Article(id=1210590158928352077, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1210590152548807015, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2024.09.002, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1706716800000, receivedDateStr=2024-02-01, revisedDate=1710432000000, revisedDateStr=2024-03-15, acceptedDate=null, acceptedDateStr=null, onlineDate=1766556785565, onlineDateStr=2025-12-24, pubDate=1726761600000, pubDateStr=2024-09-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1766556785565, onlineIssueDateStr=2025-12-24, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1766556785565, creator=13701087609, updateTime=1766556785565, updator=13701087609, issue=Issue{id=1210590152548807015, tenantId=1146029695717560320, journalId=1149653034449285133, year='2024', volume='57', issue='9', pageStart='1', pageEnd='165', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1766556784044, creator=13701087609, updateTime=1766563998200, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1210620410958312217, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1210590152548807015, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1210620410958312218, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1210590152548807015, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=15, endPage=25, ext={EN=ArticleExt(id=1210590159268090710, articleId=1210590158928352077, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Research progress in effects of extreme ambient temperature on properties of silicone rubber materials, columnId=1198667062026531195, journalTitle=Insulating Materials, columnName=Review, runingTitle=null, highlight=null, articleAbstract=

Silicone rubber has excellent mechanical and electrical properties and excellent resistance to high and low temperatures, which is widely used in the field of electrical insulation. In this paper, the effects of extreme ambient temperature on the mechanical and electrical properties of silicone rubber (SR) were reviewed. The crystallization behavior of silicone rubber at low temperature and the methods to improve the thermal stability of silicone rubber were introduced. Finally, the future development trend of silicone rubber was prospected.

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硅橡胶材料具有优异的机电性能以及出色的耐高低温性能,在电气绝缘领域具有广泛运用。本文综述了低温、高温对硅橡胶(SR)材料力学性能、电气性能的影响,同时介绍了硅橡胶在低温下的结晶行为以及提高硅橡胶材料热稳定性的方法,最后对硅橡胶材料的未来发展应用趋势进行了展望。

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王霞(1976-),女(汉族),山西运城人,教授,博导,博士,主要从事新型高压直流电缆及其直流料的研发、聚合物绝缘中空间电荷测量技术、高压电缆附件设计与故障诊断技术的研究。
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苗哲(2000-),男(汉族),内蒙古鄂尔多斯人,硕士生,主要从事电缆附件及附件绝缘材料的性能测试和应用研究。

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苗哲(2000-),男(汉族),内蒙古鄂尔多斯人,硕士生,主要从事电缆附件及附件绝缘材料的性能测试和应用研究。

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苗哲(2000-),男(汉族),内蒙古鄂尔多斯人,硕士生,主要从事电缆附件及附件绝缘材料的性能测试和应用研究。

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温度结晶效应分子运动力学性能
黏流温度Tf~热分解温度Td分子整链可以运动,链段的协同运动可实现整个大分子的位移黏流态,模量很小,会产生不可逆形变
熔融温度Tm~黏流温度Tf结晶全部熔融,不存在晶区局部分子链段可以运动,自由体积较大高弹态,模量迅速降至SR非晶态时的相应数值
玻璃化转变温度Tg~熔融温度Tm存在结晶且有最大结晶速率温度,TmTg附近不结晶或结晶很慢局部分子链段可以运动,晶区会限制分子链与链段的运动结晶后,呈半晶态,模量与结晶度有关,一直持续到结晶熔融
低于玻璃化转变温度Tg“冻结”状态,分子运动仅限于振动和短程的旋转运动玻璃态,SR呈硬而脆的特点,模量在109 Pa
), ArticleFig(id=1218262752452334291, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1210590158928352077, language=CN, label=表1, caption=

硅橡胶的热转变与力学性能

, figureFileSmall=null, figureFileBig=null, tableContent=
温度结晶效应分子运动力学性能
黏流温度Tf~热分解温度Td分子整链可以运动,链段的协同运动可实现整个大分子的位移黏流态,模量很小,会产生不可逆形变
熔融温度Tm~黏流温度Tf结晶全部熔融,不存在晶区局部分子链段可以运动,自由体积较大高弹态,模量迅速降至SR非晶态时的相应数值
玻璃化转变温度Tg~熔融温度Tm存在结晶且有最大结晶速率温度,TmTg附近不结晶或结晶很慢局部分子链段可以运动,晶区会限制分子链与链段的运动结晶后,呈半晶态,模量与结晶度有关,一直持续到结晶熔融
低于玻璃化转变温度Tg“冻结”状态,分子运动仅限于振动和短程的旋转运动玻璃态,SR呈硬而脆的特点,模量在109 Pa
), ArticleFig(id=1218262752561386199, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1210590158928352077, language=EN, label=Table 2, caption=Some high-temperature resistant fillers, figureFileSmall=null, figureFileBig=null, tableContent=
填料的分类常用的填料
金属化合物含铁氧化物(Fe2O3、FeO(OH))、含铝氧化物(Al2O3、Al(OH)3)、含铈化合物(CeO2、 Ce(OH)4)、含镁化合物(MgO、Mg(OH)2)、含锡化合物(SnO2、SnCh)、TiO2、ZnO等
无机非金属化合物SiO2、氮化硼(BN)等
碳纳米材料炭黑、碳纳米管、石墨烯
), ArticleFig(id=1218262752666243803, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1210590158928352077, language=CN, label=表2, caption=

常用的无机耐热填料

, figureFileSmall=null, figureFileBig=null, tableContent=
填料的分类常用的填料
金属化合物含铁氧化物(Fe2O3、FeO(OH))、含铝氧化物(Al2O3、Al(OH)3)、含铈化合物(CeO2、 Ce(OH)4)、含镁化合物(MgO、Mg(OH)2)、含锡化合物(SnO2、SnCh)、TiO2、ZnO等
无机非金属化合物SiO2、氮化硼(BN)等
碳纳米材料炭黑、碳纳米管、石墨烯
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极端环境温度对硅橡胶材料性能的影响研究进展
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苗哲 , 贾春 , 吴超 , 王霞
绝缘材料 | 综述 2024,57(9): 15-25
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绝缘材料 | 综述 2024, 57(9): 15-25
极端环境温度对硅橡胶材料性能的影响研究进展
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苗哲, 贾春, 吴超, 王霞
作者信息
  • 西安交通大学 电工材料电气绝缘全国重点实验室,陕西 西安 710049
  • 苗哲(2000-),男(汉族),内蒙古鄂尔多斯人,硕士生,主要从事电缆附件及附件绝缘材料的性能测试和应用研究。

通讯作者:

王霞(1976-),女(汉族),山西运城人,教授,博导,博士,主要从事新型高压直流电缆及其直流料的研发、聚合物绝缘中空间电荷测量技术、高压电缆附件设计与故障诊断技术的研究。
Research progress in effects of extreme ambient temperature on properties of silicone rubber materials
Zhe MIAO, Chun JIA, Chao WU, Xia WANG
Affiliations
  • State Key Laboratory of Electrical Insulation and Power Equipment, Xi′an Jiaotong University, Xi′an 710049, China
出版时间: 2024-09-20 doi: 10.16790/j.cnki.1009-9239.im.2024.09.002
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硅橡胶材料具有优异的机电性能以及出色的耐高低温性能,在电气绝缘领域具有广泛运用。本文综述了低温、高温对硅橡胶(SR)材料力学性能、电气性能的影响,同时介绍了硅橡胶在低温下的结晶行为以及提高硅橡胶材料热稳定性的方法,最后对硅橡胶材料的未来发展应用趋势进行了展望。

硅橡胶  /  低温  /  高温  /  机电性能  /  结晶  /  热稳定性

Silicone rubber has excellent mechanical and electrical properties and excellent resistance to high and low temperatures, which is widely used in the field of electrical insulation. In this paper, the effects of extreme ambient temperature on the mechanical and electrical properties of silicone rubber (SR) were reviewed. The crystallization behavior of silicone rubber at low temperature and the methods to improve the thermal stability of silicone rubber were introduced. Finally, the future development trend of silicone rubber was prospected.

silicone rubber  /  low temperature  /  high temperature  /  mechanical and electrical properties  /  crystallization  /  thermal stability
苗哲, 贾春, 吴超, 王霞. 极端环境温度对硅橡胶材料性能的影响研究进展. 绝缘材料, 2024 , 57 (9) : 15 -25 . DOI: 10.16790/j.cnki.1009-9239.im.2024.09.002
Zhe MIAO, Chun JIA, Chao WU, Xia WANG. Research progress in effects of extreme ambient temperature on properties of silicone rubber materials[J]. Insulating Materials, 2024 , 57 (9) : 15 -25 . DOI: 10.16790/j.cnki.1009-9239.im.2024.09.002
硅橡胶(SR)为相对分子质量高的线型聚有机硅氧烷(如图1所示),其相对分子质量高达几十万甚至一百万以上[1],具有弹性高、憎水性强、介电性能优良、耐候性出色等优点,特别是其耐热性和耐寒性十分优异(在-65~250℃都能保持弹性[1])。硅橡胶材料这些优异的性能使其在电气绝缘领域中具有较为广泛的应用,大量应用于室内和户外的电缆终端、绝缘子和避雷器等[2]
我国地理环境复杂,东西南北跨度大,电力设备经常在不同的地理环境工作,需要承受复杂的气候条件。在诸如青海、西藏等高寒、高海拔地区,电力设备要在低温环境下持续工作,有时甚至要承受-40℃的极端低温。据统计,电力机车高压电缆硅橡胶柔性终端放电击穿故障大多发生在西北高原地区,且故障多发生在温度较低的时间段[3]。复合绝缘子硅橡胶护套在高寒地区运行时,受低温环境的影响,优异的憎水性能不能完全发挥作用[4-5]。这些均表明低温环境对硅橡胶材料的可靠性提出了更加严苛的要求。除要经受低温环境的考验外,电气绝缘用硅橡胶材料还经常在高温环境下使用。我国夏季气温普遍较高,电力设备经常在30~40℃的高温环境下工作,外加电力设备的自身工作温度较高(如硅橡胶电缆终端长期运行工作温度高达70~90℃),容易导致热量的聚集,使得硅橡胶绝缘介质发生劣化,对设备的安全可靠运行造成威胁[6-7]
电力设备复杂的温度运行工况对电气绝缘用硅橡胶材料在宽温度范围下机电性能的可靠性提出了十分严苛的要求。因此,本文对电气绝缘用硅橡胶材料在极端环境温度下的机电性能变化规律进行综述,同时对硅橡胶材料在低温下的结晶作用以及提升硅橡胶热稳定性的方法进行介绍,最后对硅橡胶材料的应用发展趋势进行展望。
硅橡胶材料结构对称性高、分子规整性好、链段之间的排列有序程度高,在低温下容易发生静态结晶。结晶过程包括晶核生成和晶粒生长两个阶段,结晶只有在玻璃化转变温度(Tg)与熔融温度(Tm)之间才可能进行,在这一温度范围内,随着温度的降低,结晶速率先增大后减小,存在最大结晶速率,结晶速率与温度的关系曲线呈单峰型[8]。已有研究表明,硅橡胶只有在合适的环境温度下才会迅速结晶,而在这一温度以上结晶速度很慢或不结晶,结晶作用显著影响硅橡胶材料的性能。
玻璃化转变和结晶是影响硅橡胶低温性能的重要因素,提高硅橡胶耐寒性的关键便在于抑制其结晶过程。研究表明,改善硅橡胶低温性能的主要手段是通过共聚改性在硅氧烷分子链上引入其他大体积基团(如苯基),大体积基团的引入可以破坏低温结晶,而选择合适的改性链节既可调节硅橡胶的玻璃化转变温度,也能有效抑制结晶过程,从而提高硅橡胶的低温弹性[9-11]
硅橡胶绝缘材料在实际运行中可能会承受多种外场的作用,比如热-力场作用叠加的情况。硅橡胶材料除了在低温下会发生静态结晶外,在应力作用下也会发生应变诱导结晶,在外部高应力下,结晶微区发生滑移使晶态取向(晶态重排)[11]。因而在分析实际运行中的硅橡胶绝缘性能变化规律时,除考虑静态结晶效应外,还需要考虑低温下应变诱导结晶对硅橡胶性能的影响。由于硅橡胶具有较低的结晶温度(图2,其中Tc为冷结晶峰温度,Tc′为降温过程中的结晶峰温度[12]),目前研究通常认为硅橡胶在高于其静态结晶温度的环境下不会出现结晶行为。实际上,在复杂外场如流动外场的作用下,硅橡胶会在高于其静态结晶温度的环境温度下出现异常结晶,从而导致硅橡胶材料的弹性丧失,失去目标功能[13]
最早针对硅橡胶的应变诱导结晶(strain-induced crystallisation,SIC)行为的研究多集中于室温及其以上的环境温度,不同于天然橡胶在室温下就会出现SIC行为,聚二甲基硅氧烷(PDMS)在外施应力作用下,虽然会出现应力方向上的分子链取向行为,但并未出现结晶行为[14-15]。E KLIMOV等[16]在-20℃、-40℃下发现了白炭黑填料增强的PDMS在低温拉伸后的结晶行为,其中在-20℃、-40℃下的结晶形态并不相同。M TOSAKA等[17]首次发现了PDMS在低温叠加不同应力场下的多晶态行为。在低温下,不同的拉伸率下会产生3种不同的晶相;而在室温下,高应变作用下会产生介晶相,当对其降温时会发生结晶。赵景云[13]研究发现填充不同填料含量的PDMS在低温下的拉伸变形相变中出现两个低密度、高熵晶体,并在预拉伸降温过程中发现预拉伸应变是决定分子结晶晶型的重要因素。现有的研究均表明,硅橡胶在低温下叠加力场后会发生SIC行为,温度、拉伸率的不同会导致其产生不同的晶体,但目前的研究并未分析不同晶型对硅橡胶宏观力学行为的贡献。因此,建立硅橡胶材料在低温下拉伸诱导结晶的力学模型,定量地分析不同晶型对硅橡胶宏观力学行为的影响对于硅橡胶的应用具有重要的指导意义。
绝缘电阻用于表征绝缘体阻止电流流通的能力,是绝缘特性的基本参数之一[18]。受温度和结晶作用的影响,硅橡胶的导电特性会发生变化。王宏旭[19]研究了不同含量氢氧化铝(ATH)填充的硅橡胶在-60~20℃下的体积电阻率(ρv)随温度(T)的变化规律。结果表明,硅橡胶的体积电阻率随温度的降低而逐渐增加,基本满足高聚物绝缘材料ρvT特性曲线(lnρv-1/T)之间的线性关系,且ATH含量越高,ρv越大。但研究中并没有分析结晶作用的影响,也未对这一现象给出定量解释。LIN Y等[20]对这一问题给出了科学的解释,该团队研究发现,硅橡胶在结晶过程中的电导率变化与晶体的演化过程密切相关,可分为3个阶段;ATH对分子链的约束作用会影响硅橡胶的结晶过程,通过调节ATH含量可以调控硅橡胶在低温下的绝缘性能。在后续研究中[21],该团队结合宽带介电光谱中的非晶相信息和差示扫描量热法中的晶相信息定量探究了非晶相与结晶相含量对ATH填充硅橡胶电导率的影响,结果表明,降温过程中导电离子的热转变和非晶相体积收缩导致的导电离子之间距离的缩短是影响硅橡胶电导率的主导因素。
介电常数是描述电介质极化的宏观参数[22],在交流电场下,电场按介电常数分配,极端低温环境会使硅橡胶的介电常数发生较大变化,由此造成的电场畸变越严重,电力设备发生故障的可能性越大。LI Q等[23]对干式GIS电缆终端用硅橡胶材料在低温下的介电常数变化规律进行了测试研究,在工频下,介电常数从20℃时的3.08增加到-40℃时的3.48。通过有限元仿真研究发现,将介电常数的这一变化考虑在内时,电缆终端界面气隙处的局部场强会高于空气击穿场强,引发局部放电。张志劲等[24]以复合绝缘子用HTV硅橡胶样品为对象,研究了其在-40~25℃环境下的温度频率特性。结果表明,复介电常数实部(ε′)在高频(104~106 Hz)交变电场中随温度的升高而减小,在低频(10-2~101 Hz)时变化规律则相反。在-40~0℃温度范围内,ε′随着干冻持续时间的增加而增大,这与低温下强极性电介质水分的侵入及冰晶的形成有关。但该研究并没有说明介电特性的这种变化是否与硅橡胶低温下的结晶作用有关。而LIN Y等[25]的研究结果则充分表明,在-40~0℃温度范围内,ATH填充硅橡胶并不会发生结晶作用,硅橡胶的介电特性在这一温度范围内的变化并不是因为硅橡胶的结晶转变。
当空气中固体绝缘材料的极间电压超过一定值时,在材料和空气之间的界面处会发生气体放电,该现象称为沿面放电,当其发展成贯穿性放电时,被称为沿面闪络。在低温环境(温度为-60~0℃)下,随着温度的降低,硅橡胶的直流沿面闪络电压以及工频闪络电压均值(U50%)呈线性升高趋势[27-28]。这是由于随着温度的降低,固体-气体交界面处气体介质的相对密度增大,自由电子平均自由行程缩短,自由电子还没积聚足够的能量便与其他质点碰撞,不容易产生碰撞电离,电离过程较弱,若要使碰撞电离产生的概率增大,则需要提高电场强度使电子积累足够的能量,在宏观上则表现为闪络电压的提高。
当固体介质内部的晶格结构被足够强度的电子崩破坏后会导致击穿的发生,绝缘特性遭到破坏。固体电介质的击穿理论认为,击穿电压随温度的降低而升高。在低温环境(温度为-60~20℃)下,硅橡胶材料的工频击穿电压以及直流击穿电压随温度的降低表现出先逐渐升高后趋于稳定的规律,相比常温情况,低温环境下硅橡胶材料的击穿电压有明显的提高[27-28]。硅橡胶材料在极端低温情况下的时间长短也对击穿电压的大小有影响,在-50℃的极端低温下,随着时间的增加,硅橡胶的击穿电压先大幅增加,之后缓慢增加[29]。硅橡胶材料在低温下击穿电压的升高与温度以及结晶效应关系紧密。自由电子的密度与温度呈正相关,温度越低,自由电子数越少,碰撞电离越难发生,击穿电压也就越高。在结晶温度范围内,硅橡胶材料内部发生结晶,在结晶区,分子链段排列进入晶格,结晶区分子链之间的吸引力抑制了非晶区无序分子链的运动,导致自由体积减小,自由电子的运动受到抑制,从而削弱了电子雪崩过程,在宏观层面上表现为击穿电压的升高。
电树枝老化是造成聚合物绝缘材料破坏的重要因素之一,甚至可能引起绝缘击穿,而温度对硅橡胶的起树电压和电树枝形态都有较大影响[22,30]。国内外学者对低温下硅橡胶电树枝的生长特性进行了一系列研究。研究发现[31],在极端低温环境下(温度为-90~-30℃),电树枝呈现树枝状、灌木状、松枝状3种典型结构(如图3所示),在-30℃、-60℃下呈现树枝状、灌木状两种电树,-90℃下则呈现松枝状电树。硅橡胶电树枝生长特性与其结晶行为密切相关,在未发生结晶时,温度越低,电树的起始概率越大;发生结晶后,结晶度越高,电树的起始概率越低、生长速度越慢,结晶区与非结晶区之间的结合处可能是容易生长的弱区;当温度降低到材料的玻璃化转变温度之下时,材料的微观结构发生巨大变化,电树生长非常缓慢,起始概率也非常低[31-34]。上述研究集中于温度-结晶效应-电树生长特性三者之间的关系,通过电树形貌、起树电压、电树起始概率等特征充分说明了结晶效应对硅橡胶电树生长的影响,但在研究中并未给出针对电树生长的有效监测方法。
研究发现,绝缘材料的局部放电特性与电树生长特性紧密相关,局部放电(PD)监测是表征绝缘材料内部电树生长的有效监测手段[35-36]。HAN T等[37]通过检测PD信号分析了电树在20、-100、-196℃下的生长特性,利用局部放电的相位分布(PRPD)、多尺度排列熵(MSPE)两种方式对结果进行了表征。结果表明,低温会抑制局部放电,从而影响局部放电的相位分布(PRPD)。多尺度排列熵(MSPE)能明显地表征电树的不同生长阶段。低温下空间电荷的分布以及结晶效应是影响局部放电特性的重要因素。该研究思路表明,可以通过PD信号中的非线性变化特征量来预测硅橡胶材料的电树生长状态以及劣化状态,为硅橡胶绝缘预击穿现象的早期检测提供了一种手段。
极端低温环境下,硅橡胶力学性能最显著的影响因素是其结晶过程,结晶导致材料的宏观力学性能发生变化,对电力设备的工作运行状态可能会产生不利影响,表1总结了硅橡胶温度-分子运动-力学性能之间的关系[9,38-39]
E KLIMOV等[16]在室温至-40℃的温度范围内,研究了PDMS试样在不同拉伸应变下的力学性能、形貌和分子链取向。研究发现,随着温度的降低,杨氏模量上升,断裂伸长率下降,橡胶的不可逆形变显著增加。不同温度下分子链有序状态的变化以及拉伸率变化引起的结晶度变化是影响宏观力学性能的主要原因。黄艳华等[40]对SE6450硅橡胶的低温拉伸性能进行了测试,结果表明,随着温度的降低,橡胶的拉伸强度、拉伸模量升高,断裂伸长率先增大后减小,耐寒性下降,低温下的结晶效应和体积收缩效应是影响其低温性能的主要因素。另外,低温处理时间的长短也对硅橡胶的力学性能产生影响。胡涛等[41]研究发现,在长时间的极端低温下,硅橡胶会在高于其结晶温度的温度下缓慢结晶,当低温(-55℃)持续时间达到27天时,低温永久压缩变形突变,材料失效。WANG S H等[29]对硅橡胶在-55℃下进行了低温老化,结果发现,硅橡胶的最大拉伸力和拉伸强度随着老化时间的增加而增大。同时发现,经低温老化后的试样,在室温下放置15天后拉伸性能也不能恢复到初始状态,且低温处理时间越长,拉伸特性的恢复难度越大。
除上述反映材料力学性能的强度、刚度参数外,对于常用作绝缘护套材料的硅橡胶而言,它在低温下的硬度以及表面粗糙度的变化也值得关注。WANG S H等[29]研究了在极低温度下硅橡胶的硬度及表面形貌的变化,实验结果表明,随着低温处理时间的增加,硅橡胶样品表面裂纹长度和深度增加明显。张文文等[42]对硅橡胶与氟硅橡胶材料进行了低温老化测试。结果表明,在-50℃环境下,材料邵氏A硬度随老化时间的增加先缓慢增大,再急剧增大,最后缓慢减小;表面粗糙度则先减小,再迅速增大,最后缓慢增大。这主要是与硅橡胶在低温老化下的结晶效应以及试片降解有关。
针对电缆附件硅橡胶绝缘的实际运行工况,学者们也进行了一些研究。王霞等[43]对扩张状态下硅橡胶材料在极端低温(-60~25℃)下的应力松弛特性进行了测试。研究发现,温度越低,应力剩余率越低;扩张率越大,应力的衰减越多。推测是构象熵、低温下应变诱导结晶引起的应力降低与冷收缩引起的应力增加相互竞争的结果。低温拉伸下硅橡胶材料这种松弛特性引起的界面压力下降可能是诱发电缆终端故障的重要原因之一。张世泽等[44]针对极寒环境(-40℃)下电缆GIS终端内部的界面故障分析中发现,当环境温度骤降时,硅橡胶的收缩会使得环氧套管/硅橡胶界面出现气隙,温度降低的幅度越大,收缩引起界面的位移就越大,造成的电场畸变也就越严重,进而会引发局部放电,甚至击穿。以上研究结果均表明,为避免电力设备在低温下出现故障,需要着重关注低温下硅橡胶材料力学特性的变化。
硅橡胶材料的耐热性是其最优异的性能之一,其在200℃下可以连续使用超过10 000 h,远高于复合绝缘子和电缆附件的正常运行工作温度[2]。但在实际使用过程中,长期的高温作用以及局部异常温升(如电缆接头在短路、过载或在绝缘介质中混入杂质时,会产生近250℃的局部高温[45])的情况下,老化引起的硅橡胶绝缘性能劣化是不可避免的,会影响其运行可靠性。
长时间的高温老化下,硅橡胶的劣化机理主要分为热氧化、缩聚、热裂解和降解3个过程,热氧化引起的分子链交联与分子链裂解之间的竞争作用会使得硅橡胶在不同温度、不同老化时间下呈现不同的性能变化特点。在初期热老化过程中,Si-CH3键断裂,在高温氧化作用下,会形成新的Si-O键(如图4(a)所示),相邻的硅氧烷链之间在高温下会发生交联反应,形成交联结构(如图4(b)所示),合适的交联度可以改善硅橡胶的力学性能,但过度的交联会使得硅橡胶变硬、变脆,丧失良好的机电性能。随着老化时间的增加或老化温度的升高,硅橡胶会发生降解(如图4(c)所示)和热裂解(如图4(d)所示),形成短的链段以及小的环状分子,导致力学性能进一步劣化[6,46-47]。另外,在研究中发现,硅橡胶材料在热氧老化过程中的前期反应与热降解过程中甲基氧化阶段的反应相同,因此,可以利用甲基氧化反应活化能参数判断材料发生热氧老化反应的难易,这为评估硅橡胶材料的耐热老化性能提供了一种简单有效的思路[48]
硅橡胶材料在高温环境下的介电响应特性与温度、老化时间关系密切。SHANG R等[49]对室温硫化硅橡胶(RTV)在60~200℃的介电响应特性进行了研究。结果表明,随着温度的升高,RTV的介电常数实部(ε′)降低,介电常数虚部(ε″)在低频下增加,在高频下基本不变,当温度升高到100℃时,RTV的损耗峰移动到50 Hz附近,通过添加适量的ATH可以避免硅橡胶材料在工频下出现较大的介质损耗。但该研究只针对不同高温下的介电响应,并没有考虑高温老化作用。S HANADA等[46]研究发现,在280℃的高温老化作用下,硅橡胶材料通过形成丰富的硅氧烷键进而形成交联结构而降解,随着降解程度的加深,ε′、ε″均降低(工频附近)。但是在老化过程中,如果裂解反应占据主导地位,会产生较多的小分子产物和氧化的游离基,使得极化作用增强,进而使得硅橡胶的介电常数上升,在叠加力场的情况下,这种裂解过程会加剧,使得材料的介电性能进一步劣化[50]
除介电响应特性外,也有学者对硅橡胶在高温及高温老化下的体积电阻率、表面电阻率变化特性进行了研究。S ALAM等[51]测量了高温下高温硫化硅橡胶(HTV)的电导率变化。结果表明,温度越高,材料的电导率越高,呈非线性上升趋势,符合Arrhenuis定律。但经过高温老化之后,由于硅橡胶内部分子链发生氧化交联反应,使得材料的致密度增加,内部离子、电子的迁移率下降,导致体积电阻率上升[52]。E H BELHITECHE等[6]研究发现,表面电阻率(ρs)的变化与老化程度紧密相关,在老化初期,高温使得材料的水分子挥发,ρs上升;然后,侧链的断裂和热氧化物的产生使得材料的ρs下降;随后,缩聚反应形成的水的去吸附使得ρs再次上升;老化后期,剩余的羟基基团会加剧材料劣化,使得ρs再次下降。
研究表明,硅橡胶试样高温老化后的击穿电压随着老化时间的增加先上升后下降,击穿电压的离散程度随着老化时间的增加而增大。同样地,这也与硅橡胶试样在不同老化时间段发生不同的反应有关。老化初期,由于热和氧气的作用,硅橡胶发生氧化缩聚反应,内部分子链之间发生进一步的交联,使得材料的自由体积减小、载流子的迁移率下降,进而使得材料的击穿电压上升。而老化后期,热裂解反应占据主导地位,硅橡胶内部的载流子浓度和迁移率均增加,自由体积增大,电子在运动过程中更容易集聚能量引发碰撞电离,更容易形成放电击穿的通道,宏观上表现为击穿电压下降[49,52-53]
电树枝老化是引起硅橡胶材料电气绝缘性能失效的一个重要原因,高温及高温老化下电树生长特性的研究对硅橡胶材料绝缘状态的评估具有重要意义。高温下电树枝的生长与温度、温度梯度、老化时间关系密切。随着温度的升高,由于硅橡胶内部微观链段的松弛以及分子热运动的加强,硅橡胶的平均起树电压(ATIV)下降,符合Arrhenuis定律。随着温度的升高,电树形态由树枝状变为松枝状再变为灌木状,呈现由稀疏到密集的变化趋势,这是高温下硅橡胶电机械强度下降的主要原因[30]。同时,若硅橡胶绝缘介质存在温度梯度,温度梯度越大,电树的长度和累积损伤就越大,PD的振幅和数量也越大,进而会促进电树的生长[54]。在高温老化进程中,随着老化时间的增加,ATIV先上升后下降,这一变化符合硅橡胶先氧化交联后裂解的劣化机理,老化初期交联度的增加,使得ATIV上升,而老化后期的裂解使得交联度下降,使得ATIV下降;物理薄弱区的先减小后增大则使得松枝状电树的生成概率先减小后增大,灌木状电树的生成概率先增大后减小[55]。由此可见,对于硅橡胶材料而言,合适的温度和老化时间下的二次硫化可以提升其电学性能。
对于电缆附件、绝缘子外护套等十分依赖硅橡胶材料力学性能的电力设备而言,对高温老化下材料力学性能的考量甚至比其电性能更加关键[46]。硅橡胶在老化过程中的交联反应使得材质变硬、变脆,甚至丧失弹性,而降解反应则使得硅橡胶变软、发黏。不同温度、不同老化时间以及是否有氧气参与等条件都会影响硅橡胶内部劣化机理,影响其宏观力学性能。
当温度低于硅橡胶的起始分解温度时,单纯短时间的高温变化并不会对硅橡胶的力学性能造成严重影响,此时硅橡胶所呈现出的性能变化主要受分子状态变化的影响。张世泽等[44]在25~90℃下硅橡胶的拉伸试验中发现,温度升高引起分子链的解缠绕,分子链的柔顺性增强,使得甲基乙烯基硅橡胶的弹性模量随温度的升高而下降。XIA R等[56]在25~100℃下硅橡胶的拉伸试验中发现,随着温度的上升,由于熵效应和体积膨胀效应的共同作用,在相同的应变条件下,硅橡胶的应力先上升后下降,断裂伸长率先下降后上升,但硅橡胶的高弹特性并未变化。然而,当温度达到硅橡胶的热分解温度时,硅橡胶会发生降解反应。林荧等[48]在研究有机硅灌封胶材料的耐高温性能时发现,随着温度的升高,硅橡胶会依次发生甲基氧化反应、剪链反应和随机剪切反应、均链反应,此时已突破了硅橡胶使用温度的上限,失去橡胶使用的意义。王路伽等[57]针对硅橡胶伞裙闪络过程中的温度陡升(电弧温度普遍在4 000 K以上)现象,基于反应力场模拟探究了温度陡升(模拟时长为60 ps)下硅橡胶的电热裂解机理与特性。结果表明,硅橡胶裂解过程由主链上的Si-C键断裂引发,CH4、H2、C2H4、C2H2、H2O为不同裂解阶段的主要产物,反应结束时,硅橡胶的交联度增加,杂质气体的扩散聚集使得材料内部产生气隙,微观结构的变化使得硅橡胶宏观性能发生劣化。
在没有氧气参与的情况下,硅橡胶在加速热老化后呈现先变硬后变软的趋势。S KASHI等[58]在190℃下对硅橡胶材料进行了氮气氛围下的加速热老化试验,测试了其力学性能随老化时间的变化。结果表明,随着老化时间的增加,硅橡胶材料的拉伸强度和断裂伸长率逐渐降低,弹性模量也降低。由于老化过程中硅橡胶内部持续交联与大分子裂解的竞争作用,硅橡胶的撕裂强度和硬度先增加后降低,不同老化时间下的蠕变和恢复特性也表明,老化初期的交联有益于提高硅橡胶的力学性能,但老化后期材料的永久形变量会增大,硅橡胶变软,导致力学性能劣化。
在较高的温度且有氧气的作用下,硅橡胶在老化后呈现先变硬后变脆的特点。王若丞等[45]设计了电缆附件用硅橡胶在170℃、220℃下的加速热老化试验,研究发现热老化后硅橡胶绝缘残余的交联副产物挥发,侧链有机含量降低,主链间发生交联;随着老化温度与时间的增加,试样的断裂伸长率与拉伸强度逐渐下降,杨氏模量逐渐上升,导致分子链柔顺性变差,材料逐渐硬化。S ITO等[7]在200~290℃下对硅橡胶进行加速热老化试验,研究发现,老化后的硅橡胶内部硅氧烷键形成交叉连接结构,硅橡胶先变硬后变脆。E H BELHITECHE等[6]则在热老化过程中发现,热氧老化过程中的交联及降解会使硅橡胶表面层脱落,被聚合物和填料的混合物所取代,使其表面粗糙度下降(如图5所示)。SU D[53]则进一步从微观角度进行了分析,在热氧老化过程中,随着老化时间的增加,硅橡胶体系中C元素的相对含量降低,O元素的相对含量增加,有机基团(如-CH3)在热氧的共同作用下从硅氧烷主链上裂解,同时形成新的Si-O-Si交联点,使交联度增加,老化初期交联度的增加能够在一定程度上提升硅橡胶的力学性能,但交联度的不断增大使得硅橡胶材料变硬变脆,导致其力学性能劣化。
硅橡胶材料在实际应用中,还面临着叠加力场的高温运行工况。周远翔等[50]研究了高温下电缆附件用硅橡胶材料叠加机械应力场的性能,结果表明,相较于单纯的热老化,在机械应力耦合作用下,试样的拉伸强度和断裂伸长率下降更显著。伊德伦等[59]研究发现叠加应力场的高温老化会使硅橡胶的蠕变量增大,使电缆附件出现界面压力随老化时间的增加而下降程度增大的现象,不利于附件的正常运行。上述现象的原因可以解释如下:在叠加力场的情况下,硅橡胶内部卷曲的分子链会沿着应力方向取向,而处于拉伸状态的分子链在高温作用下更容易发生断裂,进一步加深主链结构的不对称性,造成材料力学性能的进一步劣化[50,59]
硅橡胶材料的耐高温性能十分优良,但在持续热氧环境下,由于Si-O-Si键的断裂重排以及侧基的氧化,硅橡胶仍会出现缓慢的热降解过程。因此,为充分满足硅橡胶材料在电气绝缘领域中的应用需求,仍需不断提高硅橡胶的耐热性和延长其在高温环境中的使用寿命[60]。目前提高硅橡胶热稳定性的方法主要有改进硅橡胶的分子结构和加入无机耐热填料。
硅橡胶分子在高温下会发生主链断裂和侧基氧化等复杂的化学反应,分子结构的改进可以抑制硅橡胶在高温下的裂解。在热氧环境下,苯基的“位阻”效应可以有效减缓Si-O链在热氧环境中的老化和降解,因此,在硅橡胶中引入苯基能够提高硅橡胶的热稳定性[61]。另外,分子链端基中的羟基会促进分子链的热降解,因此,减少羟基的数量能够提高硅橡胶的热稳定性。例如将硅氮烷混入硅橡胶中,能够消除大部分的硅羟基[62]。此外,通过调整硅橡胶分子链中活性基团的位置、类型和数量,也可以改善硅橡胶材料的热稳定性。
在高温环境下,缺乏耐高温添加剂和抗氧化剂,会导致橡胶分子链在热和氧的作用下无序交联、断裂、重排和降解,对硅橡胶基体的力学性能产生很大的负面影响。研究表明,加入无机耐热填料能够显著提高硅橡胶的热稳定性,表2总结了现阶段常用的无机耐热填料。
R DRAKE等[63]研究表明,以羟基氧化铁 (FeO(OH))和氧化铁(Fe2O3)为耐高温填料能够提高硅橡胶的热稳定性,在热老化前含FeO(OH)的基体的力学性能略逊于经Fe2O3改性的基体,而在热老化之后经FeO(OH)改性的基体的力学性能有明显优势。W E HUTCHINSON[64]研究发现,TiO2填充的硅橡胶在经历315℃/24 h的热老化之后,其力学性能损失率低于未改性的硅橡胶。铝的含氧化合物也是常用的耐高温填料,对提高硅橡胶的热稳定性具有显著的作用。研究表明,Al2O3可与硅橡胶分子链形成氢键,从而限制橡胶分子链的过度迁移,阻碍降解产物的形成[65]。实际上,有时两种或多种耐高温填料的联合使用具有协同效应,有助于提高硅橡胶的热稳定性。经对比研究发现,以ZnO(1.4%)/Fe2O3(2.67%)/CaCO3(4%)为耐高温填料制备得到的氟硅橡胶在经历老化后的力学性能最好,而炭黑(1.4%)/Fe2O3(4%)/CaCO3(4%)耐高温填料能使氟硅橡胶老化前后的力学性能损失达到最小[66]
随着研究的深入,许多学者发现碳纳米材料对硅橡胶复合材料的耐高温性能也有显著的改善作用。ZHANG J等[67]研究发现,导电炭黑的加入能够增加硅氧烷链的刚性,从而在一定程度上阻碍热重排引起的硅氧烷链的降解。其次,在硅胶和导电炭黑的混合过程中,三维空间结构碳凝胶的形成也能抑制降解,因此导电硅橡胶比一般硅橡胶具有更好的热稳定性。碳纳米管的表面具有清除自由基的作用,这种效应能够抑制聚合物降解的链式反应。T SHIMIZU等[68]通过少量(质量分数为0.05%)分散良好的碳纳米管制备了具有高热稳定性的碳纳米管(CNT)/硅橡胶纳米复合材料。热氧老化(温度为280℃)试验表明,在不添加碳纳米管的情况下,硅橡胶在进入热老化状态后不久就会硬化,失去橡胶的弹性,而CNT/硅橡胶纳米复合材料即使在老化7天后仍能保持良好的弹性。石墨烯具有和碳纳米管相同的碳环结构,石墨烯的加入也能提高硅橡胶材料的热稳定性。J A SORIANO-ORTI等[69]以还原氧化石墨烯(RGO)为填料,工业硅橡胶为基体制备了复合材料,发现当RGO质量分数为0.8%时,复合材料的热稳定性最高,热分解温度比原硅橡胶高出了近50℃。近年来,研究者发现,通过化学氧化处理,碳纳米管可以解压缩形成碳纳米带(GNR)。GAN L等[70]将所制备的石墨烯纳米带采用简单的溶液混合方法均匀分散在MVQ基体中,制得石墨烯纳米带填充硅橡胶纳米复合材料。从热重分析曲线中发现,与原始硅橡胶相比,复合材料的热稳定性提高,材料失重5%时的温度明显提高。总体来看,耐热填料的选择以及具体配比会影响硅橡胶复合材料的制备工艺和热稳定性,是未来提高硅橡胶复合材料热稳定性最重要的研究方向之一。
低温环境下,硅橡胶材料内部的结晶行为是引起其机电性能变化的主要原因。在高寒环境下使用时,应着重关注硅橡胶力学性能的变化,避免因弹性丧失而致绝缘失效。抑制硅橡胶材料在低温下的结晶行为以及降低硅橡胶的玻璃化转变温度是提高硅橡胶材料耐寒性的关键,通过选用合适的填料、改变分子结构等手段来提高硅橡胶材料的耐寒性仍是值得关注的研究方向,对于拓宽硅橡胶在高寒地区、航空航天等领域的应用具有重要意义。
长时间的热氧环境下,硅橡胶会发生氧化交联和热降解,使得硅橡胶变硬变脆,力学性能和电气性能均会发生严重劣化。适当的交联可以提升硅橡胶的机电性能,因此,对硅橡胶进行二次硫化有助于提升其使用寿命。提高硅橡胶材料的热稳定性仍是研究工作的重点,在未来的研究中,耐热硅氧烷分子的合成和新型耐热填料的开发将成为提高硅橡胶热稳定性的重要手段。
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2024年第57卷第9期
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doi: 10.16790/j.cnki.1009-9239.im.2024.09.002
  • 接收时间:2024-02-01
  • 首发时间:2025-12-24
  • 出版时间:2024-09-20
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  • 收稿日期:2024-02-01
  • 修回日期:2024-03-15
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    西安交通大学 电工材料电气绝缘全国重点实验室,陕西 西安 710049

通讯作者:

王霞(1976-),女(汉族),山西运城人,教授,博导,博士,主要从事新型高压直流电缆及其直流料的研发、聚合物绝缘中空间电荷测量技术、高压电缆附件设计与故障诊断技术的研究。
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https://castjournals.cast.org.cn/joweb/jycl/CN/10.16790/j.cnki.1009-9239.im.2024.09.002
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2种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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