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当下人工智能、5G与深空探测产业快速发展,芯片集成度持续攀升,芯片工作产热激增,传统风冷、水冷、热管等散热技术都需要额外消耗电能,大型数据中心散热能耗甚至占到总耗电量1/2以上,海量芯片余热直接散失,造成巨大能源浪费。

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    当下人工智能、5G与深空探测产业快速发展,芯片集成度持续攀升,芯片工作产热激增,传统风冷、水冷、热管等散热技术都需要额外消耗电能,大型数据中心散热能耗甚至占到总耗电量1/2以上,海量芯片余热直接散失,造成巨大能源浪费。

    . 让芯片边降温边发电. 科技导报, 2026 , 44 (11) : 12 -12 .
    . Science & Technology Review, 2026 , 44 (11) : 12 -12 .
    当下人工智能、5G与深空探测产业快速发展,芯片集成度持续攀升,芯片工作产热激增,传统风冷、水冷、热管等散热技术都需要额外消耗电能,大型数据中心散热能耗甚至占到总耗电量1/2以上,海量芯片余热直接散失,造成巨大能源浪费。
    2026年6月2日,中国科学院长春光学精密机械与物理研究所和长春工业大学联合攻关的片上热资源利用技术取得突破,科研团队依托水伏发电机体系,打造既能无源给芯片降温、又能把废热转化为可用电能的一体化器件。
    这项技术的核心中间层是一款生物基复合气凝胶材料,仅36.1 mg凝胶就能吸附近377 mg的水汽,兼顾优异导热与强吸湿能力。器件采用表面改性铝电极和ZIF-67复合碳布双电极结构。凝胶吸附空气中水汽后,内部无机盐解离形成钠离子、氯离子,在电极作用下定向移动产生电流;而芯片运行产生的热量会加快离子水解,进一步提升发电效率,形成产热助力散热、热量转化电能的良性循环。该器件工艺稳定性出色,6组器件并联输出电流36.12 mA、串联电压可达4.3 V,能够直接驱动小型用电元件。
    研究团队在Intel G3220商用处理器上完成商业CPU芯片实测应用验证,器件组贴附芯片表面后,CPU满载温度从93℃降至60℃以内,有效解决高温降频问题;并且,器件在电热损耗突出的深紫外LED芯片上也有突出表现,236 nm深紫外LED光电转化效率偏低,空载数秒内温度就能突破80℃,加装热利用器件后,芯片温度稳定控制在40℃以下,系统整体能源利用率大幅提升610.7%,余热转化的电能存入离子电池后,能够反向驱动LED工作,实现能源闭环利用。
    (来源于中国科技期刊卓越行动计划入选期刊:《Light: Science & Applications》,2026,15,261)

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    2种不同金属材料的力学参数

    Family
    属数
    Number of
    genus
    种数
    Number of
    species
    占总种数比例
    Percentage of
    total species (%)

    Genus
    种数
    Number of
    species
    占总种数比例
    Percentage of total
    species (%)
    鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
    小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
    多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
    红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
    小菇属 Mycena 11 5.26
    光柄菇属 Pluteus 5 2.39
    红菇属 Russula 17 8.13
    栓菌属 Trametes 5 2.39
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