committee for a Responsible Federal Budget. CBO estimates "Chips-Plus" bill would cost $79 billion[EB/OL]. (2022−07−22) [2025−08−05]. https://www.crfb.org/blogs/cbo-estimates-chips-plus-bill-would-cost-79-billion., articleTitle=null, refAbstract=null), Reference(id=1288421795682300514, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[19], rfOrder=18, authorNames=null, journalName=null, refType=null, unstructuredReference=Semiconductor Industry Association. America's chip resurgence: Over $630 billion in semiconductor supply chain investments[EB/OL]. (2025−07−28) [2025−08−05]. https://www.semiconductors.org/chip-supply-chain-investments/., articleTitle=null, refAbstract=null), Reference(id=1288421795761992291, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[20], rfOrder=19, authorNames=null, journalName=null, refType=null, unstructuredReference=The White House. Fact sheet: President Biden announces up to $8.5 billion preliminary agreement with Intel under the CHIPS & Science Act[EB/OL]. (2024−03−20) [2025−08−05]. https://bidenwhitehouse.archives.gov/briefing-room/statements-releases/2024/03/20/fact-sheet-president-biden-announces-up-to-8-5-billion-preliminary-agreement-with-intel-under-the-chips-science-act/., articleTitle=null, refAbstract=null), Reference(id=1288421795845878372, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[21], rfOrder=20, authorNames=null, journalName=null, refType=null, unstructuredReference=TSMC. TSMC Arizona and U. S. Department of Commerce announce up to US$6.6 billion in proposed CHIPS Act direct funding, the company plans third leading-edge fab in Phoenix [EB/OL]. (2024−04−08) [2025−08−05]. https://www.design-reuse.com/news/15919-tsmc-arizona-and-u-s-department-of-commerce-announce-up-to-us-6-6-billion-in-proposed-chips-act-direct-funding-the-company-plans-third-leading-edge-fab-in-phoenix., articleTitle=null, refAbstract=null), Reference(id=1288421795912987237, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[22], rfOrder=21, authorNames=null, journalName=null, refType=null, unstructuredReference=GlobalFoundries. GlobalFoundries and Biden-Harris administration announce CHIPS and Science Act funding for essential chip manufacturing[EB/OL]. (2024−02−19) [2025−08−05]. https://gf.com/gf-press-release/globalfoundries-and-biden-harris-administration-announce-chips-and-science-act-funding-for-essential-chip-manufacturing/., articleTitle=null, refAbstract=null), Reference(id=1288421795984290406, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[23], rfOrder=22, authorNames=null, journalName=null, refType=null, unstructuredReference=Varadarajan R, Koch−Weser I, Richard C, et al. Emerging resilience in the semiconductor supply chain[R]. Boston, MA: BCG, SIA, 2024., articleTitle=null, refAbstract=null), Reference(id=1288421796063982183, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[24], rfOrder=23, authorNames=null, journalName=null, refType=null, unstructuredReference=Natcast. National Semiconductor Technology Center strategic plan FY 2025−2027[R]. Portola Valley: Natcast, 2025., articleTitle=null, refAbstract=null), Reference(id=1288421796147868264, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[25], rfOrder=24, authorNames=null, journalName=null, refType=null, unstructuredReference=CHIPS Research and Development Office. A vision and strategy for the National Semiconductor Technology Center[R]. Gaithersburg, MD: CHIPS Research and Development Office, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421796311446121, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[26], rfOrder=25, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Building a Metrology Exchange to Innovate in Semiconductors (METIS): A vision for the CHIPS Metrology Program Data Exchange: NIST CHIPS 1000−2 ipd[R]. Gaithersburg, MD: NIST, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421797997556332, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[27], rfOrder=26, authorNames=null, journalName=null, refType=null, unstructuredReference=CHIPS Research and Development Office. Metrology gaps in the semiconductor ecosystem: First steps toward establishing the CHIPS R&D Metrology Program[R]. Gaithersburg, MD: CHIPS Research and Development Office, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421798094025325, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[28], rfOrder=27, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. U. S. Department of Commerce announces $1.4 billion in final awards to support the next generation of U. S. semiconductor advanced packaging[EB/OL]. (2025−01−16) [2025−08−06]. https://www.nist.gov/news-events/news/2025/01/us-department-commerce-announces-14-billion-final-awards-support-next., articleTitle=null, refAbstract=null), Reference(id=1288421798173717102, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[29], rfOrder=28, authorNames=null, journalName=null, refType=null, unstructuredReference=Wagner M, Nuland V, Neville G, et al. Trump administration issues Executive Orders that seek to shape CHIPS Program and promote domestic mineral production[EB/OL]. (2025−04−03) [2025−08−06]. https://www.insidegovernmentcontracts.com/2025/04/trump-administration-issues-executive-orders-that-seek-to-shape-chips-program-and-promote-domestic-mineral-production/., articleTitle=null, refAbstract=null), Reference(id=1288421798328906351, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[30], rfOrder=29, authorNames=null, journalName=null, refType=null, unstructuredReference=The White House. Establishing the United States investment accelerator[EB/OL]. (2025−03−31) [2025−08−06]. https://www.whitehouse.gov/presidential-actions/2025/03/establishing-the-united-states-investment-accelerator/., articleTitle=null, refAbstract=null), Reference(id=1288421798387626608, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[31], rfOrder=30, authorNames=null, journalName=null, refType=null, unstructuredReference=Stone M, Potkin F, Lee W Y, et al. Exclusive: Trump prepares to change US CHIPS Act conditions, sources say[EB/OL]. (2025−02−13) [2025−08−06]. https://www.reuters.com/technology/trump-prepares-change-us-chips-act-conditions-sources-say-2025-02-13/., articleTitle=null, refAbstract=null), Reference(id=1288421798442152561, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[32], rfOrder=31, authorNames=null, journalName=null, refType=null, unstructuredReference=Kluge J. Where the CHIPS fell: An analysis of the CHIPS Act's early returns[EB/OL]. (2025−04−04) [2025−08−06]. https://sites.lsa.umich.edu/mje/2025/04/04/where-the-chips-fell-an-analysis-of-the-chips-acts-early-returns/., articleTitle=null, refAbstract=null), Reference(id=1288421798505067122, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[33], rfOrder=32, authorNames=null, journalName=null, refType=null, unstructuredReference=The Straits Times. Trump renegotiating Biden-era Chips Act grants: US Commerce Secretary Lutnick[EB/OL]. (2025−06−05) [2025−08−06]. https://www.straitstimes.com/world/united-states/trump-renegotiating-biden-era-chips-act-grants-lutnick-says., articleTitle=null, refAbstract=null), Reference(id=1288421798580564595, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[34], rfOrder=33, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Frequently asked questions: Preventing the improper use of CHIPS Act funding[EB/OL]. (2023−12−28) [2025−08−06]. https://www.nist.gov/chips/frequently-asked-questions-preventing-improper-use-chips-act-funding., articleTitle=null, refAbstract=null), Reference(id=1288421798643479156, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[35], rfOrder=34, authorNames=null, journalName=null, refType=null, unstructuredReference=Department of Commerce. Biden-Harris administration announces final national security guardrails for CHIPS for America Incentives Program[EB/OL]. (2023−09−22)[2025−08−06]. https://www.commerce.gov/news/press-releases/2023/09/biden-harris-administration-announces-final-national-security., articleTitle=null, refAbstract=null), Reference(id=1288421798706393717, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[36], rfOrder=35, authorNames=null, journalName=null, refType=null, unstructuredReference=Henshall D. Request for information: Manufacturing USA Semiconductor Institutes[R]. Morrisville, NC: SRC Manufacturing Consortium, 2022., articleTitle=null, refAbstract=null), Reference(id=1288421798769308278, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[37], rfOrder=36, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. CHIPS R&D Program standards summit summary report[R]. Gaithersburg, MD: NIST, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421798840611447, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[38], rfOrder=37, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Vision for success: Commercial fabrication facilities[R]. Gaithersburg, MD: NIST, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421798911914616, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[39], rfOrder=38, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. AAAS business meeting: when the government makes big bets on science and technology: The CHIPS Act[EB/OL]. (2023−03−04) [2025−08−06]. https://www.nist.gov/speech-testimony/aaas-business-meeting-when-government-makes-big-bets-science-and-technology-chips., articleTitle=null, refAbstract=null), Reference(id=1288421798991606393, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[40], rfOrder=39, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. CHIPS for America announces up to $300 million in funding to boost U. S. semiconductor packaging[EB/OL]. (2024−11−21) [2025−08−06]. https://www.nist.gov/news-events/news/2024/11/chips-america-announces-300-million-funding-boost-us-semiconductor., articleTitle=null, refAbstract=null), Reference(id=1288421799062909562, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[41], rfOrder=40, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. The CHIPS Program Office vision for success: Two years later[R]. Gaithersburg, MD: NIST, 2024., articleTitle=null, refAbstract=null), Reference(id=1288421799117435515, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[42], rfOrder=41, authorNames=null, journalName=null, refType=null, unstructuredReference=Semiconductor Industry Association. America projected to triple semiconductor manufacturing capacity by 2032, the largest rate of growth in the world[EB/OL]. (2024−05−08) [2024−05−17]. https://www.semiconductors.org/america-projected-to-triple-semiconductor-manufacturing-capacity-by-2032-the-largest-rate-of-growth-in-the-world/., articleTitle=null, refAbstract=null), Reference(id=1288421799180350076, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[43], rfOrder=42, authorNames=null, journalName=null, refType=null, unstructuredReference=MITRE Engenuity. American innovation, American growth: A vision for the National Semiconductor Technology Center[R]. McLean, VA: MITRE Engenuity, 2021., articleTitle=null, refAbstract=null), Reference(id=1288421799260041853, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[44], rfOrder=43, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. National Advanced Packaging Manufacturing Program[EB/OL]. (2024−02−01) [2025−08−06]. https://www.nist.gov/chips/research-development-programs/national-advanced-packaging-manufacturing-program., articleTitle=null, refAbstract=null), Reference(id=1288421799327150718, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[45], rfOrder=44, authorNames=null, journalName=null, refType=null, unstructuredReference=CHIPS Research and Development Office. The vision for the CHIPS for America National Advanced Packaging Manufacturing Program[R]. Gaithersburg, MD: CHIPS Research and Development Office, 2023., articleTitle=null, refAbstract=null), Reference(id=1288421799406842495, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[46], rfOrder=45, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Notice of funding opportunity: CHIPS Manufacturing USA Institute[EB/OL]. (2024−05−04) [2025−08−06]. https://www.nist.gov/chips/r%2526d-funding-opportunities/notice-funding-opportunity-chips-manufacturing-usa-institute., articleTitle=null, refAbstract=null), Reference(id=1288421799469757056, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[47], rfOrder=46, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Biden-Harris administration awards Semiconductor Research Corporation Manufacturing Consortium Corporation $285M for new CHIPS Manufacturing USA Institute for Digital Twins, headquartered in North Carolina[EB/OL]. (2025−01−03) [2025−08−06]. https://www.nist.gov/news-events/news/2025/01/biden-harris-administration-awards-semiconductor-research-corporation., articleTitle=null, refAbstract=null), Reference(id=1288421799545254529, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[48], rfOrder=47, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Metrology program[EB/OL]. (2024−01−31) [2024−05−15]. https://www.nist.gov/chips/research-development-programs/metrology-program., articleTitle=null, refAbstract=null), Reference(id=1288421799608169090, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[49], rfOrder=48, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. NIST SRM 3461 standard reference cantilevers[EB/OL]. (2023−04−14) [2025−08−06]. https://www.nist.gov/mml/mmsd/nanomechanical-properties-group/nist-srm-3461-standard-reference-cantilevers., articleTitle=null, refAbstract=null), Reference(id=1288421799687860867, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[50], rfOrder=49, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. Nanometer-scale planar reference materials[EB/OL]. (2024−06−01) [2025−08−06]. https://www.nist.gov/programs-projects/nanometer-scale-planar-reference-materials., articleTitle=null, refAbstract=null), Reference(id=1288421799754969732, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[51], rfOrder=50, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. METIS[EB/OL]. (2023−12−14) [2025−08−06]. https://www.nist.gov/programs-projects/metis., articleTitle=null, refAbstract=null), Reference(id=1288421799830467205, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[52], rfOrder=51, authorNames=null, journalName=null, refType=null, unstructuredReference=National Institute of Standards and Technology. CHIPS metrology community[EB/OL]. (2024−08−21) [2025−08−06]. https://www.nist.gov/chips/metrology-community., articleTitle=null, refAbstract=null), Reference(id=1288421799897576070, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[53], rfOrder=52, authorNames=null, journalName=null, refType=null, unstructuredReference=European Commission. European Chips Act[EB/OL]. (2023−09−21) [2025−08−06]. https://commission.europa.eu/strategy-and-policy/priorities-2019-2024/europe-fit-digital-age/european-chips-act_en., articleTitle=null, refAbstract=null), Reference(id=1288421799968879239, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[54], rfOrder=53, authorNames=null, journalName=null, refType=null, unstructuredReference=Nippon. Japan making major investments in its semiconductor industry[EB/OL]. (2024−04−22) [2025−08−06]. https://www.nippon.com/en/japan-data/h01965/., articleTitle=null, refAbstract=null), Reference(id=1288421800040182408, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[55], rfOrder=54, authorNames=null, journalName=null, refType=null, unstructuredReference=Brookings Institution. The renaissance of the Japanese semiconductor industry[EB/OL]. (2024−06−03) [2025−08−06]. https://www.brookings.edu/articles/the-renaissance-of-the-japanese-semiconductor-industry/., articleTitle=null, refAbstract=null), Reference(id=1288421800111485577, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[56], rfOrder=55, authorNames=null, journalName=null, refType=null, unstructuredReference=Sohee Kim. South Korea lays out $470 billion plan to build chipmaking hub[EB/OL]. (2024−01−15) [2025−08−06]. https://www.bloomberg.com/news/articles/2024-01-15/south-korea-lays-out-470-billion-plan-to-build-chipmaking-hub., articleTitle=null, refAbstract=null), Reference(id=1288421800174400138, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[57], rfOrder=56, authorNames=null, journalName=null, refType=null, unstructuredReference=注册资本3440亿!大基金三期来了与前两期有何变化?[EB/OL]. (2024−05−31) [2025−09−10]. https://jrj.wuhan.gov.cn/ztzl_57/xyrd/dcczbsc/202405/t20240531_2410056.shtml., articleTitle=null, refAbstract=null), Reference(id=1288421800249897611, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[58], rfOrder=57, authorNames=null, journalName=null, refType=null, unstructuredReference=Triolo P. The evolution of China's semiconductor industry under U. S. export controls[EB/OL]. (2024−11−20) [2025−09−10]. https://americanaffairsjournal.org/2024/11/the-evolution-of-chinas-semiconductor-industry-under-u-s-export-controls., articleTitle=null, refAbstract=null), Reference(id=1288421800325395084, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[59], rfOrder=58, authorNames=null, journalName=null, refType=null, unstructuredReference=上海市人民政府办公厅关于印发《上海市先进制造业发展“十四五”规划》的通知[EB/OL]. (2021−07−05) [2025−09−03]. https://www.shanghaiinvest.com/cn/viewfile.phpid=16674., articleTitle=null, refAbstract=null), Reference(id=1288421800392503949, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[60], rfOrder=59, authorNames=null, journalName=null, refType=null, unstructuredReference=广州市半导体与集成电路产业发展行动计划(2022—2024年)[EB/OL]. (2022−03−17) [2025−09−04]. https://www.gz.gov.cn/zwgk/ghjh/zxgh/content/post_8188395.html., articleTitle=null, refAbstract=null), Reference(id=1288421800468001422, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[61], rfOrder=60, authorNames=null, journalName=null, refType=null, unstructuredReference=Reuters. India gives green light to chip plants worth $15.2 bln[EB/OL]. (2024−02−29) [2025−08−06]. https://www.reuters.com/technology/india-approves-three-chipmaking-units-worth-152-bln-2024-02-29., articleTitle=null, refAbstract=null), Reference(id=1288421800547693199, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[62], rfOrder=61, authorNames=null, journalName=null, refType=null, unstructuredReference=Yahya F. Role of the Southeast Asia semiconductor industry and the "chips" supply chain[EB/OL]. (2025−03−12) [2025−08−06]. https://moderndiplomacy.eu/2025/03/12/role-of-the-southeast-asia-semiconductor-industry-and-the-chips-supply-chain., articleTitle=null, refAbstract=null), Reference(id=1288421800610607760, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[63], rfOrder=62, authorNames=null, journalName=null, refType=null, unstructuredReference=Federal Register. Implementation of additional export controls: Certain advanced computing and semiconductor manufacturing items; supercomputer and semiconductor end use; entity list modification[EB/OL]. (2022−10−13) [2025−08−06]. https://www.federalregister.gov/documents/2022/10/13/2022-21658/implementation-of-additional-export-controls-certain-advanced-computing-and-semiconductor., articleTitle=null, refAbstract=null)], funds=[Fund(id=1288421794277208654, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, awardId=2022YFF0608105, language=CN, fundingSource=国家重点研发计划项目(2022YFF0608105), fundOrder=null, country=null), Fund(id=1288421794348511823, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, awardId=2019YFF0216805, language=CN, fundingSource=国家重点研发计划项目(2019YFF0216805), fundOrder=null, country=null)], companyList=[AuthorCompany(id=1288421789395038757, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, xref=null, ext=[AuthorCompanyExt(id=1288421789399233062, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, companyId=1288421789395038757, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=National Institute of Metrology, Beijing 100029, China), AuthorCompanyExt(id=1288421789407621671, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, companyId=1288421789395038757, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=中国计量科学研究院，北京 100029)])], figs=[ArticleFig(id=1288421791332807234, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, label=null, caption=null, figureFileSmall=zN9+0J14idlqA8YlmiJjFQ==, figureFileBig=iyDSsrDttlVT7E7fbi2KBQ==, tableContent=null), ArticleFig(id=1288421791416693315, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, label=图1, caption=NDAA法及CHIPS法对美国半导体产业振兴的部署, figureFileSmall=zN9+0J14idlqA8YlmiJjFQ==, figureFileBig=iyDSsrDttlVT7E7fbi2KBQ==, tableContent=null), ArticleFig(id=1288421791764820548, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, label=null, caption=null, figureFileSmall=l3Jcrl1VRBxBIqrr2i+FEw==, figureFileBig=ierHWx5Arsk+eER0xz52iQ==, tableContent=null), ArticleFig(id=1288421791869678149, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, label=图2, caption=NIST协同创新网络, figureFileSmall=l3Jcrl1VRBxBIqrr2i+FEw==, figureFileBig=ierHWx5Arsk+eER0xz52iQ==, tableContent=null), ArticleFig(id=1288421793547399750, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
资金类别总金额/
亿美元		具体分配实施机构主要用途
制造激励
基金		领先工艺制造集群28075%资金　NIST CHIPS项目办公室　最先进逻辑和存储芯片制造
成熟工艺专项20专项资金　汽车芯片等成熟制程
当代工艺制造90剩余资金　当代制程、新技术、供应商
研发投入国家半导体技术中心（NSTC）20专项投入　Natcast（NIST授权运营）　建立统一的国家级半导体研发平台
先进封装制造计划（NAPMP）30专项投入　NIST CHIPS研发办公室　支持先进封装技术、封装基板、材料研发
制造业美国研究所（Manufacturing USA）10分期投入　NIST CHIPS 研发办公室/合作方　推动数字孪生、仿真等先进制造技术平台建设
NIST计量研发计划5NIST实施　NIST实验室　突破芯片材料表征、制程控制、封装测试等关键测量技术
其他研发项目45分散管理　国家科学基金会（NSF）、国家能源部（DOE）等　包括短期劳动力培训、EDA工具、可靠性研究等
专项支撑
基金		国防基金20专项投入　国防部（DOD）　微电子研发、制造与国防人才培养
国际技术安全与创新基金5　国务院（DOS）　国际技术安全与供应链合作
劳动力与教育基金2　NSF　微电子人才培养与教育支持
总计527
), ArticleFig(id=1288421793639674439, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, label=表1, caption=

《2022年芯片与科学法》资金分配

, figureFileSmall=null, figureFileBig=null, tableContent=
资金类别总金额/
亿美元		具体分配实施机构主要用途
制造激励
基金		领先工艺制造集群28075%资金　NIST CHIPS项目办公室　最先进逻辑和存储芯片制造
成熟工艺专项20专项资金　汽车芯片等成熟制程
当代工艺制造90剩余资金　当代制程、新技术、供应商
研发投入国家半导体技术中心（NSTC）20专项投入　Natcast（NIST授权运营）　建立统一的国家级半导体研发平台
先进封装制造计划（NAPMP）30专项投入　NIST CHIPS研发办公室　支持先进封装技术、封装基板、材料研发
制造业美国研究所（Manufacturing USA）10分期投入　NIST CHIPS 研发办公室/合作方　推动数字孪生、仿真等先进制造技术平台建设
NIST计量研发计划5NIST实施　NIST实验室　突破芯片材料表征、制程控制、封装测试等关键测量技术
其他研发项目45分散管理　国家科学基金会（NSF）、国家能源部（DOE）等　包括短期劳动力培训、EDA工具、可靠性研究等
专项支撑
基金		国防基金20专项投入　国防部（DOD）　微电子研发、制造与国防人才培养
国际技术安全与创新基金5　国务院（DOS）　国际技术安全与供应链合作
劳动力与教育基金2　NSF　微电子人才培养与教育支持
总计527
), ArticleFig(id=1288421793723560520, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
调整维度拜登政府政策特朗普政府调整调整效果
审批流程　包含DEI要求、儿童保育条款、气候相关条款等附加条件　取消多样性要求、儿童保育条款、气候责任等附加条件　简化审批流程，提高资金投放效率
投资要求　按企业原有承诺执行　要求企业在原承诺基础上进一步扩大投资规模　台积电投资从650亿美元增至1650亿美元
监督机制　常规绩效考核和监督　威胁暂停资金支付，要求企业超越最初承诺 　强化政府对企业履约的约束力
国际合作　相对相对开放的合作框架　进一步收紧对中国等国合作限制条件　技术竞争进一步激化
政策连续性　相对法案制定和初步实施　“延续中调整”的务实策略　核心资金结构和战略目标保持不变
执行机构　商务部长雷蒙多主导实施　商务部长卢特尼克接任，承诺继续推进　设立专门机制处理大型投资项目
), ArticleFig(id=1288421793853583945, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, label=表2, caption=

特朗普政府对CHIPS法的政策调整对比

, figureFileSmall=null, figureFileBig=null, tableContent=
调整维度拜登政府政策特朗普政府调整调整效果
审批流程　包含DEI要求、儿童保育条款、气候相关条款等附加条件　取消多样性要求、儿童保育条款、气候责任等附加条件　简化审批流程，提高资金投放效率
投资要求　按企业原有承诺执行　要求企业在原承诺基础上进一步扩大投资规模　台积电投资从650亿美元增至1650亿美元
监督机制　常规绩效考核和监督　威胁暂停资金支付，要求企业超越最初承诺 　强化政府对企业履约的约束力
国际合作　相对相对开放的合作框架　进一步收紧对中国等国合作限制条件　技术竞争进一步激化
政策连续性　相对法案制定和初步实施　“延续中调整”的务实策略　核心资金结构和战略目标保持不变
执行机构　商务部长雷蒙多主导实施　商务部长卢特尼克接任，承诺继续推进　设立专门机制处理大型投资项目
), ArticleFig(id=1288421793929081418, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
计划名称资助金额/
亿美元		主要目标实施机构重点领域预期成果
　国家半导体技术中心（NSTC）20　前沿技术研发、工程化验证、原型制造　Natcast（由NIST 授权运营）　极紫外光（EUV）光刻、先进制程、新材料、数字资产　建立R&D旗舰设施，支持初创企业，设立投资基金
　国家先进封装制造计划（NAPMP）30　先进封装测试技术创新，建设试验设施　NIST协调管理　异构集成、多芯片封装、3D堆叠、先进基板　先进封装试验设施，新基板技术开发
　CHIPS制造业美国研究所10　数字孪生技术开发，智能制造工艺优化　SRC（NIST监管）　数字孪生、智能制造、工艺优化、AI应用　SMART USA研究所，2.85亿美元联邦资助
　半导体计量研发计划5　材料表征、制程控制、可靠性测试技术开发　NIST直接实施　7大计量挑战、测试方法、质量控制标准　国家级计量测试平台，半导体创新计量交换（METIS）数据交换系统
), ArticleFig(id=1288421794017161803, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, label=表3, caption=

CHIPS研发办公室4大计划详细对比

, figureFileSmall=null, figureFileBig=null, tableContent=
计划名称资助金额/
亿美元		主要目标实施机构重点领域预期成果
　国家半导体技术中心（NSTC）20　前沿技术研发、工程化验证、原型制造　Natcast（由NIST 授权运营）　极紫外光（EUV）光刻、先进制程、新材料、数字资产　建立R&D旗舰设施，支持初创企业，设立投资基金
　国家先进封装制造计划（NAPMP）30　先进封装测试技术创新，建设试验设施　NIST协调管理　异构集成、多芯片封装、3D堆叠、先进基板　先进封装试验设施，新基板技术开发
　CHIPS制造业美国研究所10　数字孪生技术开发，智能制造工艺优化　SRC（NIST监管）　数字孪生、智能制造、工艺优化、AI应用　SMART USA研究所，2.85亿美元联邦资助
　半导体计量研发计划5　材料表征、制程控制、可靠性测试技术开发　NIST直接实施　7大计量挑战、测试方法、质量控制标准　国家级计量测试平台，半导体创新计量交换（METIS）数据交换系统
), ArticleFig(id=1288421794084270668, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
作用维度传统计量院职能现代计量院职能（NIST模式）具体体现效果评估
基准标准
制定		基准范围　基础计量基准（primary standards）维护行业引领基准+标准物质开发　量子计算、AI芯片计量基准占据技术计量制高点
标准物质　传统标准参考物质（SRM）半导体专用标准参考物质　SRM 3461 nm悬臂梁、薄膜厚度标准为产业提供计量溯源
溯源体系　国内计量溯源链建立全球计量溯源网络引领　NIST标准成为国际参考技术话语权提升
资源整合
协调		整合范围　内部计量技术资源全国半导体计量创新资源统筹　NSTC平台汇聚产学研计量需求计量创新效率提升
协调机制　被动计量技术服务主动计量生态总调度　527亿美元中5亿美元专项计量研发重大计量项目统筹
合作模式　单向计量标准输出双向协同计量创新　与半导体企业联合开发计量技术产学研计量深度融合
产业生态
培育		建设范围　基础计量技术体系完整半导体计量生态链　从材料计量到制程控制全链条全产业链计量支撑
培育方式　计量标准推广应用平台+资金+政策+标准物质　METIS数据交换系统+7大计量挑战计量技术产业化应用
作用深度　计量技术支撑服务半导体产业复兴计量引擎　从幕后支撑到前台协调者战略地位历史性跃升
), ArticleFig(id=1288421794159768141, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1288421785544667678, language=CN, label=表4, caption=

国家计量院枢纽作用分析

, figureFileSmall=null, figureFileBig=null, tableContent=
作用维度传统计量院职能现代计量院职能（NIST模式）具体体现效果评估
基准标准
制定		基准范围　基础计量基准（primary standards）维护行业引领基准+标准物质开发　量子计算、AI芯片计量基准占据技术计量制高点
标准物质　传统标准参考物质（SRM）半导体专用标准参考物质　SRM 3461 nm悬臂梁、薄膜厚度标准为产业提供计量溯源
溯源体系　国内计量溯源链建立全球计量溯源网络引领　NIST标准成为国际参考技术话语权提升
资源整合
协调		整合范围　内部计量技术资源全国半导体计量创新资源统筹　NSTC平台汇聚产学研计量需求计量创新效率提升
协调机制　被动计量技术服务主动计量生态总调度　527亿美元中5亿美元专项计量研发重大计量项目统筹
合作模式　单向计量标准输出双向协同计量创新　与半导体企业联合开发计量技术产学研计量深度融合
产业生态
培育		建设范围　基础计量技术体系完整半导体计量生态链　从材料计量到制程控制全链条全产业链计量支撑
培育方式　计量标准推广应用平台+资金+政策+标准物质　METIS数据交换系统+7大计量挑战计量技术产业化应用
作用深度　计量技术支撑服务半导体产业复兴计量引擎　从幕后支撑到前台协调者战略地位历史性跃升
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美国国家标准与技术研究院推动半导体产业发展的经验及启示
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胡泊 , 黄怡璠 , 徐玄 , 宫轲楠 *
科技导报 | 政策建议 2026,44(13): 170-183
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科技导报 |政策建议 2026 , 44 (13) : 170 -183
美国国家标准与技术研究院推动半导体产业发展的经验及启示
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胡泊，工程师，研究方向为质量基础设施，电子信箱：

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胡泊，工程师，研究方向为质量基础设施，电子信箱：

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胡泊 , 黄怡璠, 徐玄, 宫轲楠*
作者信息
  • 中国计量科学研究院，北京 100029
通讯作者:
宫轲楠（通信作者），副研究员，研究方向为质量基础设施理论、技术经济评价，电子信箱：
作者简介:

胡泊，工程师，研究方向为质量基础设施，电子信箱：

NIST's experience and implications in promoting semiconductor industry development
Bo HU , Yifan HUANG, Xuan XU, Kenan GONG*
Affiliations
  • National Institute of Metrology, Beijing 100029, China
出版时间: 2026-07-13 doi: 10.3981/j.issn.1000-7857.2025.08.00025
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摘要
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半导体技术对国家经济安全和国防实力至关重要。面对日益激烈的全球竞争，美国政府自2021年以来接连出台多项法案，以前所未有的力度支持国内半导体产业发展，力图重振美国半导体产业的全球领先地位。美国国家标准与技术研究院（National Institute of Standards and Technology，NIST）作为美国的国家计量院，同时承担着国家级技术研究机构的职能，被指定为《2022年芯片与科学法》（CHIPS and Science Act of 2022）的主要执行机构，在法案实施过程中发挥了关键作用。通过分析NIST在法案实施3年来的组织转型、项目布局、资金投入与实施成效，系统梳理了NIST从国家计量基准和标准物质提供者向半导体产业复兴核心协调者的职能拓展过程。研究发现，NIST充分利用其在半导体领域的技术优势和产业链整合能力，通过系统性规划和协调资金、项目、平台、人才等关键创新要素，成功构建了涵盖区域创新生态建设、转化路径拓展及高水平人才培养的全链条半导体产业支持体系。通过对比分析美国政府对NIST支持模式的创新实践，揭示了国家计量院在现代产业创新体系中的枢纽作用，为中国相关领域发展提供了重要启示。

半导体产业  /  2022年芯片与科学法  /  美国国家标准与技术研究院（NIST）  /  战略科技力量  /  产业政策

Semiconductor technology is crucial to national economic security and defense capabilities. Facing increasingly fierce global competition, the U.S. government has enacted multiple legislative acts since 2021 with unprecedented intensity to support domestic semiconductor industry development, aiming to restore America's global leadership in semiconductors. The National Institute of Standards and Technology (NIST), serving as the United States' national metrology institute while also functioning as a comprehensive national−level technical research institution, has been designated as the primary implementing agency for the CHIPS and Science Act of 2022 (referred to as the CHIPS Act), playing a critical role in the Act's implementation. This paper systematically analyzes NIST's organizational transformation, project deployment, funding investment, and implementation effectiveness over the three years since the CHIPS Act's implementation, examining NIST's functional expansion from a provider of national measurement standards and reference materials to a core coordinator for semiconductor industry revitalization. The research finds that NIST has fully leveraged its technical advantages in the semiconductor field and industry chain integration capabilities, successfully constructing a comprehensive semiconductor industry support system through systematic planning and coordination of key innovation elements including funding, projects, platforms, and talent. This system encompasses regional innovation ecosystem development, commercialization pathway expansion, and high−level talent cultivation. Through comparative analysis of the U.S. government's innovative practices in supporting NIST, this study reveals the pivotal role of national metrology institutes in modern industrial innovation systems, providing important implications for China's development in related fields.

semiconductor industry  /  CHIPS and Science Act of 2022  /  National Institute of Standards and Technology (NIST)  /  strategic science and technology forces  /  industrial policy
胡泊, 黄怡璠, 徐玄, 宫轲楠. 美国国家标准与技术研究院推动半导体产业发展的经验及启示. 科技导报, 2026 , 44 (13) : 170 -183 . DOI: 10.3981/j.issn.1000-7857.2025.08.00025
Bo HU, Yifan HUANG, Xuan XU, Kenan GONG. NIST's experience and implications in promoting semiconductor industry development[J]. Science & Technology Review, 2026 , 44 (13) : 170 -183 . DOI: 10.3981/j.issn.1000-7857.2025.08.00025
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半导体产业是信息技术产业的核心，在国家经济发展和国防建设中占据战略地位。长期以来，美国在半导体领域保持着全球领先优势，英特尔、超威半导体（AMD）、高通和英伟达等国际知名半导体企业大多诞生于美国。与此同时，美国在半导体测试、计量、标准等领域保持全球领先水平。
根据1875年《米制公约》建立的国际计量体系，各国均设有国家计量院（NMI）作为本国计量基准的最高权威机构，负责建立和维护国家计量标准，确保测量结果的国际一致性和可溯源性[1−3]。美国国家标准与技术研究院（National Institute of Standards and Technology，NIST）作为美国的国家计量院，不仅承担传统的计量基准职能，更发展成为集计量、标准、技术研究和产业服务于一体的综合性国家级技术研究机构[4]。NIST在半导体材料特性表征、制程质量控制、可靠性分析、半导体标准参考物质等方面积累了雄厚实力，这些领域的领先优势是支撑美国半导体产业核心竞争力的重要基石[5]。
然而，进入21世纪以来，美国半导体制造环节大量外迁，本土制造产能占比大幅下降，加之主要经济体竞相加大投入，美国在全球半导体产业链中的主导地位受到严峻挑战。为扭转半导体产业面临的不利局面，美国政府自2021年以来先后出台《2021财年国防授权法》（NDAA Act of 2021）、《2022年芯片与科学法》（CHIPS and Science Act of 2022，简称CHIPS法）等一系列法案，以期重振美国半导体产业[6−7]。在相关法案的实施过程中，NIST作为美国商务部下属的国家级科研机构，凭借其在半导体计量基准、标准物质、检测认证等领域的技术优势，发挥关键作用。NIST作为美国国家战略科技力量在推动半导体产业发展中的探索和实践，值得审慎分析、合理借鉴。
1 《2022年芯片与科学法》的出台背景与实施进展
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1.1 《2022年芯片与科学法》出台的战略背景
进入21世纪以来，美国半导体产业面临日益复杂的国内外环境。一方面，美国半导体公司将生产环节大量转移至亚洲，导致美国在关键制造环节对外依存度过高。据波士顿咨询公司和美国半导体产业协会的联合统计，目前美国仅拥有全球约12%的芯片制造产能和不到3%的封装测试产能[8−9]。这种“去制造化”趋势引发了美国政府对产业安全和供应链韧性的担忧。2020年新冠病毒感染期间，中国台湾地区芯片生产中断导致全球芯片短缺，更让美国政府认识到过度依赖外部供应的潜在风险。另一方面，中国加快推进半导体产业的自主发展。中国自2015年启动“中国制造2025”计划以来，通过国家集成电路产业投资基金等渠道投入约1500亿美元支持半导体产业发展，本土企业如中芯国际已发展到7 nm制程工艺，产业链各环节正在加快构建[10]。在此背景下，美国政府意识到必须加大对本土半导体产业的扶持力度。
2021年1月，美国国会通过《2021财年国防授权法》（NDAA Act of 2021），明确提出要采取行动重振美国半导体产业[7]。2022年8月，美国进一步通过CHIPS法，开启了美国半导体产业振兴的新篇章[6−11]。CHIPS法的整体部署框架如图1所示。
1.2 《2022年芯片与科学法》的主要内容和目标
CHIPS法计划在5年内（2022—2027财年）投入527亿美元，全部用于支持美国国内半导体研发和制造[12−13]。作为美国历史上规模最大的一次半导体产业扶持计划，CHIPS法旨在重塑美国在全球半导体供应链中的主导地位。具体资金分配情况见表1[12,14−16]。
CHIPS法主要包含2大方面的内容。第一，提供390亿美元作为半导体制造投资激励基金，采取“匹配投资”形式，鼓励企业在美国新建或扩建芯片工厂[17]。其中280亿美元用于支持领先工艺制造集群，20亿美元专项用于支持成熟工艺芯片生产[16]。第二，提供110亿美元用于支持半导体前沿技术研发，重点建设国家半导体技术中心（NSTC）、国家先进封装制造计划（NAPMP）、制造业美国研究所（Manufacturing USA），以及支持NIST开展半导体计量测试等研发项目[15]。此外，CHIPS法还设立了25%的投资税收抵免政策，据美国国会预算办公室（CBO）估计，这项政策将在2022—2026财年减少联邦政府221亿美元的税收收入[18]。
1.3 《2022年芯片与科学法》的实施进展与成效
CHIPS法实施以来，美国半导体产业布局明显加速。据美国半导体产业协会（SIA）统计，全美已有28个州超过130个半导体相关项目宣布在美投资[19]。英特尔、三星、台积电和格芯等龙头企业纷纷宣布大规模投资计划，涉及先进逻辑芯片、存储芯片等多个关键领域[20−22]。专业机构预测到2032年，美国在全球芯片制造能力中占比也将从2022年的10%提高到14%[23]。
在研发创新领域，国家半导体技术中心联盟（NSTC Consortium）正式成立，负责牵头组织产学研各界力量开展前沿技术联合攻关和工程化研究[24−25]。NIST联合多部门启动“半导体计量挑战”计划，旨在加快突破芯片材料表征、制程控制、封装测试等领域的关键计量测试技术瓶颈[26−27]。此外，美国还启动了国家先进封装制造计划，首期将投入3亿美元支持玻璃基板、硅芯基板和扇出型晶圆级封装技术的研发和国产化[28]。
1.4 特朗普政府的政策延续与调整策略
2025年1月特朗普就任总统后，新政府实际上采取了“延续中调整”的务实策略。商务部长霍华德·卢特尼克明确表示将继续实施CHIPS法，同时通过重新谈判为纳税人争取更好的协议。另外，特朗普于2025年3月31日签署行政命令，在商务部内设立了美国投资加速办公室，接管了此前由NIST管理的CHIPS项目办公室的职责[29−30]。
政策调整主要体现在4个方面：一是简化审批流程，取消CHIPS法合同中的多样性、公平性和包容性（DEI）要求，儿童保育条款等附加条件[31]；二是强化投资要求，要求资助企业在原有承诺基础上进一步扩大投资规模，台积电就将其在亚利桑那州的投资从650亿美元增加到1650亿美元[32]；三是建立更加严格的监督机制，威胁暂停资金支付以约束企业履约[33]；四是加强国际合作限制，进一步收紧了对与中国等国家合作的限制条件[34−35]。为更直观地展示两届政府政策的具体差异，将主要调整内容对比见表2。
这种政策连续性反映了美国两党对半导体产业重要性的深度共识。即使在政治转换期间，核心的资金结构和战略目标保持基本不变，为美国半导体产业的长期发展提供了制度保障，也体现了半导体制造能力对国家安全的重要性已经超越了党派政治的考量。
2 NIST在CHIPS法实施中的战略引领作用
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2.1 参与法案制定，提供决策支撑
CHIPS法的出台是美国政府、国会、产业界等各方广泛参与、共同推动的结果。作为国家级科研机构，NIST积极响应国会号召，充分发挥自身专业优势，在法案制定过程中提供了重要的智力支持。
早在法案起草之初，NIST就与SIA等机构开展了深入的产业调研，系统梳理了美国半导体产业发展现状，深入分析了在制造、封装、设备、材料等关键环节存在的短板和挑战，形成了一系列战略研究报告，为法案起草提供了重要决策参考[15,36]。
在法案制定的关键阶段，NIST还充分发挥前瞻性思考和规划引领的作用。通过组织召开半导体技术发展路线图研讨会，NIST系统梳理了半导体技术未来5~10年的发展趋势和关键挑战，并围绕芯片设计、制造、封装、测试等环节，研究提出了一系列技术创新重点方向和任务[27,37−39]。这些前瞻性的研究成果后来直接转化为CHIPS法重点支持的任务，对法案确定产业振兴的目标和路径发挥了关键作用。
2.2 负责管理CHIPS项目办公室
CHIPS法明确规定，商务部下属的NIST需要设立CHIPS项目办公室，全面负责管理法案提供的390亿美元规模的半导体制造激励资金。CHIPS项目办公室肩负着设计和实施半导体制造激励计划的重任，通过提供资金支持、降低投资风险等方式，引导和撬动企业扩大在美投资，重建半导体关键制造能力[40−41]。
根据法案要求，CHIPS项目办公室制定了美国半导体产业振兴的总体战略和实施方案，重点聚焦4大任务：一是引领尖端逻辑芯片制造，支持建设至少2个具备完整生态的尖端逻辑芯片产业集群；二是推动先进封装测试，支持建设多个先进封装测试基地；三是发展前沿存储芯片，支持企业扩大先进动态随机存取存储器（DRAM）等存储芯片产能，并推动下一代存储技术研发；四是提升成熟工艺芯片供给，资助企业扩充成熟制程芯片产线[15,41]。
自CHIPS法实施以来，在CHIPS办公室的高效运作下，美国半导体制造领域重大项目密集落地，产能扩张进程明显加快。截至2025年7月，商务部已向32家公司的48个项目授予325.4亿美元的资金和58.5亿美元的贷款[19]。专业机构预测，到2032年，美国在全球芯片制造能力中的占比将从10%提高到14%[42]。
2.3 负责管理CHIPS研发办公室
除了提供制造端的资金激励，CHIPS法还在研发创新领域给予前所未有的支持。NIST作为CHIPS法实施的主力机构，负责管理110亿美元的半导体研发资金，其中65亿美元集中投入4大重点计划。
一是NSTC获得20亿美元资助，主要开展半导体前沿技术研发、工程化验证和原型制造，并设立投资基金支持初创企业成果转化。NSTC不仅承担技术研发任务，还肩负着培育创新生态、孵化初创企业的重要使命[25,43]。
二是NAPMP获得30亿美元资助，聚焦先进封装测试技术创新，建设公共服务平台，支撑产业链协同攻关。该计划不仅支持技术研发，还致力于建设共享的测试验证平台，为中小企业提供技术服务，培育完整的产业生态[44−45]。
三是CHIPS制造业美国研究所，2025年1月商务部宣布向半导体研究公司制造联盟（SRC）授予2.85亿美元资助，在北卡罗来纳州达勒姆市建立和运营CHIPS制造业美国研究所，专注于数字孪生技术的快速开发、验证和应用[46−47]。
四是半导体计量研发计划，由NIST自主实施，获得5亿美元资助，瞄准材料表征、制程控制、可靠性测试等方向，开发先进计量测试技术和工具。这一计划充分发挥了NIST作为国家计量院的专业优势，为半导体产业发展提供了重要的技术基础支撑[5,27]。
CHIPS研发办公室管理的这些计划，与CHIPS项目办公室的制造端激励形成良性互动，共同带动美国半导体创新能力的跃升。2大办公室通力协作，撬动社会资源广泛参与，形成研发、制造、应用的良性循环，不断巩固美国半导体产业的全球竞争力。4大计划的详细对比情况见表3。
2.4 开展半导体前沿计量研究
集成电路计量测试是保障芯片制造质量和效率的关键环节。NIST作为美国国家计量院，在半导体计量领域积累了深厚的技术优势。CHIPS法进一步赋予NIST新的使命，聚焦产业发展急需，加快先进计量技术研发。
CHIPS法授权NIST在5年实施期内获得5亿美元资金，在7大领域开展前瞻布局[6,16]：一是材料计量领域，研发先进计量表征技术，支撑半导体关键材料的纯度检测、性能评估和质量控制；二是制造计量领域，发展新型过程计量和智能测量技术，实现对半导体生产全流程的实时监控和精准反馈；三是封装计量领域，针对异质集成、多芯片堆叠等先进封装形式，突破跨尺度计量测试技术；四是仿真计量领域，开发多尺度、多物理场耦合的建模仿真工具，精准预测芯片性能；五是标准计量领域，研制半导体新材料、新工艺、新设备的通用计量标准；六是安全计量领域，发展芯片安全检测、验证、溯源关键技术；七是量子计量领域，面向量子计算、量子通信等新兴应用，开发量子器件的精密测量技术[27]。NIST还将建设一批国家级半导体计量测试平台，引领产业测试理念创新、方法创新和工具创新[48]。通过建立广泛的协同创新网络，NIST整合各方资源推进半导体计量技术发展，具体的协作关系如图2[25]所示。
2.5 NIST成功的关键要素分析
NIST在CHIPS法实施中的卓越表现并非单一因素所致，而是源于其独特的制度优势、技术底蕴和组织能力的有机结合。
立法授权的权威性是NIST发挥作用的根本保障。CHIPS法通过国会立法的形式，明确授权NIST管理520亿美元的半导体振兴资金，这种法定地位确保了NIST在半导体产业发展中的核心地位不会因政府更迭而改变。与一般的行政指令相比，立法授权具有更强的稳定性和约束力，为NIST制定长期规划、实施重大项目提供了坚实的制度基础。
技术公信力的中立性是NIST获得各方信任的重要基础。NIST作为非监管性的联邦政府机构，在产业发展中保持相对中立的立场，不偏向任何特定企业或利益集团。这种制度性中立使其能公正分配资源、制定标准、协调合作，从而获得产学研各方的信任和支持。
跨部门协调的枢纽地位是NIST整合资源的核心优势。商务部、国防部、能源部、国家科学基金会等多个部门都与NIST建立了常态化协作机制，形成了跨部门的政策合力。NIST通过建立NSTC、NAPMP等开放式合作平台，有效整合了全国的半导体创新资源，避免了部门分割和资源分散。
基于计量标准的底层支撑能力是NIST发挥引领作用的技术根基。NIST在半导体计量领域的深厚积累，使其能够为产业发展提供从材料表征到制程控制、从封装测试到可靠性评估的全链条技术支撑。通过识别7大计量技术挑战、开发专用标准参考物质、建设先进计量测试平台，NIST将自身的技术优势转化为产业优势，为美国半导体产业发展提供了不可替代的技术基础设施。
3 政府支持国家计量院的战略意义与实践模式
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3.1 美国政府对NIST支持的战略升级
美国政府对NIST的支持体现了对国家计量院战略价值的深刻认识和全面升级。这种支持不仅仅是简单的资金投入增加，而是对NIST功能定位、组织架构和运行机制的系统性重塑。
从资金投入规模看，CHIPS法授权NIST管理总计520亿美元半导体振兴资金，这是NIST历史上承担的最大规模产业协调任务。这一授权不仅体现美国政府对半导体产业的高度重视，更重要的是体现了对美国国家计量院在现代产业竞争中战略价值的深度认知。
从职能定位的战略性调整看，美国政府将NIST从传统的被动技术支持者转变为主动的产业组织者和战略协调者。NIST不仅负责制定技术标准和提供计量服务，还要协调产学研合作、引导产业布局、培育创新生态、配置创新资源。这种职能扩展体现了政府对美国国家计量院在现代产业体系中核心地位的重新认识。
从组织架构的系统性重构看，NIST通过设立CHIPS项目办公室和CHIPS研发办公室，建立了专门的半导体产业服务体系。CHIPS项目办公室专门负责制造端的资金配置和项目管理，CHIPS研发办公室专门负责创新端的研发协调和生态构建，两者相互配合，形成了从基础研究到产业化应用的完整支撑体系。
从政策环境的制度性保障看，CHIPS法通过立法形式确立了NIST在半导体产业发展中的法定地位，确保政策的连续性和稳定性。即使在政府更迭的情况下，NIST的核心职能和资金来源仍然得到法律保障，这为长期规划和持续投入提供了坚实的制度基础。
3.2 政府支持模式的创新实践特征
美国政府对NIST的支持模式具有鲜明的创新特征，这些特征为其他国家政府支持国家计量院提供了重要参考。
一是制度保障的全面性和系统性。美国政府通过CHIPS法不仅提供了大规模的资金支持，还通过立法形式确立了NIST的法定地位和职责范围，确保NIST在半导体产业发展中的核心地位不会因政府更迭而改变，职能范围涵盖从基础研究到产业化应用的全链条，执行权力赋予NIST足够的资源配置权和决策权。
二是支持方式的系统性和协调性。政府支持不仅包括直接的财政投入，还包括政策协调、部门合作、国际协作等多个层面的系统性安排。商务部、国防部、能源部、国家科学基金会等多个部门与NIST建立了常态化协作机制，形成了跨部门的政策合力。
三是评价体系的战略性和前瞻性。政府对NIST的评价不再局限于传统的科研产出指标，而是更加注重其对产业发展和国家竞争力的贡献。通过建立涵盖技术突破、产业化应用、人才培养、生态构建等多维度的评价体系，政府引导NIST更好地服务国家战略需求。
四是资源配置的市场化和效率化。虽然NIST获得了大规模的政府投入，但在具体的资源配置过程中，政府充分运用市场机制，通过竞争性资助、绩效考核、第三方评估等方式，确保资源配置的效率和公平。同时，政府还鼓励NIST与私营部门合作，通过公私合作模式撬动更多的社会资源。
3.3 国家计量院在产业创新体系中的枢纽作用
NIST在CHIPS法实施中的实践充分表明，国家计量院在现代产业创新体系中具有不可替代的枢纽作用。这种枢纽作用主要体现在基准标准的制定引领、创新资源的整合协调、产业生态的构建培育3个核心维度。
作为基准标准的制定者和引领者，NIST发挥着产业发展“指南针”的作用。NIST的实践表明，在技术快速发展的时代，国家计量院除了负责制定和维护传统计量基准，还应该承担新兴技术领域专用计量基准和标准参考物质的研发任务。在半导体领域，NIST基于其深厚的计量技术基础，持续开发专用计量基准和标准参考物质。例如，NIST于2023年发布的SRM 3461原子力显微镜悬臂梁标准为纳米级力测量提供了准确的校准基准[49]，正在开发的纳米级平面参考材料将为半导体制造中的薄膜表征提供重要支撑[50]。通过制定专用计量基准和标准参考物质，NIST能够将自身的计量技术优势转化为产业优势，为半导体制造全流程提供可靠的计量保障和溯源体系。
作为创新资源的整合者和协调者，NIST发挥着产业创新“总调度”的作用。NIST通过建立NSTC、NAPMP等开放式合作平台，有效整合了全国的半导体计量创新资源。这些平台汇聚了来自高校、企业、研究机构的顶尖人才和先进设备，形成了强大的协同创新能力。同时，NIST还通过识别7大计量挑战、设立专项基金、组织联合攻关等方式，引导计量创新资源向关键技术领域集中。
作为产业生态的构建者和培育者，NIST发挥着产业发展“播种机”的作用。NIST通过制定长期规划、设立专项基金、培育专业人才、孵化初创企业等方式，推动半导体计量生态的形成和完善。特别是通过METIS数据交换系统和CHIPS计量社区，NIST为整个半导体产业提供了计量技术共享平台，促进了计量创新成果的快速转化[51−52]。
通过在CHIPS法实施中的成功实践，NIST充分证明了国家计量院在现代产业创新体系中的枢纽地位和战略价值，如表4所示。这种实践不仅为美国半导体产业的振兴提供了有力的计量技术支撑，也为全球国家计量院的发展提供了重要启示和宝贵经验。
4 全球半导体政策竞争与供应链重构
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4.1 国际半导体政策的连锁反应与竞争格局
美国CHIPS法的实施在全球范围内引发了一场半导体政策竞赛，各主要经济体纷纷出台类似政策，形成了全球半导体产业政策竞争的新格局。
欧盟的政策响应最为迅速和全面。《欧盟芯片法》（European Chips Act）于2023年9月21日正式生效，计划动员超过430亿欧元的公共和私人投资支持半导体产业发展，目标是到2030年将欧盟在全球半导体制造中的份额从目前的10%提升到20%[53]。该法基于3大支柱：欧洲芯片倡议将支持大规模技术能力建设和创新，激励公共和私人投资制造设施的框架，以及通过欧洲半导体委员会建立的协调机制。
日本的政策响应体现了其在半导体产业链中的独特定位。日本政府在2021—2023年3年间投入3.9万亿日元（257亿美元）支持半导体产业发展，这一投入强度约占GDP的0.71%，是美国（0.21%）的3倍以上[54]。日本的政策重点是利用其在材料和设备领域的传统优势，同时通过与台积电、Rapidus等企业的合作，重建本土的先进制造能力[55]。
韩国K−CHIPS法经过多次修订，2025年将大中型企业的半导体设施投资税收抵免从15%提高到20%[56]。韩国政府2024年1月宣布建设世界最大半导体“巨型集群”计划，预计到2047年吸引私营部门投资622万亿韩元（约4700亿美元），重点巩固其在存储芯片领域的全球领先地位[56]。
面对美国CHIPS法等国际政策挑战，中国进一步加强了政策支持力度。2024年5月，国家集成电路产业投资基金三期正式成立，注册资本3440亿人民币，远超前两期总和[57]。2023年3月中央科技委员会正式成立，统筹半导体等战略科技领域的顶层协调工作[58]。各地方政府也纷纷响应，上海提出芯片设计能力进入3 nm及以下，广州制定了2022—2024年半导体与集成电路产业发展行动计划等[59−60]。
印度推出了150亿美元的半导体发展计划，致力于建设本土的芯片设计和制造能力[61]。新加坡、马来西亚等东南亚国家也出台了相应的产业扶持政策，希望在全球半导体产业链重构中获得更大份额[62]。
这种全球性的政策竞争产生了深远影响。根据波士顿咨询公司的分析，2024—2032年期间，全球晶圆厂投资预计将达到2.3万亿美元，比前一个10年增长3倍[23]。传统上集中在东亚地区的半导体制造正在向全球扩散，各国政府的大规模投入推动了半导体技术的快速发展，催生了多元化的技术发展路径和创新模式。
4.2 供应链地理重构与技术竞争新特征
全球半导体供应链正在经历深刻的地理重构，从纯粹的效率优化转向安全与效率并重的新模式。传统的基于成本效率的全球分工模式正在向基于安全考量的区域化分工模式转变。
供应链地理分布发生显著变化。各国政府都努力在本土建立相对完整的半导体产业链，减少对外依赖。美国通过CHIPS法大力发展本土制造能力，预计到2032年其在全球制造能力中的份额将从目前的12%提升到28%。欧盟希望通过《欧盟芯片法》将制造份额从10%提升到20%。这种趋势导致了供应链的区域化和多元化，虽然在一定程度上降低了效率，但提高了供应链的安全性和韧性。
先进逻辑产能的地理集中度正在降低。传统上主要由台积电和三星2家企业生产的先进逻辑芯片，随着各国政策的推动，地理分布更加分散。台积电在美国亚利桑那州、三星在美国得克萨斯州、英特尔在美国多个州的工厂扩建，都将显著提升美国的先进制造能力。
技术转移限制成为供应链重构的重要推动因素。自2022年10月以来，美国不断加强对中国半导体技术出口管制，最新的2024年12月管制措施针对140家中国企业[63]。这些限制措施不仅影响了中美两国的半导体贸易，也推动了全球供应链的重新配置。
当前的全球半导体技术竞争呈现出新的特征。竞争领域实现全面化和系统化，从单一的制造工艺竞争扩展到材料、设备、设计工具、制造工艺、封装测试、标准制定等产业链各个环节。政府作用显著增强，直接参与产业发展的规划和实施，通过大规模投资、政策引导、标准制定等方式直接影响技术发展方向。创新模式呈现开放化和协同化特征，各国在政策层面存在竞争的同时，在技术层面仍然需要广泛的国际合作。标准制定变得更加战略化和前瞻化，各国政府都高度重视技术标准的制定，努力将自身的技术优势转化为标准优势。
5 对中国半导体计量发展的启示
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5.1 构建以技术为核心的产业创新支撑体系
NIST在CHIPS法实施中的成功经验表明，在关键战略产业发展中，应充分发挥国家级技术研究机构的统筹协调作用，而非仅仅依赖行政管理手段。中国应借鉴这一经验，进一步完善以技术为纽带的产业创新支撑体系。
在具体实施路径上，中国应通过专项授权的方式，赋予中国科学院（以下简称中科院）体系内的微电子相关研究所、国家级计量科研院所、高校集成电路研究机构等具备技术优势的科研单位更大的产业协调职能。这些机构应在重大产业项目中承担技术统筹和资源配置建议的职责，发挥技术引领和标准制定的核心作用。建议在现有战略性新兴产业发展部际协调机制框架下，进一步明确半导体领域的具体分工，由国家发展和改革委员会统筹，科学技术部负责基础研究布局，工业和信息化部负责产业化推进，财政部负责资金保障，形成有机协调的政策合力。
在平台建设方面，应依托现有的全国重点实验室、工程研究中心等载体，由中科院微电子领域研究所、部属重点高校的集成电路学院等机构牵头，建设开放共享的半导体技术创新平台。这些平台应面向产业发展的重大技术需求，汇聚产业龙头企业、高等院校、科研院所的力量，形成协同攻关合力。特别是在计量测试、标准制定、检验检测等技术基础设施建设方面，应发挥国家级计量技术机构的引领作用，为产业发展提供技术基础支撑。
在制度保障方面，中国应进一步优化现有的大基金投资机制、税收优惠政策等制度安排，借鉴美国CHIPS法的立法保障经验，通过更高层级的制度设计确保政策的长期稳定性和执行连续性。建议由科学技术部会同相关部门建立政策实施效果的跟踪评估机制，定期评估政策执行情况和产业发展成效，确保政策科学性和有效性。
5.2 强化技术基础设施的战略支撑作用
NIST从传统技术服务机构向产业协调者的转型，体现了技术基础设施在现代产业竞争中的战略价值。中国应充分认识计量、标准、检验检测、认证等质量基础设施在半导体产业发展中的重要作用，加快建设半导体专用技术基础设施体系。
在计量技术突破方面，应由国家级计量科研院所牵头，联合中科院相关光学和精密仪器研究机构、重点高校精密仪器系等单位，借鉴NIST 7大计量技术挑战框架，围绕半导体材料表征、制程控制、封装测试、可靠性评估等关键环节，组织实施国家重点研发计划专项，加快突破关键计量测试技术。重点发展极紫外光刻计量、量子器件测试、先进封装计量等前沿技术，建设国家级半导体计量测试中心。同时，应支持国产半导体设备制造企业与计量机构合作，加强计量测试设备的自主研发，打破国外技术垄断，为产业发展提供自主可控的技术基础支撑。
在标准制定和检验检测方面，学习NIST在标准制定中的引领作用，发挥国家级电子技术标准化机构的主导作用，统筹协调产业界力量，积极参与美国电气电子工程师学会（IEEE）、国际电工委员会（IEC）等国际标准组织的标准制定工作，增强中国在半导体标准领域的话语权。同时，国家标准化机构应与产业龙头企业建立紧密合作机制，加快制定符合中国产业发展需要的行业标准和团体标准。建设高水平的半导体检测服务平台，支持国家级检测机构和第三方专业检测机构建设先进的检测设施，为企业提供专业的检测认证服务，加强检测技术研发和人才培养，提升检测服务的技术水平和服务能力。
5.3 应对国际竞争的战略考量与路径选择
面对美国CHIPS法等政策带来的技术竞争加剧，中国半导体产业发展需要在复杂的国际环境中寻找平衡点，统筹考虑开放合作与自主安全的关系。当前国际半导体竞争呈现出选择性合作与战略竞争并存的特点，这要求中国在技术发展策略上坚持自主创新与开放合作并重，一方面加大自主研发投入，在关键核心技术上实现突破，确保产业链供应链安全；另一方面要在确保安全的前提下，继续扩大国际合作，利用全球创新资源推动产业发展。
在应对技术封锁方面，应建立多元化的技术来源和供应渠道。学习欧洲与美国建立“竞争性合作”关系的经验，中国应由商务部牵头，协调外交部、科学技术部等部门，加强与日本、韩国、欧盟等技术先进国家和地区的合作，构建多元化的国际合作网络。支持国内晶圆制造龙头企业、存储器制造企业与国际设备材料供应商建立长期战略合作关系。同时，应发挥“一带一路”倡议的作用，加强与沿线国家的产业合作，支持国内芯片设计企业拓展新的市场空间。
在技术安全与开放合作平衡方面，应建立更加精准的技术分类管理机制。针对不同技术领域的敏感程度和战略重要性，实施差异化的合作策略。在基础研究、教育培训、标准制定等相对开放的领域保持国际合作，通过多边技术对话机制参与全球半导体产业治理。在核心技术和关键设备领域，建立动态的技术安全评估机制，既要防范技术外溢风险，也要避免过度封闭影响产业发展效率。重点加强自主创新能力建设，形成关键技术的替代方案和应急预案。
在产业生态建设上，应统筹国内国际2个市场、2种资源，充分发挥中国超大规模市场优势。由工业和信息化部牵头，制定半导体产业出海战略，通过应用牵引推动技术创新和产业发展，鼓励消费电子等优势应用企业“走出去”，在全球范围内配置创新资源，提升国际竞争力。建立海外研发中心和创新合作平台，吸引全球人才和技术资源为我所用。
5.4 构建产学研深度融合的人才培养体系
NIST在CHIPS法实施中通过构建协同创新网络，有效整合了产业界、学术界和政府部门的人才资源，形成了多元化的人才培养和使用机制。同时，CHIPS法设立了专门的劳动力与教育基金，投入2亿美元用于微电子人才培养与教育支持，体现了将人才培养纳入产业发展整体布局的战略考量。相比之下，中国虽然在半导体人才培养方面已有较大投入，但在产学研深度融合的体系性建设上仍有提升空间。
在现有基础上深化产学研协同机制方面，中国应进一步突破传统的校企合作模式，建立更加紧密的利益共同体。借鉴NIST通过NSTC、NAPMP等平台在项目实施过程中培养人才的做法，中国应依托国家重大科技专项和产业化项目，建立“真题真做”的人才培养模式。让研究生和博士后直接参与企业面临的实际技术难题，在解决产业关键问题的过程中获得系统性的工程实践能力。这种模式不同于传统的实习或合作研究，而是让人才成为产业创新的直接参与者和贡献者。
在跨界人才培养体系构建方面，中国应针对半导体产业的跨学科特点，建立更加灵活的人才培养机制。当前中国半导体人才培养主要集中在电子工程和材料科学等传统领域，但NIST的经验表明，现代半导体创新需要计量科学、标准制定、系统工程、产业政策等多领域的复合型人才。建议建立跨学科的半导体产业管理和技术人才培养项目，培养既懂技术又懂市场、既懂研发又懂制造、既懂国内又懂国际的复合型领军人才。
在国际人才流动机制优化方面，应借鉴NIST吸引全球顶尖研究人员参与的开放模式，在确保技术安全的前提下，建立更加灵活的国际人才交流机制。建议设立“半导体产业国际人才特区”，为海外高层次人才来中国工作提供便利条件，同时支持国内人才到国际一流机构学习先进技术和管理经验。重点在基础研究、标准制定、产业生态建设等相对安全的领域加强国际合作，通过人才流动促进技术交流和创新合作。
NIST在CHIPS法实施中的成功实践表明，国家级技术研究机构在现代产业竞争中具有不可替代的战略价值。中国应充分借鉴这一经验，强化技术基础设施建设，完善产业创新支撑体系，在确保产业链供应链安全的同时，积极参与国际合作，为建设制造强国和科技强国贡献力量。
基金
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  • 国家重点研发计划项目(2022YFF0608105)
  • 国家重点研发计划项目(2019YFF0216805)
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参考文献 引证文献
排序方式：
[1]
Brown R J C. Measuring measurement–What is metrology and why does it matter[J]. Measurement, 2021, 168: 108408.
[2]
Brown R, Yacoot A. Reflecting on the role of National Metrology Institutes on the occasion of the 125th anniversary of the National Physical Laboratory[J]. Measurement Science and Technology, 2025, 36(7): 071001.
[3]
Wallard A J. The organization of metrology[C]//Proceedings of the International School of Physics "Enrico Fermi". Bologna: Società Italiana Di Fisica, 2007: 21−33.
[4]
National Institute of Standards and Technology. What is a National Measurement Institute[EB/OL]. (2025−01−07) [2025−09−04]. https://www.nist.gov/nmi.
[5]
National Institute of Standards and Technology. Strategic opportunities for U. S. semiconductor manufacturing: Facilitating U. S. leadership and competitiveness through advancements in measurements and standards[R]. Gaithersburg, MD: NIST, 2022.
[6]
U.S. Congress. CHIPS and Science Act of 2022[A]. Washington, DC: U.S. Government Publishing Office, 2022.
[7]
U.S. Congress. William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021[A]. Washington, DC: U.S. Government Publishing Office, 2021.
[8]
Semiconductor Industry Association. 2024 State of the U. S. semiconductor industry[R]. Washington, DC: SIA, 2024.
[9]
Varas A, Varadarajan R, Goodrich J, et al. Strengthening the global semiconductor value chain in an uncertain era[R]. Boston, MA: BCG, SIA, 2021.
[10]
Sutter K M, Blevins E G, Grossman A B. Semiconductors and the CHIPS act: The global context: R47558[R]. Washington, DC: Congressional Research Service, 2023.
[11]
U.S. Department of Commerce. CHIPS Incentives Program: Facilities for semiconductor materials and manufacturing equipment[A]. Washington, DC: U.S. Department of Commerce, 2023.
[12]
National Institute of Standards and Technology. Funding updates[EB/OL]. (2023−12−08) [2024−05−16]. https://www.nist.gov/chips/funding-updates.
[13]
National Institute of Standards and Technology. CHIPS incentives funding opportunities[EB/OL]. (2023−09−28) [2024−05−13]. https://www.nist.gov/chips/chips-incentives-funding-opportunities.
[14]
National Governors Association. CHIPS and Science Act: Implementation resources[EB/OL]. (2024−12−13) [2025−08−05]. https://www.nga.org/chips-resources/.
[15]
Department of Commerce. A strategy for the CHIPS for America Fund[R]. Washington, DC: DoC, 2022.
[16]
Congressional Research Service. Frequently asked questions: CHIPS Act of 2022 provisions and implementation: R47523[R]. Washington, DC: CRS, 2023.
[17]
The White House. Fact sheet: Two years after the CHIPS and Science Act, Biden-Harris administration celebrates historic achievements in bringing semiconductor supply chains home, creating jobs, supporting innovation, and protecting national security[EB/OL]. (2024−08−09) [2025−08−05]. https://bidenwhitehouse.archives.gov/briefing-room/statements-releases/2024/08/09/fact-sheet-two-years-after-the-chips-and-science-act-biden-harris-administration-celebrates-historic-achievements-in-bringing-semiconductor-supply-chains-home-creating-jobs-supporting-inn/.
[18]
Committee for a Responsible Federal Budget. CBO estimates "Chips-Plus" bill would cost $79 billion[EB/OL]. (2022−07−22) [2025−08−05]. https://www.crfb.org/blogs/cbo-estimates-chips-plus-bill-would-cost-79-billion.
[19]
Semiconductor Industry Association. America's chip resurgence: Over $630 billion in semiconductor supply chain investments[EB/OL]. (2025−07−28) [2025−08−05]. https://www.semiconductors.org/chip-supply-chain-investments/.
[20]
The White House. Fact sheet: President Biden announces up to $8.5 billion preliminary agreement with Intel under the CHIPS & Science Act[EB/OL]. (2024−03−20) [2025−08−05]. https://bidenwhitehouse.archives.gov/briefing-room/statements-releases/2024/03/20/fact-sheet-president-biden-announces-up-to-8-5-billion-preliminary-agreement-with-intel-under-the-chips-science-act/.
[21]
TSMC. TSMC Arizona and U. S. Department of Commerce announce up to US$6.6 billion in proposed CHIPS Act direct funding, the company plans third leading-edge fab in Phoenix [EB/OL]. (2024−04−08) [2025−08−05]. https://www.design-reuse.com/news/15919-tsmc-arizona-and-u-s-department-of-commerce-announce-up-to-us-6-6-billion-in-proposed-chips-act-direct-funding-the-company-plans-third-leading-edge-fab-in-phoenix.
[22]
GlobalFoundries. GlobalFoundries and Biden-Harris administration announce CHIPS and Science Act funding for essential chip manufacturing[EB/OL]. (2024−02−19) [2025−08−05]. https://gf.com/gf-press-release/globalfoundries-and-biden-harris-administration-announce-chips-and-science-act-funding-for-essential-chip-manufacturing/.
[23]
Varadarajan R, Koch−Weser I, Richard C, et al. Emerging resilience in the semiconductor supply chain[R]. Boston, MA: BCG, SIA, 2024.
[24]
Natcast. National Semiconductor Technology Center strategic plan FY 2025−2027[R]. Portola Valley: Natcast, 2025.
[25]
CHIPS Research and Development Office. A vision and strategy for the National Semiconductor Technology Center[R]. Gaithersburg, MD: CHIPS Research and Development Office, 2023.
[26]
National Institute of Standards and Technology. Building a Metrology Exchange to Innovate in Semiconductors (METIS): A vision for the CHIPS Metrology Program Data Exchange: NIST CHIPS 1000−2 ipd[R]. Gaithersburg, MD: NIST, 2023.
[27]
CHIPS Research and Development Office. Metrology gaps in the semiconductor ecosystem: First steps toward establishing the CHIPS R&D Metrology Program[R]. Gaithersburg, MD: CHIPS Research and Development Office, 2023.
[28]
National Institute of Standards and Technology. U. S. Department of Commerce announces $1.4 billion in final awards to support the next generation of U. S. semiconductor advanced packaging[EB/OL]. (2025−01−16) [2025−08−06]. https://www.nist.gov/news-events/news/2025/01/us-department-commerce-announces-14-billion-final-awards-support-next.
[29]
Wagner M, Nuland V, Neville G, et al. Trump administration issues Executive Orders that seek to shape CHIPS Program and promote domestic mineral production[EB/OL]. (2025−04−03) [2025−08−06]. https://www.insidegovernmentcontracts.com/2025/04/trump-administration-issues-executive-orders-that-seek-to-shape-chips-program-and-promote-domestic-mineral-production/.
[30]
The White House. Establishing the United States investment accelerator[EB/OL]. (2025−03−31) [2025−08−06]. https://www.whitehouse.gov/presidential-actions/2025/03/establishing-the-united-states-investment-accelerator/.
[31]
Stone M, Potkin F, Lee W Y, et al. Exclusive: Trump prepares to change US CHIPS Act conditions, sources say[EB/OL]. (2025−02−13) [2025−08−06]. https://www.reuters.com/technology/trump-prepares-change-us-chips-act-conditions-sources-say-2025-02-13/.
[32]
Kluge J. Where the CHIPS fell: An analysis of the CHIPS Act's early returns[EB/OL]. (2025−04−04) [2025−08−06]. https://sites.lsa.umich.edu/mje/2025/04/04/where-the-chips-fell-an-analysis-of-the-chips-acts-early-returns/.
[33]
The Straits Times. Trump renegotiating Biden-era Chips Act grants: US Commerce Secretary Lutnick[EB/OL]. (2025−06−05) [2025−08−06]. https://www.straitstimes.com/world/united-states/trump-renegotiating-biden-era-chips-act-grants-lutnick-says.
[34]
National Institute of Standards and Technology. Frequently asked questions: Preventing the improper use of CHIPS Act funding[EB/OL]. (2023−12−28) [2025−08−06]. https://www.nist.gov/chips/frequently-asked-questions-preventing-improper-use-chips-act-funding.
[35]
Department of Commerce. Biden-Harris administration announces final national security guardrails for CHIPS for America Incentives Program[EB/OL]. (2023−09−22)[2025−08−06]. https://www.commerce.gov/news/press-releases/2023/09/biden-harris-administration-announces-final-national-security.
[36]
Henshall D. Request for information: Manufacturing USA Semiconductor Institutes[R]. Morrisville, NC: SRC Manufacturing Consortium, 2022.
[37]
National Institute of Standards and Technology. CHIPS R&D Program standards summit summary report[R]. Gaithersburg, MD: NIST, 2023.
[38]
National Institute of Standards and Technology. Vision for success: Commercial fabrication facilities[R]. Gaithersburg, MD: NIST, 2023.
[39]
National Institute of Standards and Technology. AAAS business meeting: when the government makes big bets on science and technology: The CHIPS Act[EB/OL]. (2023−03−04) [2025−08−06]. https://www.nist.gov/speech-testimony/aaas-business-meeting-when-government-makes-big-bets-science-and-technology-chips.
[40]
National Institute of Standards and Technology. CHIPS for America announces up to $300 million in funding to boost U. S. semiconductor packaging[EB/OL]. (2024−11−21) [2025−08−06]. https://www.nist.gov/news-events/news/2024/11/chips-america-announces-300-million-funding-boost-us-semiconductor.
[41]
National Institute of Standards and Technology. The CHIPS Program Office vision for success: Two years later[R]. Gaithersburg, MD: NIST, 2024.
[42]
Semiconductor Industry Association. America projected to triple semiconductor manufacturing capacity by 2032, the largest rate of growth in the world[EB/OL]. (2024−05−08) [2024−05−17]. https://www.semiconductors.org/america-projected-to-triple-semiconductor-manufacturing-capacity-by-2032-the-largest-rate-of-growth-in-the-world/.
[43]
MITRE Engenuity. American innovation, American growth: A vision for the National Semiconductor Technology Center[R]. McLean, VA: MITRE Engenuity, 2021.
[44]
National Institute of Standards and Technology. National Advanced Packaging Manufacturing Program[EB/OL]. (2024−02−01) [2025−08−06]. https://www.nist.gov/chips/research-development-programs/national-advanced-packaging-manufacturing-program.
[45]
CHIPS Research and Development Office. The vision for the CHIPS for America National Advanced Packaging Manufacturing Program[R]. Gaithersburg, MD: CHIPS Research and Development Office, 2023.
[46]
National Institute of Standards and Technology. Notice of funding opportunity: CHIPS Manufacturing USA Institute[EB/OL]. (2024−05−04) [2025−08−06]. https://www.nist.gov/chips/r%2526d-funding-opportunities/notice-funding-opportunity-chips-manufacturing-usa-institute.
[47]
National Institute of Standards and Technology. Biden-Harris administration awards Semiconductor Research Corporation Manufacturing Consortium Corporation $285M for new CHIPS Manufacturing USA Institute for Digital Twins, headquartered in North Carolina[EB/OL]. (2025−01−03) [2025−08−06]. https://www.nist.gov/news-events/news/2025/01/biden-harris-administration-awards-semiconductor-research-corporation.
[48]
National Institute of Standards and Technology. Metrology program[EB/OL]. (2024−01−31) [2024−05−15]. https://www.nist.gov/chips/research-development-programs/metrology-program.
[49]
National Institute of Standards and Technology. NIST SRM 3461 standard reference cantilevers[EB/OL]. (2023−04−14) [2025−08−06]. https://www.nist.gov/mml/mmsd/nanomechanical-properties-group/nist-srm-3461-standard-reference-cantilevers.
[50]
National Institute of Standards and Technology. Nanometer-scale planar reference materials[EB/OL]. (2024−06−01) [2025−08−06]. https://www.nist.gov/programs-projects/nanometer-scale-planar-reference-materials.
[51]
National Institute of Standards and Technology. METIS[EB/OL]. (2023−12−14) [2025−08−06]. https://www.nist.gov/programs-projects/metis.
[52]
National Institute of Standards and Technology. CHIPS metrology community[EB/OL]. (2024−08−21) [2025−08−06]. https://www.nist.gov/chips/metrology-community.
[53]
European Commission. European Chips Act[EB/OL]. (2023−09−21) [2025−08−06]. https://commission.europa.eu/strategy-and-policy/priorities-2019-2024/europe-fit-digital-age/european-chips-act_en.
[54]
Nippon. Japan making major investments in its semiconductor industry[EB/OL]. (2024−04−22) [2025−08−06]. https://www.nippon.com/en/japan-data/h01965/.
[55]
Brookings Institution. The renaissance of the Japanese semiconductor industry[EB/OL]. (2024−06−03) [2025−08−06]. https://www.brookings.edu/articles/the-renaissance-of-the-japanese-semiconductor-industry/.
[56]
Sohee Kim. South Korea lays out $470 billion plan to build chipmaking hub[EB/OL]. (2024−01−15) [2025−08−06]. https://www.bloomberg.com/news/articles/2024-01-15/south-korea-lays-out-470-billion-plan-to-build-chipmaking-hub.
[57]
注册资本3440亿!大基金三期来了与前两期有何变化?[EB/OL]. (2024−05−31) [2025−09−10]. https://jrj.wuhan.gov.cn/ztzl_57/xyrd/dcczbsc/202405/t20240531_2410056.shtml.
[58]
Triolo P. The evolution of China's semiconductor industry under U. S. export controls[EB/OL]. (2024−11−20) [2025−09−10]. https://americanaffairsjournal.org/2024/11/the-evolution-of-chinas-semiconductor-industry-under-u-s-export-controls.
[59]
上海市人民政府办公厅关于印发《上海市先进制造业发展“十四五”规划》的通知[EB/OL]. (2021−07−05) [2025−09−03]. https://www.shanghaiinvest.com/cn/viewfile.phpid=16674.
[60]
广州市半导体与集成电路产业发展行动计划(2022—2024年)[EB/OL]. (2022−03−17) [2025−09−04]. https://www.gz.gov.cn/zwgk/ghjh/zxgh/content/post_8188395.html.
[61]
Reuters. India gives green light to chip plants worth $15.2 bln[EB/OL]. (2024−02−29) [2025−08−06]. https://www.reuters.com/technology/india-approves-three-chipmaking-units-worth-152-bln-2024-02-29.
[62]
Yahya F. Role of the Southeast Asia semiconductor industry and the "chips" supply chain[EB/OL]. (2025−03−12) [2025−08−06]. https://moderndiplomacy.eu/2025/03/12/role-of-the-southeast-asia-semiconductor-industry-and-the-chips-supply-chain.
[63]
Federal Register. Implementation of additional export controls: Certain advanced computing and semiconductor manufacturing items; supercomputer and semiconductor end use; entity list modification[EB/OL]. (2022−10−13) [2025−08−06]. https://www.federalregister.gov/documents/2022/10/13/2022-21658/implementation-of-additional-export-controls-certain-advanced-computing-and-semiconductor.
2026年第44卷第13期
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doi: 10.3981/j.issn.1000-7857.2025.08.00025
  • 接收时间：2025-08-07
  • 首发时间：2026-07-27
  • 出版时间：2026-07-13
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  • 收稿日期：2025-08-07
  • 修回日期：2025-09-23
基金
国家重点研发计划项目(2022YFF0608105)
国家重点研发计划项目(2019YFF0216805)
作者信息
    中国计量科学研究院，北京 100029

通讯作者:

宫轲楠（通信作者），副研究员，研究方向为质量基础设施理论、技术经济评价，电子信箱：
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
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红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
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