Article(id=1210560430343327831, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1210560429043085661, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2024.07.001, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1698768000000, receivedDateStr=2023-11-01, revisedDate=1701187200000, revisedDateStr=2023-11-29, acceptedDate=null, acceptedDateStr=null, onlineDate=1766549697719, onlineDateStr=2025-12-24, pubDate=1721404800000, pubDateStr=2024-07-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1766549697719, onlineIssueDateStr=2025-12-24, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1766549697719, creator=13701087609, updateTime=1766549697719, updator=13701087609, issue=Issue{id=1210560429043085661, tenantId=1146029695717560320, journalId=1149653034449285133, year='2024', volume='57', issue='7', pageStart='1', pageEnd='142', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1766549697408, creator=13701087609, updateTime=1766563951127, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1210620213532430860, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1210560429043085661, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1210620213532430861, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1210560429043085661, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=1, endPage=12, ext={EN=ArticleExt(id=1210560431756808287, articleId=1210560430343327831, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Progress on improving energy storage performance of polymer dielectrics by constructing trap energy level strategy, columnId=1198667062026531195, journalTitle=Insulating Materials, columnName=Review, runingTitle=null, highlight=null, articleAbstract=

In this paper, the space charge formation mechanism and space charge effect were systematically described. Three methods of constructing trap energy levels, including filling inorganic nanoparticles, doping small molecule semiconductors, and molecular structure design, were emphatically reviewed. The design strategy to improve the energy storage performance of the dielectric material were deeply discussed, and the preparation methods of high performance polymer dielectric materials were prospected.

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本文系统阐述了空间电荷形成机理及空间电荷效应,重点综述了填充无机纳米粒子、掺入小分子半导体和分子结构设计3种构建陷阱能级的方法,深入探讨了提高电介质材料储能性能的设计策略,并对高性能聚合物电介质材料的制备方法进行展望。

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刘雷鹏(1990-),男(汉族),陕西榆林人,讲师,主要从事电介质功能材料的研究。
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陈晓飞(2000-),女(汉族),甘肃定西人,硕士生,主要从事电介质功能材料的研究。

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通过构建陷阱能级策略提高聚合物电介质储能性能研究进展
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陈晓飞 , 贠浩辰 , 段远多 , 吕生华 , 刘雷鹏
绝缘材料 | 综述 2024,57(7): 1-12
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绝缘材料 | 综述 2024, 57(7): 1-12
通过构建陷阱能级策略提高聚合物电介质储能性能研究进展
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陈晓飞, 贠浩辰, 段远多, 吕生华, 刘雷鹏
作者信息
  • 陕西科技大学 轻工科学与工程学院,陕西 西安 710021
  • 陈晓飞(2000-),女(汉族),甘肃定西人,硕士生,主要从事电介质功能材料的研究。

通讯作者:

刘雷鹏(1990-),男(汉族),陕西榆林人,讲师,主要从事电介质功能材料的研究。
Progress on improving energy storage performance of polymer dielectrics by constructing trap energy level strategy
Xiaofei CHEN, Haochen YUN, Yuanduo DUAN, Shenghua LÜ, Leipeng LIU
Affiliations
  • College of Bioresources Chemical and Materials Engineering, Shaanxi University of Science and Technology, Xi′an 710021, China
出版时间: 2024-07-20 doi: 10.16790/j.cnki.1009-9239.im.2024.07.001
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本文系统阐述了空间电荷形成机理及空间电荷效应,重点综述了填充无机纳米粒子、掺入小分子半导体和分子结构设计3种构建陷阱能级的方法,深入探讨了提高电介质材料储能性能的设计策略,并对高性能聚合物电介质材料的制备方法进行展望。

聚合物电介质  /  陷阱能级  /  储能  /  空间电荷

In this paper, the space charge formation mechanism and space charge effect were systematically described. Three methods of constructing trap energy levels, including filling inorganic nanoparticles, doping small molecule semiconductors, and molecular structure design, were emphatically reviewed. The design strategy to improve the energy storage performance of the dielectric material were deeply discussed, and the preparation methods of high performance polymer dielectric materials were prospected.

polymer dielectrics  /  trap energy level  /  energy storage  /  space charge
陈晓飞, 贠浩辰, 段远多, 吕生华, 刘雷鹏. 通过构建陷阱能级策略提高聚合物电介质储能性能研究进展. 绝缘材料, 2024 , 57 (7) : 1 -12 . DOI: 10.16790/j.cnki.1009-9239.im.2024.07.001
Xiaofei CHEN, Haochen YUN, Yuanduo DUAN, Shenghua LÜ, Leipeng LIU. Progress on improving energy storage performance of polymer dielectrics by constructing trap energy level strategy[J]. Insulating Materials, 2024 , 57 (7) : 1 -12 . DOI: 10.16790/j.cnki.1009-9239.im.2024.07.001
聚合物电介质具有较高的电气强度、极快的充放电效率[1-2]和易加工等优点,广泛应用于电能储存[3-5]、电子电力[6-9]等领域。为了使聚合物电介质更好地应用于特殊环境,对电介质性能提出了更高的要求。因此,制备具有高电气强度、低介质损耗、耐高温的新型电介质材料获得了广泛关注。电介质内部总是存在少量自由电荷,它们是造成电介质漏电的原因。在外电场的作用下,束缚电荷的局部移动会导致电介质宏观上显示出电性,在其表面和内部电场不均匀的地方出现电荷,从而改变原来的电场分布[10-14]。因此,空间电荷的积累是电介质材料面临的主要问题[15-16]
近年来,通过构建陷阱能级策略来抑制空间电荷积累,从而提高聚合物电介质储能性能的研究取得了突出进展。构建缺陷能级的方法主要包括填充无机纳米粒子、掺杂小分子半导体、设计分子结构和引入功能基团。对于复合型电介质材料,电荷载流子的分布和迁移受纳米填料周围界面的影响[17],因此在聚合物中填充各种无机纳米粒子如BaTiO3、ArO2、Al2O3、SiO2和TiO2等,可以改变陷阱能级,提高电气强度,是改善聚合物储能性能的有效方法;同时可以在导体和绝缘层之间设计1个半导体层(NTCDA、DPDI、PTCBI、PCBM)来控制空间电荷注入,提高聚合物的储能性能。对于本征型电介质材料,通过引入极性基团或者设计分子结构构建陷阱能级,可以提高聚合物电介质的储能性能。
本文主要综述通过构建陷阱能级策略提高聚合物电介质储能性能的研究进展。首先介绍空间电荷形成的机理和空间电荷效应;然后从填充无机纳米粒子、掺杂小分子半导体和分子结构设计角度阐述抑制空间电荷积累来构建陷阱能级的方法;最后对制备高性能聚合物电介质材料进行展望。
空间电荷一般是指局部空间出现的非平衡电荷或过剩电荷,主要包括电子型、空穴型、离子型、偶极子型和等离子体型。大部分电介质禁宽中存在大量陷阱能级,空间电荷对电场分布的影响与陷阱对载流子的俘获特性有关。
在聚合物中,能带结构除了导带和价带外,还有大量的局域态,习惯将能够俘获载流子的局域态称为陷阱或俘获中心。聚合物晶区和非晶区的界面,分子的支链、端基,链的折叠、断裂和杂质等都能形成陷阱。
空间电荷是由电极注入到电介质中的非平衡电荷被存在电介质中的载流子陷阱所俘获而形成。图1为空间电荷形成的示意图,其中P区代表富含正电荷的区域,N区代表富含负电荷的区域。电介质在室温和低电场下的传导机制为欧姆传导,即自由电子在导带和价带空穴中运动,此时泄漏电流随外加电场增大呈线性上升。在高温和高电场下的传导机制主要为热电子发射、场发射和普尔-弗仑克尔(Poole-Frenkel,P-F)效应。
界面电接触可以使载流子从电极注入到介质或半导体内。电接触包括中性接触、欧姆接触和阻挡接触3种类型。
(1)中性接触
中性接触时无界面电荷,即φm=φi,其中φm表示金属逸出功,φi表示电介质逸出功。
(2)欧姆接触
欧姆接触时界面处费米能级向导带靠近,即在接触处及附近的自由载流子密度比半导体内高得多,界面成为载流子积累层。载流子积累层也称为势垒层。当φm<φi时,形成电子积累层;当φm>φi时,形成空穴积累层。
(3)阻挡接触
阻挡接触可以理解为:在金属为正极、半导体为负极的正向偏压下,电子容易从半导体流向金属;反之,金属中的电子流向半导体受到较高势垒的限制。
电极发射是指电子或空穴离开电极进入电介质的过程,主要包括热电子发射和场发射。
(1)热电子发射
在高温下,载流子获得足够的动能,可能跃出金属电极进入电介质,称为热电子发射。金属电极的热电子发射电流密度可用查理森方程表示,如式(1)所示。
JT=AT2exp(-φm/kT)
式(1)中:JTT≠0 K、E=0 V/m时的电极发射电流密度;A为查理森数;k为玻尔兹曼常数;T为温度。
(2)场发射
在极高电场下,电场可以把电子从金属中吸引到电介质中,这种现象称为场发射。场发射产生的电流密度JE可以用福勒-诺德海姆(Fowler-Nordheim)方程表示,如式(2)所示。
JE=AE2exp (-B/E)
式(2)中,A、B为常数。
增加电介质中载流子陷阱能级可以起到抑制P-F效应的作用,而电介质体内的载流子增加主要有两方面的因素。一是类似于电极的肖特基效应,在电介质内部受到库仑电势约束的电子在较强电场作用下,库仑势垒大幅降低,电子容易被释放,导致载流子数增加,这称为普尔-弗仑克尔(Poole-Frenkel,P-F)效应,也称内肖特基效应;二是在禁带相对较窄而存在热激发电子-空穴对的电介质中,外电场作用使耦合的载流子对分开,从而增大载流子浓度,这称为昂萨格效应。
空间电荷效应是指在电介质中,当电场强度较高时,电子受到电场力作用而移动,导致电子云在电场中发生形变,从而在电介质中形成空间电荷区域。这种效应会影响电场的分布和电介质的电学性质,与电场畸变、导电特性、电流特性和击穿特性之间存在一定的关系。
电场畸变是指电场空间分布不均匀或出现扭曲的现象,会导致电荷的聚集或分散,从而影响电荷之间的相互作用和电场的基本性质。例如纳米复合材料内部存在很多极性基团形成的深陷阱,深陷阱捕获电子和空穴,从而在纳米复合材料内部积聚同极性空间电荷,导致纳米复合材料内部发生畸变。
(1)增加异极(离子)电荷,提高直流电导率
在直流电流中,增加异极性(离子)电荷的数量,通常可以提高电导率。这是因为大量的离子会增加导电性能,从而使电流更容易通过电介质。
(2)改变肖特基(Schottky)发射特性
空间电荷效应在Schottky发射中起到形成和调制势垒、以及限制载流子流动的作用,并对肖特基发射特性产生影响。根据Schottky发射理论,电流密度J与平均场强Ea之间的关系可以用肖特基电流方程描述,如式(3)所示。
J~exp (βsEa/kT)
式(3)中,βs为肖特基系数。
式(3)可以看出,随着平均场强Ea的增大,电流密度J呈指数式上升。
(1)空间电荷限制电流
当空间电荷产生的电场与外电场达到平衡时,注入电流进入稳定状态,此时电介质中的电流是一种受空间电荷电场制约的电流,称为空间电荷限制电流。空间电荷限制电流密度与电场强度平方成正比,与电介质厚度成反比,可以用式(4)式(5)表示。
Js=98ε0εμEa2d
Js=98ε0εμθaU2d3
式(4)~(5)中:Js为空间电荷限制电流密度;ε0ε分别为电介质材料的相对介电常数和真空介电常数;μ为电介质内载流子迁移率;Ea为平均场强;d为电介质厚度;U为外加电压;当注入电荷大部分被陷阱俘获时,引入θa为修正系数。
(2)界面势垒控制电流
对于一些由大量晶粒与晶界构成的特殊多晶电介质,例如陶瓷材料等,在晶粒晶界处的结构和成分与晶粒内部有很大差异。当晶界相是高电阻而晶粒相是低电阻半导体时,这类材料的空间分布可看作是半导体晶粒相与电介质晶界相两相结构。于是,导电过程在晶粒内是导带的扩展态电导,由于在晶界处有许多结构缺陷与杂质,电子在其中的迁移为局域态跳跃电导,其迁移率很低。在晶粒与晶界的界面处,有晶界势垒存在,晶界势垒效应主导电介质的导电特性。
在高场强下,电子和离子的空间电荷效应导致电流增加,从而导致击穿现象的发生。以固体电介质击穿为例,击穿理论模型主要有电子击穿(主要包括本征电击穿、碰撞电离雪崩击穿和隧道击穿)、热击穿和力学击穿。
(1)本征电击穿
本征电击穿是绝缘材料本身发生的击穿现象。本征电击穿理论包括单电子近似模型理论和集合电子近似模型理论。
单电子近似模型理论忽略电介质中电子间的相互影响,温度升高引起晶格振动加强,电子碰撞概率增大,平行自由行程时间变短,击穿场强提高。
集合电子近似模型理论认为,对于无定型固体电介质或含杂质、缺陷很多的晶体电介质,禁带中存在陷阱能级和激发态能级。低温时,可以忽略电子间相互作用。温度较高时,处在陷阱能级激发态的电子数增多,导带电子把能量传递给陷阱能级激发态的电子,这些电子把能量传递给晶格,使晶格温度升高,击穿场强降低。
(2)碰撞电离雪崩击穿
碰撞电离雪崩击穿是一种击穿机制,通常发生在气体或电介质中。在这种击穿过程中,初始的自由电子或正离子受到电场加速,与原子或分子碰撞,从而形成一个电子雪崩效应。这种电子雪崩会导致局部电场强度急剧增加,最终导致气体或电介质发生击穿现象。
(3)隧道击穿
隧道击穿发生在薄层介质中,是指由隧道效应使电介质中电流激增至失去绝缘性能的现象。
(4)热击穿
热击穿是指当介质材料在外加电压下,因泄漏电流和松弛损耗产生的焦耳热不能及时发散,介质失去热平衡,温度快速升高,从而发生由热作用产生的介质击穿现象。在稳态电压作用下,介质温度变化慢,其内部热稳定,此时发生的热击穿称为稳态热击穿;反之,对于电压作用时间短(或脉冲电压下),因散热不及时而发生的热击穿称为脉冲热击穿。
(5)力学击穿
力学击穿是指在电介质中施加足够高的机械应力,使其发生击穿现象的过程。当电介质受到外部机械力作用时,电介质内部的原子或分子结构可能会发生变化,导致电介质的绝缘性能降低,最终导致电介质击穿,即在电介质中形成导电通路。在材料的强度或韧性不足以抵抗外力的情况下,容易发生力学击穿。
空间电荷影响电介质材料的储能性能,因此抑制空间电荷效应是提升电介质材料储能性能的关键。陷阱的空间分布和能量显著影响电介质材料的电传导,陷阱能级的增加可阻碍载流子的转移和注入,因此,构建陷阱能级可以有效抑制电介质中的空间电荷积累,改善电介质的储能性能。
复合材料可以充分利用不同材料的优点而深受研究者青睐。由于聚合物电介质材料具有加工性能好、电气强度高、介质损耗低、制备简单且保持了聚合物基体的柔韧性而受到广泛关注。但聚合物本身的低介电常数极大地制约了其进一步发展,研究者提出了许多改善其性能的策略,主要集中在调节空间电荷积累、电场畸变和自由载流子的运动[18]等方面。根据填料的不同,聚合物复合电介质材料主要包括无机填料/聚合物复合材料和全有机聚合物复合材料。
聚合物纳米复合材料是极具潜力的储能材料之一[19]。单组分的聚合物材料很难同时满足高电气强度和高介电常数的应用要求,因此通常引入一些无机纳米陶瓷填料包括氧化铝(Al2O3)、二氧化硅(SiO2)、钛酸钡(BaTiO3)、氮化硼纳米片(BNNS)等来解决这一问题。本质上,纳米颗粒具有巨大的比表面积,填充于聚合物中时形成聚合物-填料界面,从而影响电荷的捕获和传输。
研究表明,将纳米Al2O3掺杂到聚合物基体中能引入深陷阱,可有效抑制载流子传输。文献[20-21]基于聚丙烯(PP)、聚乙烯(PE)与Al2O3纳米粒子进行复合,研究了电介质的击穿性能。结果表明较低填料含量的纳米复合电介质能够抑制空间电荷的积累,提高复合材料的电气强度。实际上,将纳米填料掺杂在聚合物基体中可以在分子内部形成界面区域,深陷阱性质和相关的分子链运动发生变化,从而导致纳米复合电介质的电导率和直流击穿场强发生变化。文献[22-23]对环氧/氧化铝纳米复合材料在低温下的直流击穿特性和表面电位行为进行了研究,结果表明较高的陷阱密度能提高复合材料的直流电气强度,改善了介电性能。LÜ F C等[24]将经CF4/Ar等离子体处理的纳米Al2O3掺杂到环氧树脂中,结果表明界面氟化能够抑制空间电荷的积累,提高环氧树脂的电气强度。
FU J等[25]将一系列不同尺寸的纳米Al2O3填充到聚酰亚胺(PI)中研究复合材料的储能性能,结果表明宽带隙Al2O3引入基体中能形成更深的电荷陷阱来抑制空间电荷积累,降低泄漏电流,从而提高了聚合物电介质的高温储能特性。LI Z H等[26]通过在改性处理的PI薄膜表面涂覆纳米Al2O3,研究其储能性能。结果表明薄膜的高频绝缘性能显著提升,主要得益于功能性纳米Al2O3涂层提高了陷阱密度。
引入核壳结构的无机填料是提高聚合物电介质材料绝缘性能的有效途径。实际上,宽带隙核壳结构纳米粒子的引入会产生能量陷阱,减少传导损失,促进热传递。ZHOU J等[27]通过核壳结构的 M-SiO2@Al2O3颗粒改变环氧树脂复合材料的介电常数,为聚合物复合材料能量陷阱的研究提供理论参考。REN L L等[28]将以ZrO2为核和以Al2O3为壳的纳米粒子填充到聚醚酰亚胺(PEI)基体中制备复合材料,使复合材料在150℃下的放电能量密度达到5.19 J/cm3,这归功于宽带隙Al2O3壳在复合材料中产生的深陷阱。ZHENG W Y等[29]将核壳结构的Al2O3@ZrO2纳米粒子引入P(VDF-HFP)中制备复合薄膜,结果表明添加纳米粒子后复合薄膜的电荷捕获总量增加,陷阱密度提高,空间电荷运动受到抑制,提高了其储能性能。DING X P等[30]在PEI基体中填充新型宽带隙二维核壳结构的BNNS@Al2O3,结果表明PEI复合电介质具有出色的放电能量密度(5.74 J/cm3),在150℃下的储能效率达到91.5%。FAN Z H等[33]等制备了核壳结构的纳米颗粒,然后与PEI复合制备了PEI纳米复合材料,结果表明在150℃下PEI复合材料的储能密度高达10.2 J/cm3,储能效率达到83.5%。
在聚合物基体中填充SiO2可以提高聚合物复合材料的综合性能。环氧树脂复合材料的介电性能和极化弛豫性能可通过填充纳米SiO2来改善,归功于SiO2引入了陷阱能级,增强了无机-有机界面的结合强度。YANG G Q等[32-33]研究了环氧树脂与改性处理纳米SiO2复合材料的介电性能和弛豫性能,结果表明加入改性处理纳米SiO2后,在环氧树脂复合材料中引入了深陷阱,其介质损耗和电导率显著降低。A HASHEMI等[34]采用溶胶-凝胶法制备了作为栅极介电薄膜的高分子纳米复合材料,与纯聚合物相比,复合材料具有优异的热稳定性和较低的泄漏电流。JIANG X W等[35]研究了涂有环氧树脂(EP)且填充不同质量分数纳米SiO2和Si3N4的聚对苯二甲酸乙二醇酯(PET)薄膜的介电性能,结果表明纳米填料的添加使得复合薄膜的电气强度显著提高。
为了改善填料在基体中的分散性,通常对纳米填料进行表面改性。表面改性可以降低填料的表面能并提高其与聚合物的相容性,影响电荷分布和迁移,从而提高纳米复合材料的储能性能。DUAN Q J等[36]将经等离子体氟化处理的纳米SiO2掺杂到玻璃纤维增强聚合物基体中,结果表明掺杂改性纳米SiO2后在基体界面处引入深陷阱,有利于电子结合,增加了宽带隙,抑制了空间电荷的运动,提高了复合材料的电气强度。文献[37-40]以聚丙烯/聚乙烯-共辛烯混合物为基体,通过填充改性的SiO2开发新型纳米复合材料。研究发现填充改性的SiO2后使极化过程中注入的电荷量减少,表明电荷迁移率降低,有效提高了复合材料的介电性能。
I RYTOLUOTO等[41]对SiO2/聚丙烯纳米复合材料的介电性能进行了全面研究,结果表明纳米SiO2的掺入减少了直流电场下空间电荷的积累,改善了复合材料的陷阱密度。LIU K等[42]在聚二甲基硅氧烷基体中引入SiO2纳米粒子,结果表明加入SiO2纳米粒子改善了基体界面极化,提高了复合材料的介电常数。SUN B Z等[43]通过溶液浇注法制备了PEI/SiO2纳米复合材料,结果表明在高温下,纳米SiO2的引入降低了复合材料的电导率并显著提高了电气强度。
钛酸钡(BaTiO3)是一种常见的铁电陶瓷,特殊的钙钛矿立方晶体结构使其具有较高的介电常数和优异的压电性能。通常可以将具有高介电常数的填料与耐高温聚合物复合,制备出储能特性优异的电介质材料。而纳米粒子能够影响电荷陷阱的能级密度,从而抑制传导损耗并提高复合材料的电气强度。ZHI J P等[44]以PEI为基体,将BN纳米颗粒嵌入BaTiO3纳米纤维中制备BN/BaTiO3/PEI复合材料,结果表明在150℃下复合材料的储能密度达到5.23 J/cm3,储能效率大于90%。RU J S等[45]研究了PI/BaTiO3纳米复合薄膜的储能特性及击穿机制,结果表明陷阱参数在电气强度变化过程中起主导作用。随着BaTiO3的质量分数增加到50%时,平均陷阱深度从0.81 eV减小到0.44 eV。为了深入研究纳米填料对聚合物基体和填料界面间电荷分布的影响,JIA B B等[46]以钛酸钡/环氧树脂(BaTiO3/EP)复合材料为研究对象,阐明了复合界面处的介电性能和电荷迁移特性。不同界面处电荷注入和耗散存在显著差异,掺杂纳米BaTiO3粒子引入了更深的陷阱,可以抑制电荷迁移。
近年来的研究表明,氟化聚合物可以改变界面表面特性,在半导体和介电层之间产生巨大的能量势垒,进而有效阻止空间电荷载流子从半导体到介电层的转移[47-52]。TAO X L等[53]在氟化聚酰亚胺(F-PI)薄膜中掺杂BaTiO3纳米颗粒,诱导介电表面的电子在接触带电后产生深陷阱和界面极化,从而提高薄膜的热稳定性,使其在发电和运动检测等领域具有巨大的应用前景。Y J JEONG等[54]将聚五氟苯乙烯(PFS)与BaTiO3复合制备介电薄膜,与纯聚合物薄膜相比,复合介电薄膜的泄漏电流明显降低。此外,PFS/BaTiO3薄膜由于表面偶极子和吸电子的作用可以形成空穴注入势垒,减少空穴捕获概率。JIANG Z H等[55]在紫外光固化树脂基体中掺杂经氟硅烷偶联剂(FAS-17)改性的BaTiO3纳米颗粒制备光敏复合材料,结果表明复合材料具有低介质损耗和高电气强度,可广泛应用于储能、3D打印等领域。
构建核壳结构的电介质复合材料为储能领域的发展开辟了新的方向。GAO L等[56]在聚偏氟乙烯(PVDF)中掺杂具有核壳结构的BaTiO3@SiO2(BT@SO)纳米粒子制备复合材料,结果表明可以通过调节核壳结构厚度来提高复合材料的储能特性,此外复合材料的放电能量密度显著提高,这归因于电荷约束的高诱导极化、纳米填料引入的深层陷阱、保护屏障和吸附层的协同作用。LI J P等[57]设计了一种核壳结构的亚胺聚合物@钛酸钡(BT)材料。-CF3基团产生的能量陷阱可以有效阻碍高能量电荷载流子在电场作用下的运动,从而增强了复合材料的储能性能。
将绝缘无机涂层沉积在聚合物表面是降低导电损耗的有效方法,通过引入界面势垒,降低传导损耗,可以防止电荷注入。氮化硼纳米片(BNNS)作为一种具有高击穿特性的绝缘填料被广泛用于制备各类电介质复合材料。WANG T Y等[58]报道了一种由自组装获得的取向氮化硼纳米片薄膜,通过掺杂BNNS引入了浅陷阱,促进了聚合物表面电荷的耗散,所得薄膜兼具优异的绝缘性能和导热性能,同时能保持较低的介质损耗和泄漏电流。类似地,WANG T Y等[59]通过将BNNS自组装在各种聚合物电介质上形成纳米涂层,结果表明纳米涂层的电荷耗散速率加快,且电气强度和介电常数显著提高。T LINKER等[60]通过实验模拟的方法,验证了界面处的BNNS涂层能捕获载流子,有效减少由载流子造成的损耗,进而提高材料的电气强度。LIU X J等[61]制备了PI/BNNS复合薄膜,BNNS作为电荷阻挡层调节了界面处的电荷迁移率并提高了电荷捕获能力,使高温下复合薄膜具有优异的储能特性。刘艺辰等[62]研究了PEI/BNNS复合电介质陷阱分布对储能特性的影响,结果表明适量掺杂BNNS能够形成深能级陷阱,提升复合电介质的击穿性能和储能特性。
近年来,研究者从多角度对聚合物电介质进行研究,新颖地提出将矿物原料例如纳米颗粒蒙脱石[63-65]、羟基磷灰石[66-67]、纳米黏土[68]等掺入聚合物基体中,提高聚合物电介质的综合性能。
除以上纳米粒子外,一些文献还报道了将高介电常数的ZrO2纳米粒子[69-70]、功能性纳米粒子SrO[71]、ZnO[72-77]、MgO[78-80]、TiO2[81]、硅氧烷基填料POSS[82-86]等掺入到聚合物基体中,通过深陷阱减少空间电荷的积累,抑制电场畸变,降低传导损耗,从而改善复合材料的介电性能,提高复合材料的绝缘性能,为聚合物电介质未来发展开辟了新的方向。
与无机填料相比,有机填料与聚合物基体具有良好的相容性。分子半导体中的自由电子通过强烈的静电吸引力阻碍电荷的注入和传输,有利于储能特性的提升。QIAO R等[87]n型分子半导体PTCBI(顺反混合物)引入到PEI基体中,在PTCBI/PEI共混物中构建电子陷阱,减少了电荷传输,使共混物在高温下表现出优异的储能特性。类似地,ZHANG B等[88]将1,4,5,8-萘四甲酸二酐(NTCDA)与PEI共混制备电介质复合材料。通过能带差异建立陷阱能级,使电介质复合材料的泄漏电流显著降低,电气强度提高,在高温下放电效率达到85%。YUAN C等[89]制备了一种由介电聚合物与分子半导体混合而成的全有机复合材料(PEI/PCBM),该复合材料在200℃下表现出高能量密度(3.0 J/cm3)和高放电效率(90%),远优于现有的聚合物纳米复合材料。REN W B等[90]在具有偶极基团的新型PI基体中引入有机半导体PCBM制备复合薄膜,结果表明复合薄膜在高温下具有出色的储能特性,很大程度上得益于深电荷陷阱引起的高电气强度。
铁电聚合物聚偏氟乙烯(PVDF)独特的分子结构和晶体结构使其具有相对较高的介电常数(10~12)。文献[91-93]报道了基于PVDF的具有高能量密度和放电效率的全有机复合薄膜。他们将MMA-co-GMA(MG)共聚物引入PVDF中制备复合薄膜,GMA组分赋予了材料高极性和深陷阱,氢键相互作用提高了复合薄膜的储能效率[91-92]。进一步地,将氰乙基化纤维素(CR-C)作为第三组分添加到PVDF复合基体中以改善储能密度(Ue)和电气强度(Eb),结果发现深陷阱效应和氰基的高极化特性显著提高了介电薄膜的EbUe[93]。LIU X等[94]以4-氰基-4′-戊基联苯作为填料制备PVDF基介电薄膜,强极性基团的引入和电荷陷阱的形成有助于获得高性能的柔性介电材料。LIU G等[95]制备了夹层结构的聚碳酸酯(PC)/PVDF复合电介质材料。结果表明PC层能阻碍电荷注入,提高复合材料的耐高温特性和储能特性。
研究者从多角度出发,阐明了陷阱能级对电介质材料储能特性的影响。RAN Z Y等[96]设计出螺旋结构的介电聚合物,螺旋基团破坏了共轭平面,引入了深陷阱位点从而调控了电荷传输过程,使介电聚合物具有优异的电容性能和热稳定性。张志成教授团队[97-98]通过引入缺电子乙烯基喹啉VQQ单元,构建表面聚合物载流子陷阱层,显著提高了聚合物电介质的高温储能特性。DING S等[99]设计了一种全有机聚醚酰亚胺/聚(亚芳基醚脲)聚合物共混薄膜,结果表明引入深层陷阱有效降低了传导损耗,提高了薄膜的储能特性。NIU Y J等[100]通过构建载流子阻断界面,设计了一种全聚合物高温电介质,有效降低了高温下的传导损耗。M DAS等[101]分别将3种磺酸(SA)掺入到聚苯胺(PANI)中,结果表明掺杂SA的材料表现出更好的热稳定性和更高的介电常数。
纳米复合材料并不是在电介质中产生深电荷陷阱的唯一策略。不同于复合型电介质材料的偶极极化和界面极化,本征型电介质材料的介电常数主要由聚合物本身所固有的电子、原子/离子和取向极化所导致。理论上,偶极玻璃态聚合物电介质能形成深陷阱来抑制电子传导,从而具有较低的介质损耗,是一种有潜力的高性能电介质材料[102]
通常可以通过分子结构设计来获得高性能聚合物电介质。PI分子结构设计性强,具有优异的热稳定性、力学性能和电绝缘性能,被广泛用于介电储能材料[103-104]。LIU X J等[105]通过调节聚酰胺酸的反应动力学优化PI的分子结构,一方面-COOH/-CN-OH-极性基团可以增加偶极子极化来增大相对介电常数;另一方面适量的-COOH/-CN-OH-基团作为深陷阱会减少载流子的迁移,进而提高电气强度。另外,通过控制酰亚胺化程度能有效抑制空间电荷积累并改善电场畸变。
除此之外,接枝功能基团是制备本征型电介质的另一种策略,一般纯的聚合物结构单一,无法获得高性能电介质材料以满足其进一步应用。可以考虑将两种或多种单体共聚来获得储能特性优异的材料。HE G H等[106]通过自由基聚合和可逆加成断链转移聚合合成了无规共聚物P(St-co-CBMA)和嵌段共聚物PS-b-PCBMA,两种共聚物都具有高介电常数和高储能效率,这归功于在共聚物中成功构建了电子深陷阱及较强的取向极化。TANG X X等[107]首次报道了高性能硝化聚苯乙烯薄膜,硝基取代基引入了电荷陷阱,减少了高电场下的电荷迁移,使载流子通道遭到破坏,显著提升了薄膜的电气强度。ZHANG M R等[108]报道了一种由甲基丙烯酸甲酯(MMA)和作为电荷陷阱的富电子乙烯基咔唑(VK)单元共聚的介电材料。VK单元提供了均匀分布的陷阱位点来捕获聚合物中的自由电荷载流子,使得聚合物电介质具有高能量密度和放电效率。ZHAO X D等[109]通过对接枝氯乙酸烯丙酯(CAAE)进行化学改性,制备了绝缘性能优异的改性交联聚乙烯(XLPE)。改性XLPE电气强度的提高和电导率的下降主要在于空间电荷积累和载流子迁移得到了有效抑制。ZHAO Y S等[110]报道了一种将氯引入环氧树脂中以调节材料中电荷陷阱深度的方法。强电负性氯原子的诱导效应和氧原子的共轭效应改变了环氧树脂中的陷阱能级分布,抑制了表面电荷积累,提高了表面电导率。强电负性卤素-苯基官能化的介电薄膜也引起了研究者的关注[111-112],强极性官能团的引入可以促进聚合物电介质分子链结构的偶极取向极化,提高介电常数;高电子亲和力的卤素基团能产生众多电荷俘获位点,提高储能效率。
虽然学者们对本征型介电材料在高温储能领域的研究取得了一定的进展,大部分集中在偶极子密度和结构性能上的优化,获得的材料具有较高的介电稳定性和热稳定性,但其在高温条件下的储能特性有待进一步提高。
构建陷阱能级可有效抑制空间电荷积累、限制载流子迁移从而降低传导损耗和泄漏电流,提高聚合物电介质材料的储能特性。其中无机聚合物复合材料可以在界面区域引入陷阱,目前在储能领域已经取得了突出的成就,然而无机填料在聚合物基体中分散不均甚至团聚会严重影响其储能特性。掺杂小分子半导体制备全有机聚合物复合材料是构建陷阱的另一种有效策略,因有机填料和聚合物基体间具有更好的相容性,有利于制备高性能电介质材料。除此之外,还可以通过设计分子结构和接枝功能基团来制备本征型电介质材料,引入陷阱限制载流子的迁移,但是这种方法往往受到聚合物基体的限制。
总体来看,目前多数聚合物电介质研究停留在实验室阶段,难以工业化生产,且引入陷阱能级的方法比较单一,相关理论有待进一步完善。未来高性能聚合物电介质材料的制备方法将更加多样化、智能化和可持续化,注重提高材料的性能、功能和应用范围,以满足不断发展的电子、能源存储等领域的需求。制备兼具高介电常数、高电气强度、低介质损耗和高热稳定性的聚合物电介质材料,还需多学科多领域研究者的共同合作。
  • 国家自然科学基金资助项目(52203011)
  • 中国博士后基金特别资助项目(站前)(2019TQ0257)
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2024年第57卷第7期
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doi: 10.16790/j.cnki.1009-9239.im.2024.07.001
  • 接收时间:2023-11-01
  • 首发时间:2025-12-24
  • 出版时间:2024-07-20
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  • 收稿日期:2023-11-01
  • 修回日期:2023-11-29
基金
国家自然科学基金资助项目(52203011)
中国博士后基金特别资助项目(站前)(2019TQ0257)
作者信息
    陕西科技大学 轻工科学与工程学院,陕西 西安 710021

通讯作者:

刘雷鹏(1990-),男(汉族),陕西榆林人,讲师,主要从事电介质功能材料的研究。
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2种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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