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This paper reviews four main types of ECAs based on different conductive fillers, as well as the research progresses of the ECAs from three aspects:The electrical conductivity, the contact resistance and the mechanical property. This applications of the ECAs may open up the possibility of developing the next generation innovative bio-nano electronic devices., authors=ZHANG Wei, YAO Jianji, ZHAN Ke, XING Junjie, WANG Wenjie, authorsList=ZHANG Wei, YAO Jianji, ZHAN Ke, XING Junjie, WANG Wenjie, authorCompany=School of Materials Science and Engineering, Southeast University, Nanjing 211189, China, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=hIMwvEckPwI7SNId6SA+0A==, pdfFileSize=1364059, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1242136858755408230, articleId=1242136856775696729, tenantId=1146029695717560320, journalId=1146031591421210625, language=CN, title=导电胶研究进展, columnId=1242116902361830275, journalTitle=科技导报, columnName=专题论文, runingTitle=null, highlight=null, articleAbstract=导电胶作为新兴的电子产品黏结剂,具有许多传统黏结剂难以具备的优势。本文介绍了导电胶的组成及4种主要的导电机制;根据不同种类导电填料,阐述了导电胶的研究现状;针对导电胶的缺陷,从导电性能、接触电阻稳定性及力学性能3个方面综述了导电胶改性研究的进展;探讨了导电胶的发展趋势,展望了导电胶的发展前景。, authors=章炜, 姚建吉, 詹科, 邢俊杰, 王文杰, authorsList=章炜, 姚建吉, 詹科, 邢俊杰, 王文杰, authorCompany=东南大学材料科学与工程学院, 南京 211189, correspAuthors=null, authorNote=章炜,副教授,研究方向为柔性储能器件、功能界面纳米材料、高分子导电材料的合成和表面改性等,电子信箱:w69zhang@seu.edu.cn, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=9An+UdjrwdAkLdHo+ZG0ug==, pdfFileSize=1364059, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null)}, authors=null, keywords=[Keyword(id=1242136858377920864, 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导电胶研究进展
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科技导报 | 专题论文 2018,36(10): 56-65
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科技导报 |专题论文 2018 , 36 (10) : 56 -65
导电胶研究进展
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章炜, 姚建吉, 詹科, 邢俊杰, 王文杰
作者信息
    东南大学材料科学与工程学院, 南京 211189
作者简介:
章炜,副教授,研究方向为柔性储能器件、功能界面纳米材料、高分子导电材料的合成和表面改性等,电子信箱:w69zhang@seu.edu.cn
Research progress of conductive adhesives
  • ZHANG Wei, YAO Jianji, ZHAN Ke, XING Junjie, WANG Wenjie
  • Affiliations
      School of Materials Science and Engineering, Southeast University, Nanjing 211189, China
    出版时间: 2018-05-28 doi: 10.3981/j.issn.1000-7857.2018.10.006
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    导电胶作为新兴的电子产品黏结剂,具有许多传统黏结剂难以具备的优势。本文介绍了导电胶的组成及4种主要的导电机制;根据不同种类导电填料,阐述了导电胶的研究现状;针对导电胶的缺陷,从导电性能、接触电阻稳定性及力学性能3个方面综述了导电胶改性研究的进展;探讨了导电胶的发展趋势,展望了导电胶的发展前景。
    导电胶  /  导电机制  /  分类  /  改性研究
    As the emerging adhesives for electronics, the electronical conductive adhesives (ECAs) enjoy many advantages,such as the lower processing temperature, the simpler processing procedures and the finer-pitch interconnection in comparison with the traditional soldering technology. This paper reviews four main types of ECAs based on different conductive fillers, as well as the research progresses of the ECAs from three aspects:The electrical conductivity, the contact resistance and the mechanical property. This applications of the ECAs may open up the possibility of developing the next generation innovative bio-nano electronic devices.
    conductive adhesive  /  conductive mechanism  /  classification  /  modification research
    章炜, 姚建吉, 詹科, 邢俊杰, 王文杰. 导电胶研究进展. 科技导报, 2018 , 36 (10) : 56 -65 . DOI: 10.3981/j.issn.1000-7857.2018.10.006
    ZHANG Wei, YAO Jianji, ZHAN Ke, XING Junjie, WANG Wenjie. Research progress of conductive adhesives[J]. Science & Technology Review, 2018 , 36 (10) : 56 -65 . DOI: 10.3981/j.issn.1000-7857.2018.10.006

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    doi: 10.3981/j.issn.1000-7857.2018.10.006
    • 接收时间:2018-03-29
    • 首发时间:2018-05-22
    • 出版时间:2018-05-28
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    • 收稿日期:2018-03-29
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    2种不同金属材料的力学参数
    科
    Family
    属数
    Number of
    genus
    种数
    Number of
    species
    占总种数比例
    Percentage of
    total species (%)
    属
    Genus
    种数
    Number of
    species
    占总种数比例
    Percentage of total
    species (%)
    鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
    小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
    多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
    红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
    小菇属 Mycena 11 5.26
    光柄菇属 Pluteus 5 2.39
    红菇属 Russula 17 8.13
    栓菌属 Trametes 5 2.39
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