Article(id=1242140687186075903, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1242140662385156262, articleNumber=null, orderNo=15, doi=10.3981/j.issn.1000-7857.2023.19.013, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1684684800000, receivedDateStr=2023-05-22, revisedDate=1689955200000, revisedDateStr=2023-07-22, acceptedDate=null, acceptedDateStr=null, onlineDate=1698393547290, onlineDateStr=2023-10-27, pubDate=1697126400000, pubDateStr=2023-10-13, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1698393547290, onlineIssueDateStr=2023-10-27, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1774079017679, creator=sys-migrate, updateTime=1774079017679, updator=sys-migrate, issue=Issue{id=1242140662385156262, tenantId=1146029695717560320, journalId=1146031591421210625, year='2023', volume='41', issue='19', pageStart='1', pageEnd='188', issueExtLink='null', onlineDate='null', pubDate='1697126400000', pubDateStr='2023-10-13', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=3, issueType=-1, specialIssue=null, createTime=1774079011768, creator='sys-migrate', updateTime=1774079011768, updator='sys-migrate', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=113, endPage=131, ext={EN=ArticleExt(id=1242140692370235681, articleId=1242140687186075903, tenantId=1146029695717560320, journalId=1146031591421210625, language=EN, title=Overview of the development status of chiplet technology, columnId=1242140672887698205, journalTitle=Science & Technology Review, columnName=Innovation leads selfreliance and selfimprovement—creating a source of high-quality technological, runingTitle=null, highlight=null, articleAbstract=Chiplet technology is a new generation of integrated circuit technology that has emerged in recent years. It has been widely recognized by the industry due to its excellent characteristics such as improving yield, breaking the limit of reticle size, flexibility in chip architecture, and standardization of IP supply chain. To further promote the development of chiplet technology in China, this article summarizes the application scenarios of chiplet technology, analyzes various core component technologies, elaborates on various technical challenges that may arise in the development of chiplet technology, reviews the development of China’s chiplet standards, and finally, puts forward some suggestions for the development of chiplet technology in China., authors=XIANG Shaolin , GUO Mao , PU Bo , FANG Liulu , LIU Shujuan , WANG Shaoyong , KONG Xianwei , ZHENG Tuo , LIU Jun ,ZHAO Ming⁹, HAO Qinfen^9, 10*, SUN Ninghui¹⁰, authorsList=XIANG Shaolin,GUO Mao,PU Bo,FANG Liulu,LIU Shujuan,WANG Shaoyong,KONG Xianwei,ZHENG Tuo,LIU Jun,ZHAO Ming,HAO Qinfen,SUN Ninghui, authorCompany=1. Hefei Geneturino Microelectronics Co., Ltd., Hefei 230041, China
2. Shanghai Professional Technical Service Platform of Microanalysis for Microelectronics Materials and Components, Shanghai
201210, China
3. DeTooLIC Technology, Co., Ltd., Ningbo 315800, China
4. Akrostar Technology Co., Ltd., Zhuhai 519031, China
5. Hubei Yangtze Memory Laboratories, Wuhan 430205, China
6. xFusion Digital Technologies Co., Ltd., Dongguan 523106, China
7. China Electronics Standardization Institute, Beijing 100007, China
8. Xpeedic Co., Ltd., Shanghai 201210, China
9. Wuxi Institute of Interconnect Technology, Wuxi 214104, China
10. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=SmFW/GEOSI8Cz3995lA/FA==, pdfFileSize=4705158, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1242140690906423575, articleId=1242140687186075903, tenantId=1146029695717560320, journalId=1146031591421210625, language=CN, title=Chiplet技术发展现状, columnId=1242140671348388621, journalTitle=科技导报, columnName=专题：创新引领 自立自强——打造高质量科技创新策源地, runingTitle=null, highlight=null, articleAbstract=Chiplet（芯粒）技术是近年来兴起的新一代集成电路技术，因其具有提升良率、突破光罩极限、芯片架构灵活、芯片组件技术供应货架化等特点，受到产业界的广泛重视。为进一步推动chiplet技术在中国的发展，梳理了chiplet技术的应用场景，分析了chiplet中的各种核心组件技术，阐述了在chiplet技术开发中可能出现的各种技术挑战，回顾了中国chiplet标准的发展情况，最后针对中国发展chiplet技术提出了建议。, authors=项少林¹，郭茂²，蒲菠³，方刘禄⁴，刘淑娟⁵，王少勇⁶，孔宪伟⁷，郑拓⁸，刘军⁹，赵明⁹，郝沁汾^9,10*，孙凝晖¹⁰, authorsList=项少林，郭茂，蒲菠，方刘禄，刘淑娟，王少勇，孔宪伟，郑拓，刘军，赵明，郝沁汾，孙凝晖, authorCompany=1. 合肥复睿微电子有限公司，合肥 230041
2. 上海市微电子材料与元器件微分析专业技术服务平台，上海 201210
3. 宁波德图科技有限公司，宁波 315800
4. 芯耀辉科技有限公司，珠海 519031
5. 湖北江城实验室，武汉 430205
6. 超聚变数字技术有限公司，东莞 523106
7. 中国电子技术标准化研究院，北京 100007
8. 芯和半导体科技（上海）股份有限公司，上海 201210
9. 无锡芯光互连技术研究院，无锡 214104
10. 中国科学院计算技术研究所，北京 100086, correspAuthors=null, authorNote=项少林，架构师，研究方向为多核处理器，电子信箱：erick.xiang@e-genesys.com；郭茂，正高级工程师，研究方向为微电子先进封装，电子信箱：gthriving@hotmail.com；蒲菠，正高级工程师，研究方向为电子设计自动化（EDA），电子信箱：pubo@detooltech.com；方刘禄，高级工程师，研究方向为高速接口电路设计，电子信箱：jacky.fang@akrostar-tech.com；刘淑娟，工程师，研究方向为三维集成工艺，电子信箱：joy_liu@yangtzelabs.ac.cn；王少勇，高级工程师，研究方向为计算机系统结构，电子信箱：wangshaoyong@xfusion. com；孔宪伟，高级工程师，研究方向为集成电路测试，电子信箱：kongxw@cesi.cn；郑拓，工程师，研究方向为微电子先进封装设计，电子信箱：tuo.zheng@xpeedic.com；刘军，工程师，研究方向为半导体先进封装，电子信箱：liujun@iicit.net；赵明，工程师，研究方向为芯粒标准技术，电子信箱：zhaoming@iicit.net；孙凝晖，研究员，研究方向为计算机系统结构、高性能计算机，电子信箱：snh@ict.ac.cn, correspAuthorsNote=郝沁汾（通信作者），研究员，研究方向为计算机系统结构，电子信箱：haoqinfen@ict.ac.cn, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=LcYVS8qrlAh+VyoW36pY1Q==, pdfFileSize=4705158, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, 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