Article(id=1198667878116458667, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1198667875570516115, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2023.06.010, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1655913600000, receivedDateStr=2022-06-23, revisedDate=1659283200000, revisedDateStr=2022-08-01, acceptedDate=null, acceptedDateStr=null, onlineDate=1763714292315, onlineDateStr=2025-11-21, pubDate=1687190400000, pubDateStr=2023-06-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1763714292315, onlineIssueDateStr=2025-11-21, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1763714292315, creator=13701087609, updateTime=1763714292315, updator=13701087609, issue=Issue{id=1198667875570516115, tenantId=1146029695717560320, journalId=1149653034449285133, year='2023', volume='56', issue='6', pageStart='1', pageEnd='109', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1763714291707, creator=13701087609, updateTime=1766563574379, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1210618633332585027, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1198667875570516115, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1210618633332585028, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1198667875570516115, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=59, endPage=65, ext={EN=ArticleExt(id=1198667878481363129, articleId=1198667878116458667, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Reactive force field simulation of electrothermal cracking of silicone rubber under steep temperature rise, columnId=1190369198472794288, journalTitle=Insulating Materials, columnName=Insulation Technology, runingTitle=null, highlight=null, articleAbstract=

When flashover and other accidents occur on the composite insulator in operation, the temperature rises steeply. Combined with the synergistic effect of electric field, the silicone rubber used for composite insulator will crack and destroy rapidly. In this paper, molecular model of silicone rubber was established, and then the mechanism and characteristics of electrothermal cracking of silicone rubber under steep temperature rise were studied based on the reactive force field simulation, in order to compensate for some limitations of macroscopic tests. The results show that in the flashover development stage, temperature and electric field have different mechanisms of action on the cracking of silicone rubber, temperature plays a dominant role, and electric field decreases the cracking temperature and accelerates the deterioration of material. The cracking process is triggered by the breakage of Si-C bonds, with CH4, H2, C2H4, C2H2, and H2O as the main products at different stages. The number of Si-CH3 bonds decreases by about 40% with a large number of methyl groups shed from the main chain of silicone rubber. With the further destruction of the main chain structure and the formation cross-linked structure, the number ratio of Si-O-Si bond to Si-C bond and the carbon hydrogen ratio increase continuously, the maximum is 2.93 times and 1.87 times higher than that of the pre-cracking level, respectively. The diffusion of impurity gas products dominated by H2 generates voids in the material, leads to the structural reorganization, results in the insulation failure eventually.

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运行中的复合绝缘子出现闪络等事故时伴随有温度陡升现象,加之电场的协同作用,使得复合绝缘子用硅橡胶材料迅速裂解破坏。通过建立硅橡胶分子模型,基于反应力场模拟探究温度陡升下材料的电热裂解机理与特性,以期弥补宏观试验的部分局限性。结果表明:温度和电场对裂解的作用机制不同,温度占主导,电场能降低裂解温度,加速材料劣化;裂解过程由Si-C键的断裂引发,CH4、H2、C2H4、C2H2、H2O为不同裂解阶段的主要产物;随着硅橡胶主链上甲基大量脱落,Si-CH3键数量下降约40%,主链结构进一步破坏形成交联结构,Si-O-Si键与Si-C键数量比及碳氢比持续升高,最大分别为裂解前的2.93倍和1.87倍;以H2为主的杂质气体产物扩散聚集,材料内产生空隙,结构发生重组,最终导致绝缘失效。

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张建文(1968-)男(汉族),宁夏银川人,教授,主要从事高电压技术、电气设备监测与故障诊断的研究。
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王路伽(1992-),男(汉族),山东济宁人,讲师,主要从事电气设备监测与故障诊断的研究。

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王路伽(1992-),男(汉族),山东济宁人,讲师,主要从事电气设备监测与故障诊断的研究。

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王路伽(1992-),男(汉族),山东济宁人,讲师,主要从事电气设备监测与故障诊断的研究。

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电场强度/(kV/cm)主要产物
CH4H2H2OC2H4C2H2
03 9166 0448 6975 0756 241
0.13 9015 9878 3704 9796 198
0.23 8975 9198 0324 8516 154
0.33 8705 8667 6234 7836 090
0.43 8215 8037 1874 6846 016
0.53 7795 7406 8184 5925 922
), ArticleFig(id=1217470461202579507, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1198667878116458667, language=CN, label=表1, caption=

主要裂解产物数量最大时的裂解温度

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电场强度/(kV/cm)主要产物
CH4H2H2OC2H4C2H2
03 9166 0448 6975 0756 241
0.13 9015 9878 3704 9796 198
0.23 8975 9198 0324 8516 154
0.33 8705 8667 6234 7836 090
0.43 8215 8037 1874 6846 016
0.53 7795 7406 8184 5925 922
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温度陡升下硅橡胶材料电热裂解的反应力场模拟
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王路伽 1 , 马晓华 1 , 张建文 1 , 陈婷 1 , 杨世芳 2 , 杨海涛 3
绝缘材料 | 绝缘技术 2023,56(6): 59-65
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绝缘材料 | 绝缘技术 2023, 56(6): 59-65
温度陡升下硅橡胶材料电热裂解的反应力场模拟
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王路伽1, 马晓华1, 张建文1, 陈婷1, 杨世芳2, 杨海涛3
作者信息
  • 1中国矿业大学 电气工程学院,江苏 徐州 221116
  • 2华北电力大学 电力工程系, 河北 保定 071066
  • 3国网安徽省电力有限公司电力科学研究院,安徽 合肥 230601
  • 王路伽(1992-),男(汉族),山东济宁人,讲师,主要从事电气设备监测与故障诊断的研究。

通讯作者:

张建文(1968-)男(汉族),宁夏银川人,教授,主要从事高电压技术、电气设备监测与故障诊断的研究。
Reactive force field simulation of electrothermal cracking of silicone rubber under steep temperature rise
Lujia WANG1, Xiaohua MA1, Jianwen ZHANG1, Ting CHEN1, Shifang YANG2, Haitao YANG3
Affiliations
  • 1School of Electrical Engineering, China University of Mining and Technology, Xuzhou 221116, China
  • 2Department of Electrical Engineering, North China Electric Power University, Baoding 071066, China
  • 3Electric Power Research Institute of State Grid Anhui Electric Power Co., Ltd., Hefei 230601, China
出版时间: 2023-06-20 doi: 10.16790/j.cnki.1009-9239.im.2023.06.010
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运行中的复合绝缘子出现闪络等事故时伴随有温度陡升现象,加之电场的协同作用,使得复合绝缘子用硅橡胶材料迅速裂解破坏。通过建立硅橡胶分子模型,基于反应力场模拟探究温度陡升下材料的电热裂解机理与特性,以期弥补宏观试验的部分局限性。结果表明:温度和电场对裂解的作用机制不同,温度占主导,电场能降低裂解温度,加速材料劣化;裂解过程由Si-C键的断裂引发,CH4、H2、C2H4、C2H2、H2O为不同裂解阶段的主要产物;随着硅橡胶主链上甲基大量脱落,Si-CH3键数量下降约40%,主链结构进一步破坏形成交联结构,Si-O-Si键与Si-C键数量比及碳氢比持续升高,最大分别为裂解前的2.93倍和1.87倍;以H2为主的杂质气体产物扩散聚集,材料内产生空隙,结构发生重组,最终导致绝缘失效。

复合绝缘子  /  硅橡胶  /  温度陡升  /  电热裂解  /  反应力场模拟

When flashover and other accidents occur on the composite insulator in operation, the temperature rises steeply. Combined with the synergistic effect of electric field, the silicone rubber used for composite insulator will crack and destroy rapidly. In this paper, molecular model of silicone rubber was established, and then the mechanism and characteristics of electrothermal cracking of silicone rubber under steep temperature rise were studied based on the reactive force field simulation, in order to compensate for some limitations of macroscopic tests. The results show that in the flashover development stage, temperature and electric field have different mechanisms of action on the cracking of silicone rubber, temperature plays a dominant role, and electric field decreases the cracking temperature and accelerates the deterioration of material. The cracking process is triggered by the breakage of Si-C bonds, with CH4, H2, C2H4, C2H2, and H2O as the main products at different stages. The number of Si-CH3 bonds decreases by about 40% with a large number of methyl groups shed from the main chain of silicone rubber. With the further destruction of the main chain structure and the formation cross-linked structure, the number ratio of Si-O-Si bond to Si-C bond and the carbon hydrogen ratio increase continuously, the maximum is 2.93 times and 1.87 times higher than that of the pre-cracking level, respectively. The diffusion of impurity gas products dominated by H2 generates voids in the material, leads to the structural reorganization, results in the insulation failure eventually.

composite insulator  /  silicone rubber  /  steep temperature rise  /  electrothermal cracking  /  reactive force field simulation
王路伽, 马晓华, 张建文, 陈婷, 杨世芳, 杨海涛. 温度陡升下硅橡胶材料电热裂解的反应力场模拟. 绝缘材料, 2023 , 56 (6) : 59 -65 . DOI: 10.16790/j.cnki.1009-9239.im.2023.06.010
Lujia WANG, Xiaohua MA, Jianwen ZHANG, Ting CHEN, Shifang YANG, Haitao YANG. Reactive force field simulation of electrothermal cracking of silicone rubber under steep temperature rise[J]. Insulating Materials, 2023 , 56 (6) : 59 -65 . DOI: 10.16790/j.cnki.1009-9239.im.2023.06.010
复合绝缘子由于具有质量轻、憎水性强、耐污性能好等优点,已逐步取代普通的瓷、玻璃绝缘子,广泛应用于特高压输电线路中[1]。运行实践表明,复合绝缘子能有效提高系统可用率与线路可靠性,但是随运行年限增加,长期工作在高海拔、重污秽等复杂环境地区的复合绝缘子材料性能会出现不同程度下降[2],进而产生电晕、电弧放电,甚至导致闪络事故发生[3]。复合绝缘子伞裙和护套材料主体一般为有机高温硫化硅橡胶,材料的特殊性使闪络过程更加复杂。
实际运行中复合绝缘子闪络很短暂,是一个涉及电、热、化学的复杂过程[4]。闪络电弧发展阶段电弧温度迅速升高,极短时间内的温度陡升会对绝缘材料造成严重影响,加之电场的协同作用,硅橡胶材料发生裂解,使其绝缘性能迅速劣化甚至失效。在温度陡升工况下,其裂解机制和慢速热老化机制不同,因此获得温度陡升下硅橡胶材料裂解的相关信息具有重要意义。
目前国内外学者通过各种试验手段研究了硅橡胶材料的电热裂解和性能下降情况。S H KIM等[5]采用红外光谱、化学分析电子能谱研究电弧对硅橡胶化学性能的影响,发现硅橡胶表面甲基含量显著减少。S KUMAGAI等[6]采用热重分析法探究热分解后硅橡胶的固体残留物,发现了Si-C-Si键的形成。黄成才等[7]以发生闪络故障的复合绝缘子为样品进行了憎水性测试、紫外成像分析等实验,发现绝缘子憎水性大幅下降、硅橡胶伞裙被烧蚀,表面出现开裂现象。上述研究从多个角度对材料性能变化的机理做出了合理论断,但是裂解的本质是材料微观结构发生不可逆破坏,宏观测试无法追踪分析温度陡升下材料裂解的动态反应机理,也无法在微观层面解释裂解导致性能劣化的原因。
反应力场模拟作为分子模拟技术的主要方法之一,可研究宏观实验方法尚无法考察的现象,从微观角度模拟化学键的断裂与生成,揭示化学反应过程[8]。余颖辉等[9]基于此方法研究了聚碳酸酯材料在高温下的裂解过程。李庆民等[10]基于此方法研究了聚酰亚胺材料在电场下的裂解过程。LIU X等[11]对聚乙烯材料进行了高温裂解模拟,裂解产物和实验结果吻合,证明反应力场模拟方法研究温度或电场对材料劣化的作用机理是有效的。
基于上述问题与技术手段,本文构建复合绝缘子用硅橡胶材料的分子模型,通过反应力场模拟方法对温度陡升下硅橡胶材料的裂解过程与特性进行研究,尝试从微观角度解释硅橡胶性能劣化导致绝缘失效的机理,以期弥补宏观实验条件的局限性,为硅橡胶复合绝缘子的电热稳定性提升及配方优化提供理论依据。
闪络过程中局部电弧的发展阶段较关键,该阶段中复合绝缘子受到的破坏最严重,硅橡胶材料的绝缘性能在持续的电热作用下会迅速劣化。发展中的电弧逐渐沿绝缘子护套和伞裙延伸,弧柱区不断伸长,电弧温度出现陡升,普遍在4 000 K以上,最高超过10 000 K[12]
运行中的复合绝缘子表面电场整体呈U形分布,硅橡胶材料所处位置为绝缘子中间段,电场分布较均匀,且显著低于绝缘子高压端、低压接地端,电场强度在0.5 kV/cm左右[13]。在电弧发展阶段,泄漏电流增大,电弧场强出现衰减,大部分电弧覆盖区域电场强度小于0.5 kV/cm[14],此时维持电弧发展的是强烈的热电离作用。
在传统的分子力场下,各原子间的连接是固定的,无法处理其化学反应过程。A C T VAN DUIN等[15]提出了REAXFF反应力场模拟方法,通过计算任意两个原子间的键级确定当前时刻的两者连接性,从而表征化学反应中化学键的断裂与生成。
反应力场模拟以量子化学、统计力学为基础,借助计算机强大的计算能力,实现短时间内对大量不同状态体系的计算,这些大量不同状态体系的组合称为系综。通过系综平均代替一个体系足够长的时间平均,实现各态历经,从而能基于很小的时空尺度表征宏观性能。
反应力场将键级B定义为原子间距离rij的函数,并基于化学键中的单键Bσ、双键Bπ、三键Bππ将键级定义为三部分的贡献,如式(1)所示。
B=BOσ+BOπ+BOππBOσ=exppbo1rijrσpbo2BOπ=exppbo3rijrπpbo4BOππ=exppbo5rijrππpbo6
式(1)中:rij为两原子间的距离;rσrπrππ为原子参数;pbo1pbo6为键参数。反应力场根据过配位情况进行矫正。
在键级定义的基础上,反应力场将原子间的相互作用能量定义为键级的函数。反应体系的能量可用式(2)表达。
Esystem=Ebond+Eover+Eunder            +Eval+Epen+Etors            +Econj+EvdWaals+ECoulomb
式(2)中:Esystem为原子间的相互作用能量;Ebond为键能;EoverEunder为通过配位的能量矫正项;Eval为键角的价角能量项;Epen为惩罚能量项;Etors为扭转能量项;Econj为分子共轭作用项;EvdWaals为非键范德华力作用;ECoulomb为非键库仑力作用。
在反应力场模拟中,随着反应进行,任意两原子间距离发生改变,键级函数随之改变,当前能量随着键级发生变化。基于运动学定律可通过当前能量确定下一时刻原子间距离,重新计算键级,判断化学键的形成和断裂情况,进而模拟整个化学反应的过程。
复合绝缘子用硅橡胶主要由甲基乙烯基硅氧烷生胶交联硫化而成,其分子量一般为40万~80万[16]。对比不同聚合度模型的仿真结果,发现聚合度对硅橡胶裂解机理的研究基本无影响。综合考虑计算时间与精度,同时保证模型的交联强度,本研究构建了4条乙烯基封端的甲基乙烯基硅氧烷分子链,聚合度为44,乙烯基含量为1.536%,每条链包含479个原子。参照电力系统复合绝缘子用硅橡胶配方[17],选用双25DBPMH作为硫化剂,按照每100质量份硅橡胶用2质量份硫化剂的配比将4条甲基乙烯基硅氧烷分子链充分交联,确定交联温度为443 K,交联力场选择COMPASS II,交联后的模型如图1所示。
为保证模型结构的稳定性,使模型更接近实际构象,本研究在模拟开始前对硅橡胶模型结构进行了优化。首先利用共轭梯度法对模型进行能量最小化计算,得到能量较低的分子模型。随后在NPT等温等压系综下优化模型密度,使得模型分子排布更接近实际构型;在NVT正则系综下进一步降低体系能量,使结构更稳定。优化后的模型总能量大幅下降且趋于平衡,处于较为稳定的状态。
对于优化后的模型,本文选用LAMMPS软件,基于NVT系综进行反应力场模拟。对硅橡胶分子模型进行从ps级到ns级不同时长的模拟计算,发现在60 ps时裂解产物数量变化幅度在5%以内,电热裂解基本趋于稳定,故模拟时长确定为60 ps。
为保证电热裂解反应的精确性,反应体系单位统一为real,原子类型设置为charge,结合量子化学计算结果,选用的反应力场为CHONSSi.ff。在计算过程中,根据温度陡升实际工况设置升温区间为300~10 000 K,考虑到电场的影响,沿x轴施加0.5 kV/cm的电场。反应体系选用Nose-Hoover法进行温度与压力控制,选用高斯分布算法设置体系初始速度,采用EEM法计算体系电荷分布。为保证计算精度,反应步长设为0.1 fs,每隔100步输出当前体系的反应状态。
根据裂解产物片段含碳原子数不同,将裂解产物片段分为C0产物、C1~3产物、C4~6产物、C7~9产物与C10+产物。不同含碳数产物片段随裂解时间的变化如图2所示。从图2可以看出,裂解产物片段含碳原子数主要集中在0~3,随着裂解反应进行,C1~3产物数量先增加后减少,其余含碳数的产物片段数量先增加后基本稳定不变。
进一步分析裂解反应主要产物分布随模拟时间的变化如图3所示。从图3可以看出,裂解产物主要有甲烷CH4、氢气H2、水H2O、乙烯C2H4、乙炔C2H2,产物类型与文献[18]在甲基乙烯基硅氧烷裂解实验中测得的结果相符。硅橡胶材料电热裂解反应前期主要的产物为CH4,分子数量最高超过60。随着反应的进行,CH4分子数量大幅下降,H2、C2H4、C2H2等产物分子数量逐步增加,H2分子数量多达200,C2H4、C2H2分子数量也达到15以上。在反应中后期,随着裂解温度继续升高,上述产物发生进一步反应,分子数量出现不同程度的下降,H2分子数量稳定在120左右,CH4、C2H4、C2H2分子数量均低于5,H2O分子数量呈现上升趋势,稳定在30以上。
图4为裂解反应过程中观察到的主要产物生成情况,本文基于原子示踪法标记主要产物,追踪其生成路径及反应路径,结合硅橡胶分子模型的主链结构变化情况进一步研究硅橡胶材料的电热裂解机理。
模拟反应开始前,Si、O原子交替有序排列,除交联链节与连接乙烯基的Si原子外,每个Si原子上连接两个甲基。模拟最初,在温度和电场力的作用下,体系中原子开始剧烈运动,硅橡胶主链结构出现螺旋化缩卷扭曲,此时化学键尚未断裂。随着模拟反应逐渐进行,硅橡胶主链上的Si-C键首先发生断裂,主链上Si原子连接的甲基(-CH3)大量脱落,硅橡胶裂解过程开始。在同一阶段,Si原子所连接的甲基以及脱落甲基上的C-H键也发生断裂,形成氢自由基(H·),氢自由基与甲基结合形成CH4,为裂解反应前期主要产物。
硅橡胶主链结构中各原子归一化数量占比随反应时间变化如图5所示。从图5可以观察到,反应前期主链中C、H原子数占比下降,Si、O原子数占比上升,与裂解过程相符。YUAN X等[19]通过红外光谱分析法研究发现放电试验后复合绝缘子硅橡胶材料主链Si-O-Si、侧链Si-C及侧链甲基中C-H的吸收峰均有明显减弱,也印证了本文电热裂解模拟的可靠性。
随着反应进行,CH4发生分解,形成甲基、亚甲基(-CH2-)、次甲基(-CH)、氢自由基等,基团之间相互结合,发生自由基反应,形成各种小分子烷烃、烯烃、炔烃或C2H5自由基、C2H3自由基等基团,其中H2、C2H4、C2H2为该阶段主要产物,H2分子数量最多。
随着反应温度进一步升高,体系内原子、分子运动加剧,H2等小分子扩散距离增大。C2H4、C2H2等产物不稳定,发生裂解脱氢,H2分子也逐渐发生分解,数量下降。一方面产物类型越来越多,另一方面生成的自由基团运动更加剧烈,会撞击硅橡胶主链,主链上的Si-O-Si键发生断裂,体系中Si原子与O原子数量增加,与碳氢自由基反应结合形成各类小分子硅氧烷、醛类、醇类等产物,醛基(-CHO)、羟基(-OH)等结构开始被观察到。在反应中后期,羟基、氢自由基的数量逐渐增多,结合形成H2O分子。H2O分子数量不断增加,成为反应中后期的主要产物。
随着裂解反应的不断进行,体系内产物分子数量和产物类型均不断升高,最终趋于稳定。硅橡胶主链结构也发生变化。图5显示反应中后期主链结构中C原子数占比增加,模拟反应结束时,体系中出现了(-Si-C-Si-)、(-Si-C-O-)等结构,使得硅橡胶主链间形成各种立体网状交联结构,交联密度上升,硅橡胶体系交联度增加。
为进一步研究温度对硅橡胶材料裂解的影响,分别进行了温度为4 000、5 000、6 000、7 000、8 000、9 000、10 000 K的反应力场模拟。
对各温度下生成物随裂解反应时间分布的情况进行数据统计,主要产物CH4、H2的曲线分别如图6图7所示。从图67可以看出,随着温度的提升,CH4、H2等主要产物的产生速率明显提高,CH4开始分解的时间提前,反应达到平衡的时间缩短,但不同温度下裂解达到平衡后主要产物的数量不同,随着温度的提升而减少。
图8展示了不同温度下裂解产物类型随时间的变化情况。从图8可以看出,随着温度的提升,裂解反应更加剧烈,生成的产物类型数更多,产物生成速率增加,裂解反应更快趋于平衡。
对比不同温度下主要产物生成数量分析可得,温度的提升使得体系内分子、自由基团化学键的断裂与生成速率增加,主要分子产物进一步发生分解,导致数量减少。分解形成各样的裂解片段之间相互反应,故体系中裂解片段的总数和类型数增加。此外,各种裂解片段不规则的热运动更加剧烈,对于硅橡胶主链的撞击频率增加,硅橡胶主链结构裂解破坏更加严重,体系交联链节增多,交联度进一步上升。
为探究电场对硅橡胶材料裂解的影响,分别进行了不同电场强度时300~10 000 K及300 K恒温下电热协同的反应力场模拟,电场强度取0~0.5 kV/cm,间隔为0.1 kV/cm,不同电场强度下硅橡胶材料裂解的主要产物在达到最大数量时的裂解温度如表1所示。从表1可以看出,施加电场后裂解温度均出现了不同程度下降,随着电场强度增大,裂解温度下降更多。其中H2O的裂解温度下降幅度最大,当电场强度为0.5 kV/cm时,裂解温度降低了1 879 K。通过EEM法对裂解过程中硅橡胶模型的电荷分布计算发现,Si、H原子电荷量为正,O、C原子电荷量为负,模型中Si-C、Si-O、C-H键呈极性,存在电偶极矩。
分析认为,在电场作用下,正、负电荷中心会沿电场方向定向偏移,使电偶极矩增大,硅橡胶主链上的极性键更容易发生扭动断裂。由于Si-O键极性最强,受电场影响更大,加入电场后硅橡胶主链上的O原子更易析出,进一步生成H2O分子。因此在硅橡胶材料电热裂解过程中,电场能够降低材料的裂解温度,更易形成各种裂解产物,其中对H2O分子影响最大。
不同电场强度下300 K恒温的电热协同的反应力场模拟结果显示硅橡胶分子模型并未发生裂解,没有裂解产物形成。结合上述研究分析可知,电场加速了硅橡胶材料的劣化,但硅橡胶本身电气强度较高,实际工况下的场强不足以使硅橡胶结构中的化学键扭动断裂。温度在电热裂解过程中起主导作用。
硅橡胶主链两侧大量甲基朝外排布可有效屏蔽Si-O键的强极性作用,甲基上的H原子与水中的H原子相互排斥,使水分子难以接近。独特的结构使硅橡胶材料显现出良好的憎水性。模拟结果发现,硅橡胶主链上Si-C键的断裂开启了电热裂解过程,大量甲基基团脱落,进一步反应形成各种裂解产物片段,硅橡胶主链的硅氧键失去了甲基基团的屏蔽作用,整体极性增强,憎水性大幅下降。后续自由基反应中进一步产生羟基等亲水性基团,硅橡胶材料憎水性破坏严重。
追踪模拟反应前期主链Si-CH3键数量变化可有效表征憎水性下降情况。宏观试验中常用静态接触角来表征材料的憎水性。高华[20]搭建了闪络电弧烧蚀试验平台,根据电弧能量变化将硅橡胶损伤过程分为初始、损坏和失效3个阶段。电弧温度随电弧能量增大而迅速升高。通过研究静态接触角随作用时间的变化来分析闪络电弧对复合绝缘子憎水性的影响。本文将微观模拟与宏观试验进行了对比,考虑到两个体系的表征量与时间尺度不同,对实验数据进行了归一化处理。憎水性归一化处理结果设定为N,Si-CH3键数量及静态接触角度的初始值为n0,试验过程中测量的变化值记录为n,按照式(3)进行归一化处理。
N=nn0
结果对比如图9所示。图9中横坐标为作用时间的相对值,1、2、3分别对应硅橡胶损伤过程的初始、损坏、失效3个阶段,纵坐标为Si-CH3键数量及静态接触角随作用时间变化的归一化处理结果N
根据图9分析发现,在闪络电弧发展前期,电弧温度较低,对于硅橡胶材料的破坏有限,硅橡胶材料仍具有良好的憎水性,随着闪络电弧不断发展,电弧温度陡升,硅橡胶材料的憎水性开始出现大幅下降,且速率不断增加,最终造成失效。微观电热裂解反应模拟结果与宏观闪络试验结果基本符合,下降幅度约40%。
S ITO等[21]研究表明在硅橡胶材料劣化的早期阶段Si-O-Si与Si-C的数量比与材料的压头模量呈正相关,与断裂伸长率呈负相关,压头模量越大、断裂伸长率越小,材料的硬度越大。因此可用Si-O-Si键与Si-C键数量比来表征材料的硬度变化。对硅橡胶分子模型电热裂解前30 ps内Si-O-Si键与Si-C键的数量比变化如图10所示。从图10可以看出,硅橡胶材料开始裂解后硬度不断提升,最大硬度为裂解前的2.93倍。
在裂解反应中后期,含碳裂解产物片段会撞击硅橡胶主链结构,硅氧分子链断裂,断裂后的自由基相互反应结合,在不同位置产生各种立体网状交联结构。图11为裂解过程中主链碳氢比随时间的变化。从图11可以看出,随着反应进行,碳氢比持续升高,最大为裂解前的1.87倍。说明各种含碳自由基随机与主链硅原子进行交联反应,硅橡胶体系交联度增加,进而在宏观上表征为材料变硬、变脆,这也与文献[22]中报道的复合绝缘子伞裙硬度与交联度呈显著正相关相吻合。
在电热裂解模拟反应中会产生各种杂质气体小分子,这些气体分子在硅橡胶材料内部扩散聚集,逐渐产生空隙。H2是硅橡胶电热裂解数量最多的产物,且H2相对分子质量小,温度和电场的协同作用使H2获得很大的加速度,扩散范围更大,对硅橡胶材料造成的影响更严重。追踪电热裂解反应过程中一个H2分子产物的空间位移轨迹如图12所示。经测量可得,H2分子最远扩散的距离已达到硅橡胶分子模型边界长度的5倍以上。在各种杂质气体产物活动范围重叠最多的位置处气体分子出现的概率最高,气体分子逐渐扩散聚集,产生空隙,硅橡胶材料内部压强也急剧升高。同时此处的绝缘性能下降最明显,更易发生击穿,导致硅橡胶伞裙表面出现各种裂纹和孔洞。
(1)硅橡胶裂解始于其主链上的Si-C键断裂。裂解产物片段和类型数随时间不断增加,并逐渐趋于稳定。产物片段撞击硅橡胶主链,硅氧键发生断裂,主链结构不断发生破坏、重组,最终硅橡胶主链间形成各种立体网状交联结构,体系交联度增加。
(2)基于原子示踪法可追踪主要产物生成路径,CH4为裂解前期主要产物,源于硅橡胶主链上大量甲基脱落,与氢自由基结合而成。随着反应进行,CH4数量减少,引发自由基反应,H2、C2H4、C2H2为该阶段主要产物,H2数量最多。主链硅氧键发生断裂,氧原子与碳氢自由基反应,出现羟基结构,与氢自由基结合形成H2O,为反应后期主要产物。
(3)在硅橡胶分子电热裂解过程中,温度和电场作用机制不同。电场能降低材料裂解温度,加速材料劣化。但实际工况下的场强不足以使化学键扭动断裂,温度在电热裂解中占主导作用。
(4)硅橡胶发生裂解后主链大量甲基脱落,Si-CH3键数量下降约40%;裂解过程中主链不同位置产生交联结构,Si-O-Si键与Si-C键数量比、碳氢比持续升高,最大分别为裂解前的2.93倍和1.87倍;以H2为主的杂质气体产物扩散聚集,材料内部产生空隙,内部压强增大。微观结构的变化表现为宏观性能的劣化,最终导致绝缘失效。
  • 国家自然科学基金资助项目(52207180)
  • 国家自然科学基金资助项目(52207154)
  • 广东省基础与应用基础研究基金资助项目(2021A1515110435)
  • 中央高校基本科研业务费专项资金项目(2021MS104)
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2023年第56卷第6期
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doi: 10.16790/j.cnki.1009-9239.im.2023.06.010
  • 接收时间:2022-06-23
  • 首发时间:2025-11-21
  • 出版时间:2023-06-20
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  • 收稿日期:2022-06-23
  • 修回日期:2022-08-01
基金
国家自然科学基金资助项目(52207180)
国家自然科学基金资助项目(52207154)
广东省基础与应用基础研究基金资助项目(2021A1515110435)
中央高校基本科研业务费专项资金项目(2021MS104)
作者信息
    1中国矿业大学 电气工程学院,江苏 徐州 221116
    2华北电力大学 电力工程系, 河北 保定 071066
    3国网安徽省电力有限公司电力科学研究院,安徽 合肥 230601

通讯作者:

张建文(1968-)男(汉族),宁夏银川人,教授,主要从事高电压技术、电气设备监测与故障诊断的研究。
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2种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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