Article(id=1242139315300544642, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1242139306463142588, articleNumber=null, orderNo=8, doi=10.3981/j.issn.1000-7857.2021.14.002, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1589126400000, receivedDateStr=2020-05-11, revisedDate=1616947200000, revisedDateStr=2021-03-29, acceptedDate=null, acceptedDateStr=null, onlineDate=1630991387837, onlineDateStr=2021-09-07, pubDate=1627401600000, pubDateStr=2021-07-28, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1630991387837, onlineIssueDateStr=2021-09-07, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1774078690595, creator=sys-migrate, updateTime=1774078690595, updator=sys-migrate, issue=Issue{id=1242139306463142588, tenantId=1146029695717560320, journalId=1146031591421210625, year='2021', volume='39', issue='14', pageStart='0', pageEnd='172', issueExtLink='null', onlineDate='null', pubDate='1627401600000', pubDateStr='2021-07-28', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=3, issueType=-1, specialIssue=null, createTime=1774078688489, creator='sys-migrate', updateTime=1774078688489, updator='sys-migrate', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=20, endPage=29, ext={EN=ArticleExt(id=1242139317640966293, articleId=1242139315300544642, tenantId=1146029695717560320, journalId=1146031591421210625, language=EN, title=Development and trend of the third generation semiconductor industry, columnId=1242139317506748563, journalTitle=Science & Technology Review, columnName=Exclusive: Innovation and development of the third generation semiconductor, runingTitle=null, highlight=null, articleAbstract=The third generation semiconductor is in the frontier of the global semiconductor technology research and is the focus of the new industry competition. This paper reviews the development of the third generation semiconductor, China's scientific and technological support policies for the third generation semiconductor industry, and the current risks and existing problems. The exploration and the practice of the third-generation strategic alliance for the technological innovation in the semiconductor industry are discussed, including promoting the integration of the industry-university-research innovation consortium with major national projects, promoting the construction of the national public platform and industrial innovation ecology, formulating the group standards and promoting the construction of the related testing platforms, promoting the integration and the development of large, medium and small enterprises through innovative and entrepreneurial services, and the international cooperation. In view of the current international situation and the opportunities and challenges faced by China's third-generation semiconductor industry, this paper puts forward five suggestions:Starting the national 2030 major project as soon as possible, aiming at the major needs of the country and exploring a new national system; consolidating the basic platforms such as the public R&D and services that support the industrial chain; accelerating the improvement of the industrial ecological environment; implementing the application demonstration projects and bringing into full play the leading role of the demand side in the industry; constructing the network chain of the science and technology capital, and realizing the pulling function of the national credit on the R&D chain, the industrial chain and the capital chain., authors=WU Ling, ZHAO Lubing, authorsList=WU Ling, ZHAO Lubing, authorCompany=China Advanced Semiconductor Industry Innovation Alliance, Beijing 100083, China, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=HJBqLZKQO3WVr66dwkKNEQ==, pdfFileSize=687919, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1242139316604973192, articleId=1242139315300544642, tenantId=1146029695717560320, journalId=1146031591421210625, language=CN, title=第三代半导体产业发展与趋势展望, columnId=1242139316504306398, journalTitle=科技导报, columnName=专题:第三代半导体的创新发展, runingTitle=null, highlight=null, articleAbstract=第三代半导体是全球半导体技术研究前沿和新的产业竞争焦点。综述了第三代半导体发展现状、中国对第三代半导体产业的科技支持政策及当前面临的风险和存在的问题。阐述了第三代半导体产业技术创新战略联盟的探索实践,包括推动产学研用创新联合体对接国家重大项目、推动国家级公共平台和产业创新生态建设、制定团体标准并推动相关检测平台建设、通过创新创业服务促进大中小企业融通发展、精准深度国际合作等。针对当前国际形势及中国第三代半导体产业面临的机遇和挑战,提出5点建议:尽快启动国家2030重大项目,通过国家第三代半导体技术创新中心形成合力,瞄准国家重大需求,探索新型举国体制;夯实支撑产业链的公共研发与服务等基础平台;加速推动产业生态环境的完善;组织实施应用示范工程,充分发挥需求端对产业的带动作用;构建科技资本网链,实现国家信用对研发链、产业链和资本链的拉动。, authors=吴玲, 赵璐冰, authorsList=吴玲, 赵璐冰, authorCompany=第三代半导体产业技术创新战略联盟, 北京 100083, correspAuthors=null, authorNote=吴玲,研究员,研究方向为半导体材料,电子信箱:wuling@china-led.net, correspAuthorsNote=赵璐冰(通信作者),副研究员,研究方向为半导体材料,电子信箱:zhaolb@china-led.net, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=17yAYvFilWiBRV31vkhCBw==, pdfFileSize=687919, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null)}, authors=null, keywords=[Keyword(id=1242139316118433925, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=CN, orderNo=1, keyword=第三代半导体产业), Keyword(id=1242139316202316504, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=CN, orderNo=1, keyword=氮化镓), Keyword(id=1242139316286202586, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=CN, orderNo=1, keyword=碳化硅), Keyword(id=1242139316395254493, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=CN, orderNo=1, keyword=产业生态), Keyword(id=1242139317108289676, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=EN, orderNo=1, keyword=third generation semiconductor industry), Keyword(id=1242139317196370061, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=EN, orderNo=1, keyword=GaN), Keyword(id=1242139317313810574, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=EN, orderNo=1, keyword=SiC), Keyword(id=1242139317397696656, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242139315300544642, language=EN, orderNo=1, keyword=industrial ecology)], refs=null, funds=null, companyList=null, figs=null, attaches=null, journal=Journal(id=1125356956822126595, delFlag=0, nameCn=科技导报, nameEn=Science & Technology Review, nameHistory1=null, nameHistory2=null, issn=1000-7857, eissn=, cn=11-1421/N, coden=null, periodic=3, language=CN, oaType=0, ccby=null, superviseOffice=null, ownerOffice=null, pubOffice=null, editorOffice=null, officeType=null, aims=null, clcCode=null, officeProv=null, officeCity=null, officeAddr=null, officeZip=null, officeEmail=null, officePhone=null, editDirector=null, officeDirector=null, officeDirectorPhone=null, officeStaffNum=null, officeEmpNum=null, coverPicUrl=wfghvu3bhh/dKxuZ+ucVHA==, journalPrice=null, startedYear=null, abbrevIsoEn=Sci Technol Rev, journalRemark=null, publicationField=null, createdTime=null, updatedTime=1774230116083, createdBy=null, updatedBy=13041195026, firstLetterCn=S, firstLetterEn=S, subjectCode=Natural Sciences, subjectName=自然科学, subjectCodeEn=Natural Sciences, subjectNameEn=null, picCn=wfghvu3bhh/dKxuZ+ucVHA==, picEn=yjSfclmpNm7ihn9NbTZ69g==, jcr=null, cjcr=null, exts=[JournalExt(id=1242774439910290156, language=CN, name=科技导报, nameHistory1=null, nameHistory2=null, managedBy=中国科学技术协会, sponsoredBy=中国科学技术协会, publishedBy=科技导报社, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=http://www.kjdb.org/CN/home, createdTime=1774230116107, updatedTime=1774230116107, createdBy=13041195026, updatedBy=13041195026, submissionGuidelinesUrl=http://www.kjdb.org/CN/column/column7.shtml, submissionAuthorUrl=https://kjdbauthor.cast.org.cn/webm, submissionEditorUrl=https://kjdbeditor.cast.org.cn/webm/, submissionReviewUrl=https://kjdbauthor.cast.org.cn/webm, submissionCeEditorUrl=https://kjdbeditor.cast.org.cn/webm/, submissionAeEditorUrl=https://kjdbeditor.cast.org.cn/webm/, option={"copyright":""}), JournalExt(id=1242774439960621805, language=EN, name=Science & Technology Review, nameHistory1=null, nameHistory2=null, managedBy=, sponsoredBy=, publishedBy=, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=http://www.kjdb.org/EN/home, createdTime=1774230116119, updatedTime=1774230116119, createdBy=13041195026, updatedBy=13041195026, submissionGuidelinesUrl=http://www.kjdb.org/EN/column/column7.shtml, submissionAuthorUrl=https://kjdbauthor.manuscriptcloud.com/login, submissionEditorUrl=https://kjdbeditor.manuscriptcloud.com/login, submissionReviewUrl=https://kjdbauthor.manuscriptcloud.com/login, submissionCeEditorUrl=https://kjdbeditor.manuscriptcloud.com/login, submissionAeEditorUrl=https://kjdbeditor.manuscriptcloud.com/login, option={"copyright":""})], databaseList=null, tenantJournalId=1146031591421210625, websiteList=[Website(id=1146104741081231361, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1146031591421210625, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/kjdb/CN, language=CN, createTime=1751182263881, createBy=18614031015, updateTime=1751778001962, updateBy=18614031015, name=科技导报, tplId=1146099689490845704, title=科技导报, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1148021146403992296, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=articleTextType, value=kx, createTime=1751639170504, updateTime=1751639170504, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146378826469, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=banner, value=null, createTime=1751639170498, updateTime=1751639170498, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146366243556, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=logo, value=https://castjournals.cast.org.cn/joweb/kjdb/CN/file/pic?fileId=9GHSf7eGlIPH0Tv/OOdstA==, createTime=1751639170495, updateTime=1751639170495, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146395603687, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/kjdb/CN/file/pic, createTime=1751639170502, updateTime=1751639170502, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146387215078, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_cn_619/, createTime=1751639170500, updateTime=1751639170500, creator=18614031015, updator=18614031015)]), Website(id=1146105254833139715, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1146031591421210625, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/kjdb/EN, language=EN, createTime=1751182386363, createBy=18614031015, updateTime=1753500121937, updateBy=18614031015, name=科技导报, tplId=1146101810881728533, title=Science & Technology Review, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1155838567709528217, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=articleTextType, value=kx, createTime=1753502988984, updateTime=1753502988984, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567692750998, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=banner, value=null, createTime=1753502988980, updateTime=1753502988980, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567688556693, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=logo, value=https://castjournals.cast.org.cn/joweb/kjdb/EN/file/pic?fileId=9GHSf7eGlIPH0Tv/OOdstA==, createTime=1753502988979, updateTime=1753502988979, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567705333912, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/kjdb/EN/file/pic, createTime=1753502988983, updateTime=1753502988983, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567701139607, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_en_623/, createTime=1753502988982, updateTime=1753502988982, creator=18614031015, updator=18614031015)])], journalTitle=科技导报, weixinUrl=null, journalUrl=null, iacademicId=null, status=1, seqNo=null, journalTitleEn=Science & Technology Review, journalPhotoCn=wfghvu3bhh/dKxuZ+ucVHA==, journalPhotoEn=yjSfclmpNm7ihn9NbTZ69g==, journalFirstLetter=S, journalRecommend=null, journalNew=null, journalCollection=1, jcrJf=null, cjcrJf=0.91, jcrJfStr=null, cjcrJfStr=null, submissionFirstDecision=null, sciSubjectClassification=null, casSubjectClassification=null, citeScore=null, totalCitationFrequency=null, icpCode=null, psCode=null, advertisingLicenseCode=null, copyrightInformation=null, country=null, option=, provinceCode=null, provinceName=null, collectFlag=false, interPubPlatform=null, interPubPlatformUrl=null), detailUrlCn=https://castjournals.cast.org.cn/joweb/kjdb/CN/10.3981/j.issn.1000-7857.2021.14.002, detailUrlEn=https://castjournals.cast.org.cn/joweb/kjdb/EN/10.3981/j.issn.1000-7857.2021.14.002, pdfUrlCn=https://castjournals.cast.org.cn/joweb/kjdb/CN/PDF/10.3981/j.issn.1000-7857.2021.14.002, pdfUrlEn=https://castjournals.cast.org.cn/joweb/kjdb/EN/PDF/10.3981/j.issn.1000-7857.2021.14.002, aliStartDate=null, aliEndDate=null, collectionFlag=false, citedCount=null, citedUrl=null, previewStatus=0, delFlag=0, hasFullText=0, orderTime=1627401600000, fullTextJson=null, articleText=null, reference=null)
科技导报
| 专题:第三代半导体的创新发展 2021, 39(14): 20-29
第三代半导体产业发展与趋势展望
全屏
吴玲, 赵璐冰
作者信息
第三代半导体产业技术创新战略联盟, 北京 100083
通讯作者:
赵璐冰(通信作者),副研究员,研究方向为半导体材料,电子信箱:zhaolb@china-led.net
Development and trend of the third generation semiconductor industry
Affiliations
出版时间: 2021-07-28
doi: 10.3981/j.issn.1000-7857.2021.14.002
文章导航
第三代半导体是全球半导体技术研究前沿和新的产业竞争焦点。综述了第三代半导体发展现状、中国对第三代半导体产业的科技支持政策及当前面临的风险和存在的问题。阐述了第三代半导体产业技术创新战略联盟的探索实践,包括推动产学研用创新联合体对接国家重大项目、推动国家级公共平台和产业创新生态建设、制定团体标准并推动相关检测平台建设、通过创新创业服务促进大中小企业融通发展、精准深度国际合作等。针对当前国际形势及中国第三代半导体产业面临的机遇和挑战,提出5点建议:尽快启动国家2030重大项目,通过国家第三代半导体技术创新中心形成合力,瞄准国家重大需求,探索新型举国体制;夯实支撑产业链的公共研发与服务等基础平台;加速推动产业生态环境的完善;组织实施应用示范工程,充分发挥需求端对产业的带动作用;构建科技资本网链,实现国家信用对研发链、产业链和资本链的拉动。
第三代半导体产业
/
氮化镓
/
碳化硅
/
产业生态
The third generation semiconductor is in the frontier of the global semiconductor technology research and is the focus of the new industry competition. This paper reviews the development of the third generation semiconductor, China's scientific and technological support policies for the third generation semiconductor industry, and the current risks and existing problems. The exploration and the practice of the third-generation strategic alliance for the technological innovation in the semiconductor industry are discussed, including promoting the integration of the industry-university-research innovation consortium with major national projects, promoting the construction of the national public platform and industrial innovation ecology, formulating the group standards and promoting the construction of the related testing platforms, promoting the integration and the development of large, medium and small enterprises through innovative and entrepreneurial services, and the international cooperation. In view of the current international situation and the opportunities and challenges faced by China's third-generation semiconductor industry, this paper puts forward five suggestions:Starting the national 2030 major project as soon as possible, aiming at the major needs of the country and exploring a new national system; consolidating the basic platforms such as the public R&D and services that support the industrial chain; accelerating the improvement of the industrial ecological environment; implementing the application demonstration projects and bringing into full play the leading role of the demand side in the industry; constructing the network chain of the science and technology capital, and realizing the pulling function of the national credit on the R&D chain, the industrial chain and the capital chain.
third generation semiconductor industry
/
GaN
/
SiC
/
industrial ecology
吴玲, 赵璐冰.
第三代半导体产业发展与趋势展望.
科技导报,
2021
, 39
(14)
: 20
-29
.
DOI: 10.3981/j.issn.1000-7857.2021.14.002
WU Ling, ZHAO Lubing.
Development and trend of the third generation semiconductor industry[J].
Science & Technology Review ,
2021
, 39
(14)
: 20
-29
.
DOI: 10.3981/j.issn.1000-7857.2021.14.002
2021年第39卷第14期
PDF下载
479
74
引用本文
BibTeX
文章信息
doi: 10.3981/j.issn.1000-7857.2021.14.002
接收时间:2020-05-11
首发时间:2021-09-07
出版时间:2021-07-28
收稿日期:2020-05-11
修回日期:2021-03-29
通讯作者:
赵璐冰(通信作者),副研究员,研究方向为半导体材料,电子信箱:zhaolb@china-led.net
https://castjournals.cast.org.cn/joweb/kjdb/CN/10.3981/j.issn.1000-7857.2021.14.002
复制链接
引用本文
BibTeX
2种不同金属材料的力学参数
科 Family 属数 Number of genus 种数 Number of species 占总种数比例 Percentage of total species (%) 属 Genus 种数 Number of species 占总种数比例 Percentage of total species (%) 鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78 小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39 多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39 红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87 小菇属 Mycena 11 5.26 光柄菇属 Pluteus 5 2.39 红菇属 Russula 17 8.13 栓菌属 Trametes 5 2.39
关闭全屏
BibTeX
EndNote
RefWorks
TxT