Article(id=1242140344188478295, tenantId=1146029695717560320, journalId=1146031591421210625, issueId=1242140333585277757, articleNumber=null, orderNo=4, doi=10.3981/j.issn.1000-7857.2023.05.002, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1671724800000, receivedDateStr=2022-12-23, revisedDate=1675958400000, revisedDateStr=2023-02-10, acceptedDate=null, acceptedDateStr=null, onlineDate=1679884877203, onlineDateStr=2023-03-27, pubDate=1678636800000, pubDateStr=2023-03-13, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1679884877203, onlineIssueDateStr=2023-03-27, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1774078935902, creator=sys-migrate, updateTime=1774078935902, updator=sys-migrate, issue=Issue{id=1242140333585277757, tenantId=1146029695717560320, journalId=1146031591421210625, year='2023', volume='41', issue='5', pageStart='1', pageEnd='124', issueExtLink='null', onlineDate='null', pubDate='1678636800000', pubDateStr='2023-03-13', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=3, issueType=-1, specialIssue=null, createTime=1774078933375, creator='sys-migrate', updateTime=1774078933375, updator='sys-migrate', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=15, endPage=26, ext={EN=ArticleExt(id=1242140347632005366, articleId=1242140344188478295, tenantId=1146029695717560320, journalId=1146031591421210625, language=EN, title=Progress of the interconnected copper electroplating in TSV (through silicon via) of advanced packaging, columnId=1242140346973496174, journalTitle=Science & Technology Review, columnName=Exclusive: Boost China's Strength in Manufacturing, runingTitle=null, highlight=null, articleAbstract=As Moore's law approaches to the limit, "More than Moore" for 2.5D/3D packaging is entering its historical arena. Through silicon via (TSV) is one of the important representatives in high-end electronics advanced packaging. This paper focuses on the copper plating process which realizes electrical interconnection in TSV technology and systematically summarizes the composition of the formula of copper plating solutions. The key difficulty of the copper plating process lies in the defect-free filling of TSV, and the selection of additives is particularly important. A guide for selection of electroplating solution for TSV metallization electroplating process is then provided. In addition, the external electric field and other process conditions imposed on the plating solution during the plating process will also affect the quality of filling vias. Therefore, TSV copper plating processes of the research teams at home and abroad are summarized for selection of a copper plating process. Finally, the characterization methods for studying the action mechanism of additives in electroplating solutions based on computational simulation and electrochemical testing are briefly summarized, and the progress and shortcomings of current research methods on additives in electroplating solution are discussed., authors=CHEN Kexin^1,3, GAO Liyin^1,2*, XU Zengguang², LI Zhe¹, LIU Zhiquan^1,2, authorsList=CHEN Kexin, GAO Liyin, XU Zengguang, LI Zhe, LIU Zhiquan, authorCompany=1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen 518103, China
2. Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
3. School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=VSevxtvPuZYDvK4/LC+a/g==, pdfFileSize=1561161, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1242140346642146154, articleId=1242140344188478295, tenantId=1146029695717560320, journalId=1146031591421210625, language=CN, title=先进封装中硅通孔（TSV）铜互连电镀研究进展, columnId=1242140345681650525, journalTitle=科技导报, columnName=专题：制造强国建设, runingTitle=null, highlight=null, articleAbstract=随着摩尔定律接近极限，超摩尔定律的2.5D/3D封装登上历史舞台。硅通孔（through silicon via，TSV）是实现多维封装纵向互连的关键技术，也是目前高端电子制造领域的重要代表之一。概述了TSV铜互连的关键技术，包括铜电镀液、电镀工艺和研究方法。认为TSV电镀铜技术难点在于无缺陷填充，而添加剂是实现无缺陷填充的关键组分。归纳了TSV电镀铜的加速剂、抑制剂以及整平剂等多种添加剂，指出随着 TSV深宽比的不断提高，对电镀工艺提出了更高的要求。介绍了仿真计算、电化学测试等电镀液添加剂作用机理的研究手段。随着研究手段的不断升级，对添加剂作用机理研究更加深入透彻，确保了高深宽比TSV镀铜的无缺陷填充，进一步促进了先进封装的发展。, authors=谌可馨^1,3，高丽茵^1,2*，许增光²，李哲¹，刘志权^1,2, authorsList=谌可馨，高丽茵，许增光，李哲，刘志权, authorCompany=1. 深圳先进电子材料国际创新研究院，深圳 518103
2. 中国科学院深圳先进技术研究院，深圳 518055
3. 中国科学技术大学材料科学与工程学院，沈阳 110016, correspAuthors=null, authorNote=谌可馨，博士研究生，研究方向为微电子封装材料，电子信箱：kx.chen@siat.ac.cn, correspAuthorsNote=高丽茵（通信作者），副研究员，研究方向为微电子封装材料及服役可靠性，电子信箱：ly.gao@siat.ac.cn, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=Nyyut9l8FsizsP6v7zqtWg==, pdfFileSize=1561161, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=国家自然科学基金项目（62104243，62274172）；广东省自然科学基金项目（2022A1515011485）)}, authors=null, keywords=[Keyword(id=1242140346159801186, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=CN, orderNo=1, keyword=硅通孔), Keyword(id=1242140346235298660, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=CN, orderNo=1, keyword=电镀铜), Keyword(id=1242140346323379045, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=CN, orderNo=1, keyword=添加剂), Keyword(id=1242140346411459430, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=CN, orderNo=1, keyword=填孔工艺), Keyword(id=1242140346482762600, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=CN, orderNo=1, keyword=表征方法), Keyword(id=1242140347162243310, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=EN, orderNo=1, keyword=TSV), Keyword(id=1242140347233546479, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=EN, orderNo=1, keyword=copper electroplating), Keyword(id=1242140347309043952, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=EN, orderNo=1, keyword=additives), Keyword(id=1242140347388735730, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=EN, orderNo=1, keyword=filling process), Keyword(id=1242140347481010419, tenantId=1146029695717560320, journalId=1146031591421210625, articleId=1242140344188478295, language=EN, orderNo=1, keyword=characterization method)], refs=null, funds=null, companyList=null, figs=null, attaches=null, journal=Journal(id=1125356956822126595, delFlag=0, nameCn=科技导报, nameEn=Science & Technology Review, nameHistory1=null, nameHistory2=null, issn=1000-7857, eissn=, cn=11-1421/N, coden=null, periodic=3, language=CN, oaType=0, ccby=null, superviseOffice=null, ownerOffice=null, pubOffice=null, editorOffice=null, officeType=null, aims=null, clcCode=null, officeProv=null, officeCity=null, officeAddr=null, officeZip=null, officeEmail=null, officePhone=null, editDirector=null, officeDirector=null, officeDirectorPhone=null, officeStaffNum=null, officeEmpNum=null, coverPicUrl=wfghvu3bhh/dKxuZ+ucVHA==, journalPrice=null, startedYear=null, abbrevIsoEn=Sci Technol Rev, journalRemark=null, publicationField=null, createdTime=null, updatedTime=1774230116083, createdBy=null, updatedBy=13041195026, firstLetterCn=S, firstLetterEn=S, subjectCode=Natural Sciences, subjectName=自然科学, subjectCodeEn=Natural Sciences, subjectNameEn=null, picCn=wfghvu3bhh/dKxuZ+ucVHA==, picEn=yjSfclmpNm7ihn9NbTZ69g==, jcr=null, cjcr=null, exts=[JournalExt(id=1242774439910290156, language=CN, name=科技导报, nameHistory1=null, nameHistory2=null, managedBy=中国科学技术协会, sponsoredBy=中国科学技术协会, publishedBy=科技导报社, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=http://www.kjdb.org/CN/home, createdTime=1774230116107, updatedTime=1774230116107, createdBy=13041195026, updatedBy=13041195026, submissionGuidelinesUrl=http://www.kjdb.org/CN/column/column7.shtml, submissionAuthorUrl=https://kjdbauthor.cast.org.cn/webm, submissionEditorUrl=https://kjdbeditor.cast.org.cn/webm/, submissionReviewUrl=https://kjdbauthor.cast.org.cn/webm, submissionCeEditorUrl=https://kjdbeditor.cast.org.cn/webm/, submissionAeEditorUrl=https://kjdbeditor.cast.org.cn/webm/, option={"copyright":""}), JournalExt(id=1242774439960621805, language=EN, name=Science & Technology Review, nameHistory1=null, nameHistory2=null, managedBy=, sponsoredBy=, publishedBy=, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=http://www.kjdb.org/EN/home, createdTime=1774230116119, updatedTime=1774230116119, createdBy=13041195026, updatedBy=13041195026, submissionGuidelinesUrl=http://www.kjdb.org/EN/column/column7.shtml, submissionAuthorUrl=https://kjdbauthor.manuscriptcloud.com/login, submissionEditorUrl=https://kjdbeditor.manuscriptcloud.com/login, submissionReviewUrl=https://kjdbauthor.manuscriptcloud.com/login, submissionCeEditorUrl=https://kjdbeditor.manuscriptcloud.com/login, submissionAeEditorUrl=https://kjdbeditor.manuscriptcloud.com/login, option={"copyright":""})], databaseList=null, tenantJournalId=1146031591421210625, websiteList=[Website(id=1146104741081231361, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1146031591421210625, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/kjdb/CN, language=CN, createTime=1751182263881, createBy=18614031015, updateTime=1751778001962, updateBy=18614031015, name=科技导报, tplId=1146099689490845704, title=科技导报, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1148021146403992296, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=articleTextType, value=kx, createTime=1751639170504, updateTime=1751639170504, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146378826469, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=banner, value=null, createTime=1751639170498, updateTime=1751639170498, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146366243556, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=logo, value=https://castjournals.cast.org.cn/joweb/kjdb/CN/file/pic?fileId=9GHSf7eGlIPH0Tv/OOdstA==, createTime=1751639170495, updateTime=1751639170495, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146395603687, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/kjdb/CN/file/pic, createTime=1751639170502, updateTime=1751639170502, creator=18614031015, updator=18614031015), WebsiteProps(id=1148021146387215078, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146104741081231361, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_cn_619/, createTime=1751639170500, updateTime=1751639170500, creator=18614031015, updator=18614031015)]), Website(id=1146105254833139715, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1146031591421210625, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/kjdb/EN, language=EN, createTime=1751182386363, createBy=18614031015, updateTime=1753500121937, updateBy=18614031015, name=科技导报, tplId=1146101810881728533, title=Science & Technology Review, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1155838567709528217, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=articleTextType, value=kx, createTime=1753502988984, updateTime=1753502988984, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567692750998, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=banner, value=null, createTime=1753502988980, updateTime=1753502988980, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567688556693, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=logo, value=https://castjournals.cast.org.cn/joweb/kjdb/EN/file/pic?fileId=9GHSf7eGlIPH0Tv/OOdstA==, createTime=1753502988979, updateTime=1753502988979, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567705333912, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/kjdb/EN/file/pic, createTime=1753502988983, updateTime=1753502988983, creator=18614031015, updator=18614031015), WebsiteProps(id=1155838567701139607, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1146105254833139715, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_en_623/, createTime=1753502988982, updateTime=1753502988982, creator=18614031015, updator=18614031015)])], journalTitle=科技导报, weixinUrl=null, journalUrl=null, iacademicId=null, status=1, seqNo=null, journalTitleEn=Science & Technology Review, journalPhotoCn=wfghvu3bhh/dKxuZ+ucVHA==, journalPhotoEn=yjSfclmpNm7ihn9NbTZ69g==, journalFirstLetter=S, journalRecommend=null, journalNew=null, journalCollection=1, jcrJf=null, cjcrJf=0.91, jcrJfStr=null, cjcrJfStr=null, submissionFirstDecision=null, sciSubjectClassification=null, casSubjectClassification=null, citeScore=null, totalCitationFrequency=null, icpCode=null, psCode=null, advertisingLicenseCode=null, copyrightInformation=null, country=null, option=, provinceCode=null, provinceName=null, collectFlag=false, interPubPlatform=null, interPubPlatformUrl=null), detailUrlCn=https://castjournals.cast.org.cn/joweb/kjdb/CN/10.3981/j.issn.1000-7857.2023.05.002, detailUrlEn=https://castjournals.cast.org.cn/joweb/kjdb/EN/10.3981/j.issn.1000-7857.2023.05.002, pdfUrlCn=https://castjournals.cast.org.cn/joweb/kjdb/CN/PDF/10.3981/j.issn.1000-7857.2023.05.002, pdfUrlEn=https://castjournals.cast.org.cn/joweb/kjdb/EN/PDF/10.3981/j.issn.1000-7857.2023.05.002, aliStartDate=null, aliEndDate=null, collectionFlag=false, citedCount=null, citedUrl=null, previewStatus=0, delFlag=0, hasFullText=0, orderTime=1678636800000, fullTextJson=null, articleText=null, reference=null)