Article(id=1242136794179907665, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1242136774428926011, articleNumber=null, orderNo=12, doi=10.3981/j.issn.1000-7857.2018.07.010, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1484496000000, receivedDateStr=2017-01-16, revisedDate=1519833600000, revisedDateStr=2018-03-01, acceptedDate=null, acceptedDateStr=null, onlineDate=1524796871023, onlineDateStr=2018-04-27, pubDate=1523548800000, pubDateStr=2018-04-13, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1524796871023, onlineIssueDateStr=2018-04-27, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1774078089513, creator=sys-migrate, updateTime=1774078089513, updator=sys-migrate, issue=Issue{id=1242136774428926011, tenantId=1146029695717560320, journalId=1146031591421210625, year='2018', volume='36', issue='7', pageStart='1', pageEnd='96', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=3, issueType=-1, specialIssue=null, createTime=1774078084807, creator=sys-migrate, updateTime=1774078084807, updator=sys-migrate, preIssue=null, nextIssue=null, ext=null, issueFiles=null}, startPage=64, endPage=73, ext={EN=ArticleExt(id=1242136799246622884, articleId=1242136794179907665, tenantId=1146029695717560320, journalId=1146031591421210625, language=EN, title=Current status and prospects of electrochemical migration research, columnId=1242116810380743325, journalTitle=Science & Technology Review, columnName=Reviews, runingTitle=null, highlight=null, articleAbstract=Currently, electronic components are becoming more integrated and more miniaturized, which substantially increases the sensitivity of electrochemical migration (ECM). In this paper, the current status and prospects of electrochemical migration research are reviewed in terms of research methods, failure mechanism and protection methods. In addition, a newly method that improves the sensitivity of ECM is also provided., correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=5M0rnCberC1IuVubJkitNg==, pdfFileSize=2669681, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, authorCompany=1. Key Laboratory for Corrosion and Protection of the Ministry of Education;Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China;
2. Service Center for Societies, China Association for Science and Technology, Beijing 100081, China, fund=null, authors=YI Pan¹, DONG Chaofang¹, XIAO Kui¹, WEI Dan², authorsList=YI Pan, DONG Chaofang, XIAO Kui, WEI Dan), CN=ArticleExt(id=1242136796809732256, articleId=1242136794179907665, tenantId=1146029695717560320, journalId=1146031591421210625, language=CN, title=电化学迁移研究进展, columnId=1242134377686180284, journalTitle=科技导报, columnName=综述, runingTitle=null, highlight=null, articleAbstract=随着电子电路和元器件的集成化、小型化，电子元器件中间距急剧减小，导致其对电化学迁移更加敏感。本文从研究方法、失效机制方面，综述当前电子元器件中电化学迁移行为的研究进展，探讨改善电子元器件电化学迁移敏感性的方法，提出更为行之有效的电化学迁移防护方法。, correspAuthors=null, authorNote=易盼,博士研究生,研究方向为电子元器件的腐蚀与防护,电子信箱:bkyipan@126.com, correspAuthorsNote=董超芳(通信作者),教授,研究方向为金属材料腐蚀与防护,电子信箱:cfdong@ustb.edu.cn, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=y5TSO2zF3hCJphO6umDE7w==, pdfFileSize=2669681, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, authorCompany=1. 北京科技大学腐蚀与防护中心, 腐蚀与防护教育部重点实验室, 北京 100083;
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