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Article(id=1199642732500185438, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1199642729207660562, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2023.11.015, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1672761600000, receivedDateStr=2023-01-04, revisedDate=1677772800000, revisedDateStr=2023-03-03, acceptedDate=null, acceptedDateStr=null, onlineDate=1763946715711, onlineDateStr=2025-11-24, pubDate=1700409600000, pubDateStr=2023-11-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1763946715711, onlineIssueDateStr=2025-11-24, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1763946715711, creator=13701087609, updateTime=1763946715711, updator=13701087609, issue=Issue{id=1199642729207660562, tenantId=1146029695717560320, journalId=1149653034449285133, year='2023', volume='56', issue='11', pageStart='1', pageEnd='116', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1763946714927, creator=13701087609, updateTime=1766563708953, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1210619197772657229, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1199642729207660562, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1210619197772657230, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1199642729207660562, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=94, endPage=100, ext={EN=ArticleExt(id=1199642733905277286, articleId=1199642732500185438, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Analysis on surface flashover characteristics of silicone rubber composite insulators under mold contamination, columnId=1192878364340924664, journalTitle=Insulating Materials, columnName=Test and Analysis, runingTitle=null, highlight=null, articleAbstract=

The silicone rubber composite insulators operating in humid and hot areas has the problem of microbial contamination caused by mold adhesion, and the effect of mold as a special biological pollution on the performance of silicone rubber insulators is still unclear. In this paper, the suspended insulator strings were contaminated by mold, and their surface flashover characteristics were analyzed under different pollution levels. The influence of mold contamination on the surface flashover properties of insulator was studied by hydrophobicity analysis, scanning electron microscopy, and infrared spectroscopy. The results show that for the insulators with the same pollution level, when there is mold pollution, the mold would damage the surface structure of silicone rubber compared with insulators without mold pollution, resulting in a significant decrease in the hydrophobicity of silicone rubber, and thus the flashover voltage is reduced significantly. Compared with the control group, the surface flashover voltage can be reduced to 76% of the original level at the lowest. However, under the same pollution level, when the mold concentration reaches 107 pcs/cm2, there is an inflection point for the decrease of surface flashover voltage, and the decline rate slows down and tends to saturation. In summary, the synergistic effect of mold adhesion behavior and natural ageing of silicone rubber makes the mold mycelium form micro holes on the surface of insulator, resulting in the breakage of silicone rubber molecular chain, reducing the flashover voltage of insulator, and affecting the stable operation of silicone rubber insulators.

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硅橡胶复合绝缘子在湿热地区中运行其表面存在霉菌附着引起的微生物染污问题，霉菌作为一种特殊的生物污秽对硅橡胶绝缘子性能的影响尚不明确。本文对悬式绝缘子串进行霉菌染污，并在不同污秽等级下对绝缘子串沿面闪络特性进行分析，通过憎水性分析、扫描电镜以及红外光谱3种微观测试方法研究霉菌浓度对绝缘子沿面闪络特性的影响。结果表明：对于同一污秽等级的绝缘子，当存在霉菌污染时，相较于无霉菌染污的绝缘子，霉菌对硅橡胶表面结构造成破坏，导致硅橡胶憎水性显著降低，进而造成闪络电压大幅降低，与对照组相比，沿面闪络电压最低可下降至原始水平的76%；但在同一污秽等级下，霉菌浓度达到107 个/cm2时，沿面闪络电压下降出现拐点，下降速度放缓并趋于饱和状态。综上，霉菌的附着行为与硅橡胶自然老化协同作用使霉菌菌丝在绝缘子表面形成微型孔洞，导致有机硅橡胶分子链断裂，降低了绝缘子的闪络电压，影响了硅橡胶绝缘子的稳定运行。

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杨世芳（1994-），女（汉族），河北保定人，讲师，博士，主要从事高电压外绝缘生物染污问题、退役绝缘材料无害化处理等方面的研究；
刘云鹏（1976-），男（汉族），安徽六安人，教授，主要从事特高压输电技术、电气设备在线检测和外绝缘方面的研究。
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陈天羽（1999-），女（汉族），河北保定人，硕士生，主要从事微生物污染的硅橡胶对高压绝缘特性的影响方面的研究。

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陈天羽（1999-），女（汉族），河北保定人，硕士生，主要从事微生物污染的硅橡胶对高压绝缘特性的影响方面的研究。

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陈天羽（1999-），女（汉族），河北保定人，硕士生，主要从事微生物污染的硅橡胶对高压绝缘特性的影响方面的研究。

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污秽等级ESDDNSDD
Ⅰ级污染0.050.5
Ⅱ级污染0.11.0
Ⅲ级污染0.22.0
Ⅳ级污染0.44.0
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污秽等级的盐灰密

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污秽等级ESDDNSDD
Ⅰ级污染0.050.5
Ⅱ级污染0.11.0
Ⅲ级污染0.22.0
Ⅳ级污染0.44.0
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霉菌浓度/(个/cm2)峰高
-CH3Si-OSi-O/-CH3
00.8740.8620.986
1050.9890.9600.971
1060.9090.9401.034
1071.0491.0691.019
1081.0801.0931.012
1091.0211.0581.036
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有机基团与无机基团的峰高比值

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霉菌浓度/(个/cm2)峰高
-CH3Si-OSi-O/-CH3
00.8740.8620.986
1050.9890.9600.971
1060.9090.9401.034
1071.0491.0691.019
1081.0801.0931.012
1091.0211.0581.036
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霉菌染污状态下硅橡胶复合绝缘子的沿面闪络特性分析
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陈天羽 1 , 杨世芳 1 , 刘云鹏 1 , 李泳霖 2 , 耿江海 1 , 王瑶 1 , 贾志东 3 , 夏云峰 4
绝缘材料 | 测试与分析 2023,56(11): 94-100
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绝缘材料 | 测试与分析 2023, 56(11): 94-100
霉菌染污状态下硅橡胶复合绝缘子的沿面闪络特性分析
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陈天羽1, 杨世芳1, 刘云鹏1, 李泳霖2, 耿江海1, 王瑶1, 贾志东3, 夏云峰4
作者信息
  • 1华北电力大学 河北省输变电设备安全防御重点实验室,河北 保定 071003
  • 2国网济南供电公司,山东 济南 250000
  • 3清华大学深圳国际研究生院,广东 深圳 518055
  • 4海南电网有限责任公司输电运检分公司,海南 海口 570203

    • 陈天羽（1999-），女（汉族），河北保定人，硕士生，主要从事微生物污染的硅橡胶对高压绝缘特性的影响方面的研究。

通讯作者:

杨世芳（1994-），女（汉族），河北保定人，讲师，博士，主要从事高电压外绝缘生物染污问题、退役绝缘材料无害化处理等方面的研究；
刘云鹏（1976-），男（汉族），安徽六安人，教授，主要从事特高压输电技术、电气设备在线检测和外绝缘方面的研究。
Analysis on surface flashover characteristics of silicone rubber composite insulators under mold contamination
Tianyu CHEN1, Shifang YANG1, Yunpeng LIU1, Yonglin LI2, Jianghai GENG1, Yao WANG1, Zhidong JIA3, Yunfeng XIA4
Affiliations
  • 1Hebei Provincial Key Laboratory of Power Transmission Equipment Security Defense, North China Electric;Power University, Baoding 071003, China
  • 2State Grid Jinan Power Supply Company, Jinan 250000, China
  • 3Shenzhen Graduate School of Tsinghua University, Shenzhen 518055, China
  • 4Power Transmission Operation & Maintenance Branch, Hainan Power Grid Co., Ltd., Haikou 570203, China
出版时间: 2023-11-20 doi: 10.16790/j.cnki.1009-9239.im.2023.11.015
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摘要
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硅橡胶复合绝缘子在湿热地区中运行其表面存在霉菌附着引起的微生物染污问题，霉菌作为一种特殊的生物污秽对硅橡胶绝缘子性能的影响尚不明确。本文对悬式绝缘子串进行霉菌染污，并在不同污秽等级下对绝缘子串沿面闪络特性进行分析，通过憎水性分析、扫描电镜以及红外光谱3种微观测试方法研究霉菌浓度对绝缘子沿面闪络特性的影响。结果表明：对于同一污秽等级的绝缘子，当存在霉菌污染时，相较于无霉菌染污的绝缘子，霉菌对硅橡胶表面结构造成破坏，导致硅橡胶憎水性显著降低，进而造成闪络电压大幅降低，与对照组相比，沿面闪络电压最低可下降至原始水平的76%；但在同一污秽等级下，霉菌浓度达到107 个/cm2时，沿面闪络电压下降出现拐点，下降速度放缓并趋于饱和状态。综上，霉菌的附着行为与硅橡胶自然老化协同作用使霉菌菌丝在绝缘子表面形成微型孔洞，导致有机硅橡胶分子链断裂，降低了绝缘子的闪络电压，影响了硅橡胶绝缘子的稳定运行。

霉菌  /  硅橡胶  /  闪络电压  /  憎水性  /  微观测试

The silicone rubber composite insulators operating in humid and hot areas has the problem of microbial contamination caused by mold adhesion, and the effect of mold as a special biological pollution on the performance of silicone rubber insulators is still unclear. In this paper, the suspended insulator strings were contaminated by mold, and their surface flashover characteristics were analyzed under different pollution levels. The influence of mold contamination on the surface flashover properties of insulator was studied by hydrophobicity analysis, scanning electron microscopy, and infrared spectroscopy. The results show that for the insulators with the same pollution level, when there is mold pollution, the mold would damage the surface structure of silicone rubber compared with insulators without mold pollution, resulting in a significant decrease in the hydrophobicity of silicone rubber, and thus the flashover voltage is reduced significantly. Compared with the control group, the surface flashover voltage can be reduced to 76% of the original level at the lowest. However, under the same pollution level, when the mold concentration reaches 107 pcs/cm2, there is an inflection point for the decrease of surface flashover voltage, and the decline rate slows down and tends to saturation. In summary, the synergistic effect of mold adhesion behavior and natural ageing of silicone rubber makes the mold mycelium form micro holes on the surface of insulator, resulting in the breakage of silicone rubber molecular chain, reducing the flashover voltage of insulator, and affecting the stable operation of silicone rubber insulators.

mold  /  silicone rubber  /  flashover voltage  /  hydrophobicity  /  microscopic testing
陈天羽, 杨世芳, 刘云鹏, 李泳霖, 耿江海, 王瑶, 贾志东, 夏云峰. 霉菌染污状态下硅橡胶复合绝缘子的沿面闪络特性分析. 绝缘材料, 2023 , 56 (11) : 94 -100 . DOI: 10.16790/j.cnki.1009-9239.im.2023.11.015
Tianyu CHEN, Shifang YANG, Yunpeng LIU, Yonglin LI, Jianghai GENG, Yao WANG, Zhidong JIA, Yunfeng XIA. Analysis on surface flashover characteristics of silicone rubber composite insulators under mold contamination[J]. Insulating Materials, 2023 , 56 (11) : 94 -100 . DOI: 10.16790/j.cnki.1009-9239.im.2023.11.015
正文
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0 引言
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硅橡胶复合绝缘材料具有优异的憎水性和良好的耐污闪性能，其在高压绝缘领域应用十分广泛[1-5]。我国幅员辽阔，气候环境复杂，其中广东、四川、云南等地区属亚热带季风气候，高压输电线路经过温湿及湿热地区时，空气中漂浮的大量菌类孢子在适宜天气条件下会在硅橡胶绝缘子表面粘附、萌发，这种霉菌染污硅橡胶绝缘子的现象难以避免[6-7]。
霉菌附着对硅橡胶绝缘子的影响程度存在一定争议，国内外学者[8-9]在四川雅安、四川广安、云南昭通、美国佛罗里达州和德克萨斯州的内陆地区发现运行的绝缘子上有黑色生物的生长迹象，采集生物样品，经鉴定有黑曲霉菌的存在。各国学者对霉菌染污硅橡胶进行了相关研究，如对美国沿海气候佐治亚州[8]以及内陆气候德克萨斯州与佛罗里达州[9]等地区的支柱绝缘子观察到黑点形式的黑曲霉菌污染，推论出霉菌的生长取决于硅橡胶配方[8]。S M GUBANSKI等[7]与A F LEÓN等[10]提出，由硅橡胶混合物制成的绝缘体可支持霉菌等微生物生长。XIA G L等[11]认为与地衣生长相比，绝缘子表面的霉菌生长对安全操作具有更大的危害。OUYANG X G等[12]和A F LEÓN等[13]研究发现，霉菌污染绝缘子后，陶瓷和聚合物绝缘子的闪络电压分别降低了约21%和8%。M N DINESH等[14]认为霉菌的染污易形成生物膜，从而吸收空气中的水分，形成亲水性生物膜，进而在绝缘子表面出现导电层，容易引发硅橡胶绝缘子的闪络，给电网安全稳定运行造成潜在的威胁。但R GORUR等[15]指出霉菌覆着硅橡胶绝缘子的现象很普遍，数量不足以肉眼可见，对复合绝缘子电性能的影响相当小，且霉菌渗入材料表面的速度极慢，不太可能将材料分解。以上研究结论在霉菌对硅橡胶绝缘子影响程度上具有一定的差异性，目前学者对热带地区的低压配电网复合绝缘子藻类附生现象研究较多，结果表明附生藻类的绝缘子湿闪电压会降低10%～30%，且泄漏电流明显增大，但对于霉菌附生绝缘子影响的研究较少，因此亟需展开霉菌染污复合绝缘子的沿面闪络特性研究[16]。
温湿环境是霉菌生长必不可少的条件，绝缘子伞裙下支柱连接处水分蒸发较慢，会在较长时间内处于湿润状态，故霉菌极易在硅橡胶绝缘子伞裙下遮光处以及芯棒附近大量繁殖，如图1所示。通过研究美国弗罗里达州、四川雅安市、云南昭通市3个存在霉菌染污现象地区的气温、湿度等环境因素，发现霉菌生长在热带、亚热带气候居多，且更易生长于湿度差距较大的地区以及湖泊附近，在实际变电站中，发现绝缘子上霉菌生长不均匀，但由支柱向外生长。
本文选取上述3个地方生长的黑曲霉菌种作为实验菌种，并将附着有黑曲霉菌的悬式绝缘子串作为研究对象，模拟不同盐灰密等级，在霉菌染污状态下，对悬式绝缘子串进行闪络试验，研究绝缘子串电气性能的变化规律。为探究其影响机理，在实验室条件下，通过静态接触角、扫描电子显微镜（SEM）、傅里叶红外光谱分析（FTIR）测试，对受污染的硅橡胶复合绝缘材料进行憎水性、表面微观形貌、化合物结构分析，研究霉菌污染对硅橡胶绝缘子的影响。
1 实验
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1.1 主要原材料
悬式绝缘子若干，型号为FXBW4-10/100。
1.2 样品的制备
称取10 g黑曲霉菌倒入500 mL三角瓶容器中，加入100 mL去离子水进行分散作为母液菌悬液。将母液菌悬液在100 mL三角瓶中进行稀释，用移液枪吸取5.0 mL母液菌悬液加入至45 mL无菌水中充分混匀。用移液枪吸取1.0 mL上述稀释液并加入9 mL无菌水置于20 mL刻度试管中，按浓度比为1∶10进行系列梯度稀释，分别得到1∶1×101、1∶1×102、1∶1×103、1∶1×104不同稀释度的菌悬液。取3个连续且霉菌含量适宜的稀释度，充分振荡，用移液枪分别吸取0.1 mL不同稀释度的菌悬液，加入至预先制备好的固体培养基平板上，分别用一次性无菌塑料涂布棒将不同稀释度的菌悬液均匀的涂于琼脂表面，每一稀释度重复3次，同时以无菌水做空白对照，将培养基平板置于30℃条件下培养48 h。通过镜检手段进行菌落计数确定黑曲霉菌的数量，由式（1）计算得到单位质量有效活菌数。
nm=kv1/m0v2×10-8
式（1）中：nm为单位质量有效活菌数（亿/g）；kv1为稀释倍数；m0为样品质量（g）；v2为菌悬液加入量（mL）。
经过计算配置了5组不同浓度霉菌溶液，浓度分别为105、106、107、108、109个/cm2，同时得到相应浓度等级菌液染污的硅橡胶复合绝缘子，并模拟4种不同污秽等级进行染污。根据GB/T 26218.4—2010相关要求[17]，将无机污染物设置成4个污秽等级的盐密（ESDD）和灰密（NSDD），如表1所示。为模拟现场实际情况，污染区域为除去上伞裙上表面以及下伞裙下表面的的全部区域，染污面积为486.3 cm2，染污区域如图2所示。
2 结果与分析
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2.1 污闪闪络试验
为分析霉菌对绝缘子电气性能的影响，本文采用直线型污染带进行闪络特性测试。根据GB/T 4585—2004相关要求[18]，首先使用去离子水清洁绝缘子串，晾干后进行染污。设置4组不同等级的盐灰密，在每个等级盐灰密下设置5组不同霉菌浓度染污的绝缘子串，涂刷污秽后在室内自然晾干，选用铜线将额定电压为110 kV的变压器连接一端电极，另一端电极连接接地装置后将其置于起雾装置中，待起雾装置起雾，硅橡胶绝缘子串表面达到饱和受潮的要求时进行后续试验，实验接线原理如图3所示。对每个样品采用定量涂刷法进行染污，通过升压法测试样品，升压速率为0.45 kV/s，环境温度为25℃，先后闪络5次，闪络前后间隔15 min，重新饱和润湿，将5次实验的平均值作为最终闪络电压[19-20]。电弧沿污秽带迅速发展，贯穿两极，呈现出明亮的电弧放电通道，如图4所示。实验设有对照组，在洁净的状态下，闪络电压可达到100.4 kV。
在不同污秽等级下，霉菌染污浓度对闪络电压的影响如图5所示。从图5可以看出，在同一污染等级下，随着霉菌浓度的增加，闪络电压明显降低，平均下降10%，相较于原始对照组，电压下降率均为50%～75%。在不同污秽等级下，随着盐灰密的增加，电场畸变严重，闪络电压下降明显，但当污秽等级达到IV级时，闪络电压不再下降，IV级污秽的闪络电压普遍高于或等于III级污秽的闪络电压，这是因为随着污秽等级增加，普通污秽相较霉菌污秽与硅橡胶表面直接接触的比例增加，从而降低了霉菌的影响程度。
图6为不同霉菌浓度下硅橡胶的闪络电压下降率。从图6可以看出，在同一污秽等级下，随着霉菌浓度的增加，硅橡胶复合绝缘材料的沿面闪络电压下降率不断升高，当霉菌浓度达到107个/cm2时，闪络电压基本达到饱和。在排除无机污染的影响，只考虑霉菌附着的条件下，闪络电压最低可降至原始水平的76%。在同一霉菌浓度下，由于霉菌生长会破坏硅橡胶绝缘材料的表面结构，对其绝缘性能也有影响，导致绝缘材料表面结构呈现亲水性，此时由于盐灰密可吸收水分，盐灰密对绝缘子闪络的影响会更显著，大幅降低了闪络电压，影响其绝缘性能，发生闪络现象。为验证霉菌染污后硅橡胶绝缘子串闪络电压下降的原因，进行了后续的研究。
2.2 憎水性及憎水迁移性
使用JC200D型动静态接触角测量仪，利用静态接触角测量法对霉菌染污绝缘子的憎水性以及憎水迁移性进行研究。用蘸取无水酒精的棉棒将样品擦拭干净，防止霉菌或生物膜对结果造成影响。每次测量时滴5 μL去离子水，取5个不同方位点测量静态接触角，取平均值作为最终静态接触角测量结果。
标准硅橡胶复合绝缘材料的接触角为（95±5）°。静态接触角测量结果如图7(a)所示，可以看出无霉菌染污对照组的静态接触角为103.08°，说明该材料具有很强的憎水性。霉菌浓度为105个/cm2和106个/cm2的样品静态接触角下降至80°以下，说明憎水性被破坏。霉菌浓度为107～109个/cm2的样品静态接触角均下降到50°～40°，静态接触角随霉菌浓度增加逐渐减小且变化越来越明显，呈现较强的亲水性。憎水性光学照片如图7(b)所示，可以看出随着随霉菌浓度增加，接触角逐渐变小，亲水性表现愈发明显。
为探究霉菌对绝缘子憎水恢复性的影响程度，将上述试片放入25℃、相对湿度为65%的恒温恒湿箱中，每经过4 h测试一次静态接触角，结果如图8所示。从图8可以看出，随着时间增加，试片的憎水性有不同程度的恢复，经过48 h后，霉菌浓度为105个/cm2和106个/cm2的样品静态接触角均恢复至（95±5）°且趋于饱和，其余样品的静态接触角均未恢复到标准值，霉菌浓度为107～109个/cm2的样品静态接触角较低，说明低浓度菌液会影响硅橡胶复合绝缘材料的憎水性，将霉菌去除后憎水性会恢复至接近正常状态，但当霉菌到达一定浓度后，会导致硅橡胶复合绝缘材料的憎水性丧失，静态接触角降低至40°左右。
2.3 微观形貌
利用扫描电子显微镜（SEM）观测硅橡胶表面被霉菌腐蚀后的微观形貌，检测仪器为美国-FEI-NOVA公司NANO 230型场发射扫描电镜，该电镜加速电压为1～30 kV，放大倍数为200～200 000，分辨率为1.0 nm（15 kV）。在使用扫描电镜对样品进行观测前，需要进行喷金处理，随后放入SEM腔体进行微观形貌测试，放大倍数分别为500、2 000、10 000、20 000。样品尺寸约为5 mm×5 mm×2 mm，其中有两个样品用无水乙醇擦拭以保证表面洁净，作为无霉菌附着样品进行对比。
霉菌腐蚀后硅橡胶样品形貌如图9所示。从图9(a)可以看出，菌丝横生，菌丝上有若干孢子附着；将样品经酒精擦拭后放大2 000倍，形貌如图9(b)所示，从图中可以看出表面呈絮状形态，凹凸不平，不够平整光滑，有明显的裂缝和孔隙等表面结构劣化；将霉菌附着的硅橡胶区域放大至2 000倍，形貌如图9(c)所示，从图中可以看出硅橡胶表面被菌丝缠绕以及孢子附着，表面存在裂缝；将霉菌附着样品放大至10 000倍，形貌如图9(d)所示，从图中可以看出硅橡胶表面劣化出现孔洞并且周围有明显的孢子附着；将去除霉菌样品放大至20 000倍，形貌如图9(e)所示，从图中可以看出去除霉菌菌丝后硅橡胶表面未看到孢子以及菌丝的存在，存在多个不规则的孔洞，孔径为0.5～2.5 μm。
2.4 化学基团
为探究霉菌附着前后硅橡胶表面结构的变化特征，利用傅里叶红外光谱仪进行测试，仪器为布鲁克北京科技有限公司生产的原位红外检测仪，型号为INVENIOS。切取样品长和宽都为3 mm的小方块进行测试，扫描范围为400～4 000 cm-1，记录各波段光谱的透射率。
硅橡胶复合绝缘材料的主要特征吸收峰如图10所示。从图10可以看出，波数从高到低依次可以观察到硅橡胶的特征峰主要有硅醇羟基以及阻燃剂填料Al(OH)3中的O-H吸收峰（波数为3 200～3 700 cm-1）、硅橡胶侧链甲基Si-CH3中的C-H不对称吸收峰（波数为2 960 cm-1）、硅橡胶侧链甲基Si-CH3中的C-H对称吸收峰（波数为1 260 cm-1）、硅橡胶主链Si-O-Si中的Si-O键吸收峰（波数为1 005 cm-1）、交联基团Si(CH3)2中的Si-C键吸收峰（波数为787 cm-1）。在硅橡胶的分子结构中，甲基基团-CH3是憎水的，赋予硅橡胶的憎水性能，而硅橡胶中的无机填料和硅结构，尤其是硅醇羟基-OH是亲水性的，甲基的降低会造成硅橡胶的憎水性下降[21-24]。
为研究霉菌对硅橡胶绝缘材料破坏程度，将5种不同霉菌浓度样品的红外光谱与对照组进行对比，结果如图11所示。
从图11(a)可以看出，相较于对照组，随着霉菌浓度的增加，C-H吸收峰的强度明显减弱，说明样品表面侧链上的甲基数量减少，而甲基的数量与材料的憎水性密切相关。从图11(b)可以看出，随着霉菌浓度的增加，波数为2 360 cm-1的Si-H特征峰强度有所增强。从图11(c)可以看出，波数为1 260 cm-1、1 005 cm-1分别对应的C-H对称吸收峰和Si-O吸收峰与对照组相比均有所减弱，说明有机成分不论是长链含量还是交联程度方面，其强度均有所下降。从图11(d)可以看出，波数为787 cm-1的Si-C吸收峰强度明显减弱，有机基团的相对含量减少，但在波数为680 cm-1的C-H特征峰明显增强。
硅橡胶分子链的主链是静态的，与时间无关，对于相同的样品表面，甲基-CH3与硅氧键Si-O的比值反应了有机组分消失的数量，同时也反映了憎水性下降和霉菌破坏状态。对于特征吸收，通常用峰强度（峰高）来表示组分中基团的数量。表2为有机基团与无机基团的峰高比值。从表2可以看出，经过霉菌附着后样品的无机基团与有机基团含量比值高于对照组，说明与憎水性相关的甲基基团下降程度高于无机基团的下降程度，佐证了上文霉菌附着导致憎水性下降的结论。
3 讨论
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在湿润地区，霉菌染污硅橡胶复合绝缘材料的现象十分普遍，甚至在不带电的情况下也会发生霉菌附着现象。闪络电压试验表明霉菌的附着会对硅橡胶复合绝缘材料的电气性能产生负面影响，耐污闪性能大幅降低。分析认为，霉菌的生长导致硅橡胶复合绝缘材料表面产生孔径为0.5～2.5 μm的不规则孔洞，霉菌浓度的增大导致硅橡胶材料化学键发生变化。在菌丝与孢子的共同作用下，硅橡胶表面结构发生变化，致使其憎水性降低，静态接触角降低至40°左右。相较于对照组，霉菌的附着加速了硅橡胶复合绝缘材料的老化，对其绝缘性能产生了负面影响。当遇到潮湿天气时，附着霉菌的硅橡胶表面可形成连续的水膜，暴露在室外环境中，水膜会吸附无机盐离子，导致其电导率增大，电场强度分布不均匀，对硅橡胶复合绝缘材料的闪络电压产生影响，给电力系统的稳定运行造成威胁。
4 结论
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（1）霉菌生长需要温暖湿润的气候条件，在此气候条件下霉菌极易在硅橡胶绝缘子伞裙下遮光处以及芯棒附近大量繁殖。
（2）在同一霉菌浓度、不同污秽等级条件下，硅橡胶复合绝缘子串的沿面闪络电压下降率不断升高，在霉菌浓度为107 个/cm2时出现拐点，下降速度放缓。在同一霉菌浓度下，盐灰密的影响更显著，因为盐灰密可吸收水分。在排除无机污染的影响，只考虑霉菌附着的条件，闪络电压最低可降低至原始水平的76%，霉菌染污状态下硅橡胶复合绝缘子的沿面闪络电压呈下降趋势，霉菌污秽与无机污秽存在一定的差别。
（3）在霉菌染污状态下硅橡胶复合绝缘材料的憎水性能受到影响，霉菌浓度越大，对憎水性的影响越明显，最终导致材料憎水性的丧失。这表明霉菌染污会影响硅橡胶绝缘材料的绝缘特性以及憎水性，进而影响沿面闪络特性。
（4）通过扫描电镜测试可观察到硅橡胶表面形成多个孔径为0.5～2.5 μm的不规则孔洞，菌丝的生长行为使硅橡胶表面出现明显的裂缝和孔洞，导致表面结构严重劣化。通过红外光谱测试，发现硅橡胶表面有机基团相对含量减少，出现Si-O-Si主链断裂、交联网络降解等表面结构变化的现象，从微观的角度解释了硅橡胶复合绝缘材料闪络电压的降低原因。
基金
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  • 国家自然科学基金青年资助项目(52207154)
  • 中央高校基本科研业务费专项资金资助项目(2023MS104)
文献
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2023年第56卷第11期
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doi: 10.16790/j.cnki.1009-9239.im.2023.11.015
  • 接收时间：2023-01-04
  • 首发时间：2025-11-24
  • 出版时间：2023-11-20
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  • 收稿日期：2023-01-04
  • 修回日期：2023-03-03
基金
国家自然科学基金青年资助项目(52207154)
中央高校基本科研业务费专项资金资助项目(2023MS104)
作者信息
    1华北电力大学 河北省输变电设备安全防御重点实验室,河北 保定 071003
    2国网济南供电公司,山东 济南 250000
    3清华大学深圳国际研究生院,广东 深圳 518055
    4海南电网有限责任公司输电运检分公司,海南 海口 570203

通讯作者:

杨世芳（1994-），女（汉族），河北保定人，讲师，博士，主要从事高电压外绝缘生物染污问题、退役绝缘材料无害化处理等方面的研究；
刘云鹏（1976-），男（汉族），安徽六安人，教授，主要从事特高压输电技术、电气设备在线检测和外绝缘方面的研究。
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https://castjournals.cast.org.cn/joweb/jycl/CN/10.16790/j.cnki.1009-9239.im.2023.11.015
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2种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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