Article(id=1190367731569492733, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1190365079976640655, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2025.07.007, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1735574400000, receivedDateStr=2024-12-31, revisedDate=1740067200000, revisedDateStr=2025-02-21, acceptedDate=null, acceptedDateStr=null, onlineDate=1761735383168, onlineDateStr=2025-10-29, pubDate=1752940800000, pubDateStr=2025-07-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1761735383168, onlineIssueDateStr=2025-10-29, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1761735383168, creator=13701087609, updateTime=1761735383168, updator=13701087609, issue=Issue{id=1190365079976640655, tenantId=1146029695717560320, journalId=1149653034449285133, year='2025', volume='58', issue='7', pageStart='1', pageEnd='150', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=1, specialIssue=null, createTime=1761734750980, creator=13701087609, updateTime=1761735924323, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1190370001430348320, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1190365079976640655, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1190370001430348321, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1190365079976640655, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=64, endPage=72, ext={EN=ArticleExt(id=1190367731829539583, articleId=1190367731569492733, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Study on influence of conductive carbon black dispersion on interfacial characteristics of shielding layer-insulation layer for high voltage cable, columnId=1190365080723226768, journalTitle=Insulating Materials, columnName=Special Issue on Electrical Equipment Interface Insulation, runingTitle=null, highlight=

The interfacial characteristic between the shielding layer and insulation layer is a key factor determining the service life and operational reliability of the high-voltage cables. This study focused on the regulation of the dispersion of conductive carbon black (CB), and investigated the impact of interfacial characteristics between the shielding layer and cross-linked polyethylene (XLPE) insulation layer. The semi-conductive shielding materials with two different formulations were prepared, and an imported semi-conductive shielding material was selected as a comparison sample, then the mechanical, thermal, and electrical compatibility between the shielding materials and insulation layer were comprehensively evaluated. The results show that the introduction of polymer dispersant polyvinylpyrrolidone (PVP) into the matrix resin significantly improves the dispersibility of CB. The mechanical compatibility between the shielding layer and insulation layer is predominantly influenced by crosslinking, and an optimal crosslinking compatibility can enhance the interfacial adhesion and prevent delamination. The PVP-modified shielding layers exhibit better thermal compatibility with the insulation layer in terms of the coefficient of thermal expansion, and show superior thermal conductivity compared to the imported shielding material. Furthermore, the improved CB dispersion optimizes electrical compatibility between shielding layer and insulation layer, elevating the AC electrical strength at the shield-insulation interface.

, articleAbstract=

The interfacial characteristic between the shielding layer and insulation layer is a key factor determining the service life and operational reliability of the high-voltage cables. This study focused on the regulation of the dispersion of conductive carbon black (CB), and investigated the impact of interfacial characteristics between the shielding layer and cross-linked polyethylene (XLPE) insulation layer. The semi-conductive shielding materials with two different formulations were prepared, and an imported semi-conductive shielding material was selected as a comparison sample, then the mechanical, thermal, and electrical compatibility between the shielding materials and insulation layer were comprehensively evaluated. The results show that the introduction of polymer dispersant polyvinylpyrrolidone (PVP) into the matrix resin significantly improves the dispersibility of CB. The mechanical compatibility between the shielding layer and insulation layer is predominantly influenced by crosslinking, and an optimal crosslinking compatibility can enhance the interfacial adhesion and prevent delamination. The PVP-modified shielding layers exhibit better thermal compatibility with the insulation layer in terms of the coefficient of thermal expansion, and show superior thermal conductivity compared to the imported shielding material. Furthermore, the improved CB dispersion optimizes electrical compatibility between shielding layer and insulation layer, elevating the AC electrical strength at the shield-insulation interface.

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高压电缆屏蔽层与绝缘层之间的界面特性是决定电缆服役寿命和运行可靠性的关键因素。本文从调控导电炭黑(CB)分散性角度出发,开展高压电缆屏蔽层与交联聚乙烯(XLPE)绝缘层的界面特性影响研究。制备了两种配方体系的半导电屏蔽料,并选取进口半导电屏蔽料作为对比样,综合评估了屏蔽层与绝缘层的力学、热学和电学匹配性。结果表明:在基体树脂中引入高分子分散剂聚乙烯吡咯烷酮(PVP)能够显著改善CB的分散性。屏蔽层与绝缘层的力学匹配性主要受到交联的影响,良好的交联匹配性能够提高界面的结合力,避免剥离现象。PVP改性后的屏蔽层在热膨胀系数方面与绝缘层具有更佳的热学匹配性,导热性能也优于进口屏蔽料。同时,CB分散性的改善优化了屏蔽层与绝缘层的电学匹配性,提升了屏蔽-绝缘界面的交流电气强度。

, articleAbstract=

高压电缆屏蔽层与绝缘层之间的界面特性是决定电缆服役寿命和运行可靠性的关键因素。本文从调控导电炭黑(CB)分散性角度出发,开展高压电缆屏蔽层与交联聚乙烯(XLPE)绝缘层的界面特性影响研究。制备了两种配方体系的半导电屏蔽料,并选取进口半导电屏蔽料作为对比样,综合评估了屏蔽层与绝缘层的力学、热学和电学匹配性。结果表明:在基体树脂中引入高分子分散剂聚乙烯吡咯烷酮(PVP)能够显著改善CB的分散性。屏蔽层与绝缘层的力学匹配性主要受到交联的影响,良好的交联匹配性能够提高界面的结合力,避免剥离现象。PVP改性后的屏蔽层在热膨胀系数方面与绝缘层具有更佳的热学匹配性,导热性能也优于进口屏蔽料。同时,CB分散性的改善优化了屏蔽层与绝缘层的电学匹配性,提升了屏蔽-绝缘界面的交流电气强度。

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何文(1975-),男(汉族),广东梅州人,高级工程师,主要从事输电电缆的研究。

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何文(1975-),男(汉族),广东梅州人,高级工程师,主要从事输电电缆的研究。

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何文(1975-),男(汉族),广东梅州人,高级工程师,主要从事输电电缆的研究。

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(a) XLPE击穿 (b) 3#-XLPE击穿

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编号 屏蔽层 绝缘层
1#-XLPE LE0592S XLPE
2#-XLPE CB/EBA XLPE
3#-XLPE PVP@CB/EBA XLPE
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屏蔽-绝缘复合试样组成

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编号 屏蔽层 绝缘层
1#-XLPE LE0592S XLPE
2#-XLPE CB/EBA XLPE
3#-XLPE PVP@CB/EBA XLPE
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参数 XLPE 1#-XLPE 2#-XLPE 3#-XLPE
电气强度/(kV/mm) 60.6 50.9 46.9 49.1
形状参数β 23.6 15.9 24.9 26.8
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试样的交流击穿数据

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参数 XLPE 1#-XLPE 2#-XLPE 3#-XLPE
电气强度/(kV/mm) 60.6 50.9 46.9 49.1
形状参数β 23.6 15.9 24.9 26.8
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导电炭黑分散性对高压电缆屏蔽层-绝缘层界面特性影响研究
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何文 1 , 侯帅 2 , 展云鹏 2 , 黎灼佳 1 , 黄罡 1 , 傅明利 2
绝缘材料 | 电气设备界面绝缘专题 2025,58(7): 64-72
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绝缘材料 | 电气设备界面绝缘专题 2025, 58(7): 64-72
导电炭黑分散性对高压电缆屏蔽层-绝缘层界面特性影响研究
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何文1, 侯帅2, 展云鹏2, 黎灼佳1, 黄罡1, 傅明利2
作者信息
  • 1.广东电网有限责任公司东莞供电局,广东 东莞 523120
  • 2.南方电网科学研究院有限责任公司,广东 广州 510663
  • 何文(1975-),男(汉族),广东梅州人,高级工程师,主要从事输电电缆的研究。

Study on influence of conductive carbon black dispersion on interfacial characteristics of shielding layer-insulation layer for high voltage cable
Wen HE1, Shuai HOU2, Yunpeng ZHAN2, Zhuojia LI1, Gang HUANG1, Mingli FU2
Affiliations
  • 1. Dongguan Power Supply Bureau, Guangdong Power Grid, Dongguan 523120, China
  • 2. Electric Power Research Institute of China Southern Power Grid, Guangzhou 510663, China
出版时间: 2025-07-20 doi: 10.16790/j.cnki.1009-9239.im.2025.07.007
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高压电缆屏蔽层与绝缘层之间的界面特性是决定电缆服役寿命和运行可靠性的关键因素。本文从调控导电炭黑(CB)分散性角度出发,开展高压电缆屏蔽层与交联聚乙烯(XLPE)绝缘层的界面特性影响研究。制备了两种配方体系的半导电屏蔽料,并选取进口半导电屏蔽料作为对比样,综合评估了屏蔽层与绝缘层的力学、热学和电学匹配性。结果表明:在基体树脂中引入高分子分散剂聚乙烯吡咯烷酮(PVP)能够显著改善CB的分散性。屏蔽层与绝缘层的力学匹配性主要受到交联的影响,良好的交联匹配性能够提高界面的结合力,避免剥离现象。PVP改性后的屏蔽层在热膨胀系数方面与绝缘层具有更佳的热学匹配性,导热性能也优于进口屏蔽料。同时,CB分散性的改善优化了屏蔽层与绝缘层的电学匹配性,提升了屏蔽-绝缘界面的交流电气强度。

高压电缆  /  半导电屏蔽料  /  界面匹配  /  导电炭黑  /  分散改性

The interfacial characteristic between the shielding layer and insulation layer is a key factor determining the service life and operational reliability of the high-voltage cables. This study focused on the regulation of the dispersion of conductive carbon black (CB), and investigated the impact of interfacial characteristics between the shielding layer and cross-linked polyethylene (XLPE) insulation layer. The semi-conductive shielding materials with two different formulations were prepared, and an imported semi-conductive shielding material was selected as a comparison sample, then the mechanical, thermal, and electrical compatibility between the shielding materials and insulation layer were comprehensively evaluated. The results show that the introduction of polymer dispersant polyvinylpyrrolidone (PVP) into the matrix resin significantly improves the dispersibility of CB. The mechanical compatibility between the shielding layer and insulation layer is predominantly influenced by crosslinking, and an optimal crosslinking compatibility can enhance the interfacial adhesion and prevent delamination. The PVP-modified shielding layers exhibit better thermal compatibility with the insulation layer in terms of the coefficient of thermal expansion, and show superior thermal conductivity compared to the imported shielding material. Furthermore, the improved CB dispersion optimizes electrical compatibility between shielding layer and insulation layer, elevating the AC electrical strength at the shield-insulation interface.

high-voltage cable  /  semi-conductive shielding material  /  interface compatibility  /  conductive carbon black  /  dispersibility modification
何文, 侯帅, 展云鹏, 黎灼佳, 黄罡, 傅明利. 导电炭黑分散性对高压电缆屏蔽层-绝缘层界面特性影响研究. 绝缘材料, 2025 , 58 (7) : 64 -72 . DOI: 10.16790/j.cnki.1009-9239.im.2025.07.007
Wen HE, Shuai HOU, Yunpeng ZHAN, Zhuojia LI, Gang HUANG, Mingli FU. Study on influence of conductive carbon black dispersion on interfacial characteristics of shielding layer-insulation layer for high voltage cable[J]. Insulating Materials, 2025 , 58 (7) : 64 -72 . DOI: 10.16790/j.cnki.1009-9239.im.2025.07.007
近年来,随着我国城市化进程和工业化步伐的加快,城市用电负荷急剧增加,高压电缆凭借其远距离传输、大容量和低损耗等优势,需求量日益攀升[1-3]。在高压电缆的设计与制造过程中,屏蔽层与绝缘层之间的界面特性是决定电缆绝缘水平和使用寿命的关键因素之一[4-5]。优异的屏蔽层-绝缘层界面匹配性不仅有利于均化界面电场分布,而且能够减少空间电荷注入以及提高绝缘层的击穿电压[6]
已有研究表明,屏蔽层-绝缘层结构是决定界面特性的重要因素。G C MONTANARI等[7]通过3种不同的绝缘层-屏蔽层试样组合方式,研究了空间电荷分布的变化规律,结果表明优化的屏蔽层-绝缘层界面能够有效减少绝缘层内空间电荷的积聚。此外,研究人员通过调节屏蔽料的组分,例如调控导电填料的种类和含量,或者通过无机粒子改性等方式,提升了屏蔽-绝缘层界面的匹配特性[8-9]。高凯等[10]对比了超导炭黑与普通炭黑制备的屏蔽层对绝缘层空间电荷的影响,结果表明超导炭黑因其粒径小、结构度高等特征能够显著减少空间电荷的注入量。WANG T等[11]通过仿真模拟探究了绝缘层-屏蔽层接触界面形态对电场畸变的影响,发现通过调节炭黑粒径及其渗透深度能够有效抑制电场畸变。此外,为了减少绝缘层内空间电荷积累,研究人员还尝试在屏蔽层中掺杂具有陷阱效应的无机粒子,以捕获迁移过程中的电子或空穴,从而减少杂质并降低空间电荷的注入概率[12-14]。ZHANG C等[15]和WEI Y等[16]采用磁性粒子锶铁氧体对屏蔽层进行改性,利用电磁场中的洛伦兹力改变电荷的输运路径,发现适量的锶铁氧体能显著减少绝缘层中的电荷注入。
在屏蔽料体系中,导电炭黑(CB)的分散性至关重要,分散性不佳容易引发表面凸起等微观缺陷,使得屏蔽层-绝缘界面出现介观电场分布集中现象,引起电荷发射增多,进而导致绝缘破坏。张瑞[17]研究了相同CB含量下4种不同聚丙烯(PP)基体对屏蔽层-绝缘层复合试样空间电荷、直流电导与直流击穿特性的影响,发现基体类型直接影响CB的分散性,优异的CB分散性对改善绝缘层-屏蔽界面电性能存在积极作用。然而,在交联聚乙烯(XLPE)绝缘电缆中,CB分散性对屏蔽-绝缘层界面匹配性的影响规律还尚未建立。
尽管研究人员在优化屏蔽层-绝缘层界面特性方面已取得显著进展,但当前研究主要关注屏蔽层对绝缘层空间电荷注入等电性能的影响规律,对于屏蔽层-绝缘层界面的物理机械匹配性能缺乏系统性评价[18-20]。首先,屏蔽层与绝缘层应具备良好的力学匹配性,以确保二者界面紧密结合;其次,屏蔽层与绝缘层匹配的热膨胀性能和优异的导热性能是避免电缆运行过程中二者分离和热量积聚的重要因素;此外,屏蔽层的电学性能直接影响绝缘层内部的电场分布和空间电荷积累,从而影响电缆的电气性能和安全性[21-22]。因此,优化屏蔽层中CB的分散性,研究高压电缆屏蔽层与绝缘层力学、热学和电学特性的匹配性,已成为提升电缆运行可靠性的重要研究方向。
为了探究高压电缆屏蔽屏-绝缘层的界面特性,本文选取进口半导电屏蔽料及两种不同配方的国产半导电屏蔽料作为屏蔽层原料,低密度聚乙烯(LDPE)基料作为绝缘层原料,系统评价屏蔽层与绝缘层的力学、热学和电学匹配性,重点探讨使用高分子分散剂聚乙烯吡咯烷酮(PVP)调控CB分散性及其对界面匹配特性的影响规律。希望研究结果能为提升电缆的整体性能与使用寿命,保障电力系统的安全可靠运行提供技术支撑。
进口半导电屏蔽料购自北欧化工公司,牌号为LE0592S;乙烯-丙烯酸丁酯共聚物(EBA)购自雷普索尔公司;导电炭黑(CB)购自卡博特公司。低密度聚乙烯(LDPE)购自中国石化扬子石油化工有限公司;分散剂聚乙烯吡咯烷酮(PVP)购自上海阿拉丁生化科技股份有限公司。其余加工助剂为润滑剂、抗氧剂和交联剂,均购自成都科龙化工试剂有限公司。
将基体树脂EBA、导电填料CB以及加工助剂在80℃下干燥24 h。将CB与分散剂、润滑剂、抗氧剂充分搅拌,然后加入设定配比的基体树脂EBA继续混合均匀。将均匀混合后的物料加入双螺杆挤出机中熔融共混,物料经过挤出后进入冷却水槽,经水下拉条后送入切粒机切粒,最后在80℃下烘干12 h制得半成品屏蔽料颗粒。根据是否添加PVP分散剂分别得到CB/EBA和PVP@CB/EBA两种配方体系的屏蔽料试样。
交联剂吸收工艺:将半成品屏蔽料颗粒置于60℃烘箱中恒温3 h后,加入定量的交联剂,在60℃下混合10 min,最后放回烘箱保温6 h,得到成品屏蔽料粒料。
将LDPE绝缘料按照屏蔽料相同的交联剂吸收工艺制备成品XLPE绝缘料粒料。如图1所示,屏蔽层-绝缘层复合试样采用模压-层压工艺制备得到。首先,将屏蔽料和绝缘料分别放入Labtech平板硫化机(LP-S-50型,威讯科技(集团)有限公司)内,在120℃、15 MPa下压制20 min,通过模压成型得到屏蔽层与绝缘层。然后,将屏蔽层和绝缘层复合后在180℃、15 MPa下压制20 min,完成层压工艺,冷却脱模后得到屏蔽层-绝缘层复合试样,采用不同屏蔽料制得的复合试样编号如表1所示,对应的屏蔽料试样命名为1#、2#、3#
将待测试样放入液氮中浸泡30 min并进行脆断处理以保持断面形态,采用场发射扫描电子显微镜(Nova NanoSEM450型,FEI公司)观察断面形貌。
采用电子万能拉伸试验机(Model 5576型, Instron公司)根据JB/T 10738—2007测试剥离强度,将屏蔽层-绝缘层复合试样裁剪成宽度为2 cm、工作段长度为10 cm的长条试样。测试时用夹具分别夹紧绝缘层和屏蔽层端并以50 mm/min的拉伸速率向两侧拉伸,每组试样重复测试5次。
根据GB/T 2951.21—2008测试材料的热延伸性能。测试前将试样裁剪成哑铃型,并在试样上标记1 cm长度,将试样悬挂在支架上,下夹头加重物至负重值为0.2 MPa。然后将试样在150℃烘箱中放置15 min,记录标记线间距离,计算得到负载下的伸长率。之后解除试样负荷,将试样置于150℃温度环境中恢复5 min,自然冷却至室温后,计算冷却后的永久伸长率。
采用激光导热仪(LFA-467型,NETZSCH公司)测试导热系数,测试前在圆片两面均匀喷涂石墨,圆片直径为2.5 cm、厚度为1 mm,待石墨干燥后进行测试。测试时选取25、50、75、90℃这4个温度点,各温度点均测试3次并取其平均值作为热扩散系数,并计算得到导热系数。
使用热机械分析仪(Q400EM型,TA公司)对材料的相对形变率和热膨胀系数进行测试,测试前将试样裁剪成直径为4 mm、高度为4 mm的圆柱型试样。采用压缩模式,负载为50 mN,以5℃/min的速率从20℃升温至120℃,材料的相对形变率ε和热膨胀系数α分别通过式(1)式(2)计算。
ε = Δ L L
α = Δ L L Δ T
式(1)~(2)中:ΔT为温度变化值;ΔL为试样在ΔT下的高度变化值;L为试样的初始高度。
采用单螺杆挤出机(RM-200C型,哈尔滨哈普电气技术有限责任公司)挤出宽度为2 cm、厚度为0.1 cm的屏蔽料带材,使用高清4K测量工具显微镜(GP-304K型,昆山高品精密仪器有限公司)观察带材表面形貌,并标注凸起尺寸,表征屏蔽层表面光洁度。
采用万能击穿试验仪(DDJ-100KV型,北京冠测精电仪器设备有限公司)进行交流击穿试验,将电极置于屏蔽层-绝缘层复合试样表面,并将待测部位浸入硅油中,升压速率为0.5 kV/s,取10次有效击穿电压。
首先通过SEM观察不同屏蔽料的表面形貌,结果如图2所示。从图2可以看出,1#屏蔽料中CB分散均匀,添加分散剂的3#屏蔽料中CB团聚现象较2#屏蔽料明显改善。这是因为PVP主链为长碳链结构,其能够吸附在导电炭黑表面,形成空间位阻效应,实现良好的分散效果。同时,PVP能够增强表面酸性基团解离后减弱的静电排斥力,从而有效阻止分散后的CB重新聚集,显著提高分散性[23]。屏蔽层和绝缘层热压得到的复合试样微观形貌如图3所示。从图3可以看出,屏蔽层和绝缘层的界面平整,界面粘结较好,无明显的缺陷。
在高压电缆运输、敷设和使用过程中,屏蔽层和绝缘层界面容易受到应力作用产生气隙,此类气隙在高压运行条件下可能引发局部放电,在绝缘层中形成电树枝缺陷,最终降低电力电缆的服役年限。因此,屏蔽-绝缘层应具有良好的力学匹配性,使二者具有合适的界面强度,避免屏蔽层与绝缘层之间发生界面剥离现象。
屏蔽层-绝缘层的界面剥离性能是评估电缆屏蔽层与绝缘层之间力学匹配性的重要指标之一。界面剥离强度越高,表明屏蔽层-绝缘层之间的结合力越强,界面匹配性越好。图4为各屏蔽层-绝缘层复合试样经过剥离试验前后的剥离情况对比图和相应的应力应变曲线。从图4可以看出,试样1#-XLPE发生完全剥离,试样2#-XLPE和3#-XLPE未剥离且发生界面断裂现象。说明与试样1#-XLPE相比较,试样2#-XLPE和3#-XLPE界面结合更好,力学匹配性更好。与试样2#-XLPE相比,试样3#-XLPE在界面断裂时的应力从14.1 MPa增加至15.1 MPa,应变从51.2%增加至57.6%,说明试样3#-XLPE的界面结合性最好。
在交联聚乙烯电缆中,屏蔽层-绝缘层结合力的强弱主要取决于屏蔽层和绝缘层间的交联情况。因为2#、3#屏蔽料均采用了与XLPE绝缘料相同的交联剂,在热熔接时采用了相同的交联时间和温度,所以增强了二者与XLPE的交联匹配性,提高了屏蔽层-绝缘层的界面结合力。而1#屏蔽料和XLPE的交联匹配性较弱,导致屏蔽层-绝缘层复合试样出现完全剥离现象。
从界面剥离测试结果可以发现,界面力学特性的主要影响因素是交联而非CB分散性,这也表明界面力学特性可以通过交联行为调控。
屏蔽层与绝缘层的热膨胀性能匹配至关重要,屏蔽层与绝缘层之间的热膨胀系数差值及其随温度变化的趋势是确保电缆高温稳定运行的关键因素。当两者的热膨胀系数差值较小且随温度的变化趋势相近时,绝缘层与屏蔽层组合将表现出更为优异的热学匹配性,可以避免电缆运行过程中因热胀冷缩导致屏蔽层与绝缘层脱离接触,有助于降低因热循环引起的热残余应力,进而减少其对电缆结构的潜在危害[24]
图5(a)是XLPE绝缘料和3种屏蔽料的热膨胀系数随温度的变化趋势。从图5(a)可以看出,在温度上升初期,XLPE和屏蔽料的热膨胀系数均随温度升高而增大,这源于材料内部晶相向非晶相的转变及树脂分子链段运动能力的增强。当温度逐渐接近或超过熔点时,热膨胀系数开始逐渐下降,这是由于高温下材料内部的分子链段运动达到饱和状态,热膨胀系数无法进一步增大。XLPE绝缘层在低温区的热膨胀系数受温度影响较小,但在高温下热膨胀系数急剧上升,超过了屏蔽层。这是由于XLPE中含有更多的晶相,在晶相转为非晶相的过程中产生了明显的膨胀效应[25]。相比之下,屏蔽层中的CB作为热膨胀系数较低的无机材料,其线性尺寸稳定性良好,且在填充后会与基体树脂分子链缠结,从而在一定程度上阻碍了屏蔽层的热膨胀[26]
图5(b)、(c)分别为XLPE绝缘料和3种屏蔽料的相对形变率随温度的变化趋势及90℃下的相对形变率。从图5(b)可以看出,1#屏蔽料的相对形变率最小,显示出良好的尺寸稳定性,2#和3#屏蔽料的相对形变率整体小于1#;2#和3#屏蔽料的相对形变率变化趋势较为一致,但是当温度升高至80℃时,3#的相对形变率明显小于2#。从图5(c)可以看出,在电缆高温运行温度(90℃附近)下,3#屏蔽料的相对形变率与1#相当,表明其在特定温度下的相对形变率较低。结合图5(a)分析,1#、2#、3#和XLPE的热膨胀系数分别在88、88、96、106℃时达到峰值,因此3#屏蔽料的热膨胀性能更接近XLPE绝缘料。
图5(c)可以看出,3#在高压电缆运行温度(90℃附近)的相对形变率与1#相当,低于2#,结合图5(a)分析可得,3#的热膨胀系数随温度变化的趋势与XLPE更为接近。随着温度升高,3#的热膨胀系数变化更加平缓,热膨胀系数的峰值温度也相对较高,表明3#在热膨胀性能上与XLPE更为匹配,有助于减少因温度变化导致的界面应力差异。该现象主要归因于CB在屏蔽料内部的均匀分散,有助于形成更稳定的复合材料结构,从而显著限制了分子链的热运动[27]
导热性能良好的屏蔽层能够将电缆内部产生的热量迅速传递至外部环境,避免热量在屏蔽层内积聚,从而有效防止电缆因过热而发生损坏。在电缆运行过程中,尤其是在高负载条件下会产生一定的热量。如果这些热量未能及时耗散,电缆内部的绝缘层将面临高温加速老化环境,甚至引发绝缘击穿。因此,具备优异导热性能的屏蔽层对电缆的正常运行具有至关重要的作用。
图6展示了3种屏蔽料热扩散系数和导热系数随温度的变化趋势,其中热扩散系数反映外部温度差异引起的热量在物体内部扩散所需的时间。从图6(a)可以看出,在温度低于75℃时,1#、2#、3#屏蔽料的热扩散系数均随温度的升高而下降,说明屏蔽料内部的热量扩散速率随着温度的升高逐渐降低。这是由于温度升高,屏蔽料内部的分子链运动能力增强,CB颗粒与基体树脂之间的界面热阻增加,导致热传递过程中能量的传递效率降低。然而,当温度达到90℃时,1#和2#屏蔽料的热扩散系数出现上升现象,这是由于在接近或超过EBA基体树脂的熔融温度时,基体树脂的膨胀效应导致大分子链段、链节和基团的热运动加剧,在一定程度上恢复了屏蔽料内部的导热网络,使得热量扩散速率升高。3#屏蔽料在90℃时热扩散系数继续下降,这主要是由于3#中引入了高分子分散剂PVP,CB优异的分散性提高了分子链网络的温度稳定性,减弱了屏蔽料的热膨胀效应,大分子链段、链节和基团的热运动比其余试样弱,从而保持了较为稳定的热扩散性能。
图6(b)可以看出,3#屏蔽料的导热系数最高,而2#屏蔽料导热系数最低。CB作为良好的热传导载体,其在基体树脂中的分散和分布情况是影响屏蔽料导热系数的关键因素。3#采用了高分子分散剂使CB在屏蔽料内部形成了均匀导热的网络结构,增加了屏蔽料的导热路径,提升了材料的导热效率[28]。相比之下,未经过分散处理的2#由于CB分散效果不佳,其导热系数最低。由此可知,3#通过优化CB的分布和分散,显著提升了其导热性能,且导热性能优于1#
由热膨胀性能和导热性能结果可知,采用3#屏蔽料制备的屏蔽层热膨胀系数与XLPE绝缘层的更接近,导热系数也更高,因此在热学性能方面二者具有更优异的匹配性,这也表明通过分散剂提高CB分散性可以改善屏蔽层-绝缘层的热学匹配性。
交流电气强度是评价高压电缆运行可靠性的关键指标。当交流电压升高至一定程度时,电缆绝缘介质中会发生放电现象,电流通过介质引发介电击穿。在这一过程中,电场强度在绝缘介质中达到足够的阈值,促使原本不易导电的绝缘材料电气性质发生显著变化,进而引发电流流经绝缘介质并产生放电现象。这种放电现象会导致绝缘材料内部产生裂纹、空洞或熔融等损伤,进而破坏绝缘层的结构完整性和连续性。
屏蔽层和绝缘层的电学匹配性可通过屏蔽层-绝缘层复合试样的击穿行为和屏蔽层表面光洁度的变化规律来评价。首先,屏蔽屏-绝缘层的电气强度与屏蔽层表面凸起密切相关;其次,屏蔽层的电场分布受到绝缘层电场均匀性的影响,较差的电学匹配性将导致屏蔽层-绝缘层界面局部电场强度过大,从而引发过早击穿现象。为了验证采用1#~3#屏蔽料与XLPE所制备的屏蔽层-绝缘层复合试样的电学匹配性,制备了如图7所示的试样。然后将屏蔽层-绝缘层复合试样进行交流击穿试验,在击穿点附近进行切片,并通过光学显微镜分别测量绝缘层击穿点两侧厚度并计算平均值作为绝缘厚度。对XLPE和屏蔽层-绝缘层复合试样交流击穿后的形貌进行观察,并与XLPE的击穿形貌进行对比,结果如图8所示。从图8可以看出,与XLPE击穿试样相比,屏蔽层-绝缘层复合试样击穿空洞内存在大量黑色颗粒,且存在向击穿空洞内部扩散的趋势,这是由于交流击穿主要为热击穿,击穿时空洞附近温度较高,屏蔽层在高温作用下发生熔融,其内部CB向绝缘层扩散。这一现象表明屏蔽层的存在会影响绝缘层的击穿特性[29]。此外,绝缘层和屏蔽层-绝缘层复合试样的击穿空洞均呈现出类似的形态特征:上下宽、中间窄,形状类似沙漏。这种形态特征表明,介质击穿是从绝缘层的上、下两侧向内部共同发展的过程。
采用威布尔分布对击穿数据进行统计,得出击穿概率为63.2%时各试样的电气强度如图9表2所示。从表2可以看出,XLPE、1#-XLPE、2#-XLPE、3#-XLPE的电气强度分别为60.6、50.9、46.9、49.1 kV/mm。相较于XLPE,屏蔽层-绝缘层复合试样的电气强度均有不同程度降低。通过观察各屏蔽层-绝缘层复合试样的界面情况(如图10所示),可以看出3种屏蔽层-绝缘层复合试样的界面均存在凸起点,说明屏蔽层-绝缘层界面引入的杂质以及屏蔽层的表面凸起是导致绝缘层内部电场分布不均的根本原因[30]
在各屏蔽层-绝缘层复合试样中,1#-XLPE的电气强度最高,而2#-XLPE的电气强度最低,表明1#屏蔽料与XLPE具有良好的电学匹配性。相较于2#-XLPE,3#-XLPE的交流电气强度有所提升,表明本文所采用的CB分散策略有效提高了屏蔽料与XLPE的电学匹配性。观察屏蔽层-绝缘层的界面情况可知,界面形貌特征将会影响试样的交流电气强度。进一步通过光学显微镜对屏蔽料试样表面粗糙度进行表征,以反映屏蔽层-绝缘层的界面情况,结果如图11所示。从图11可以看出,1#屏蔽料试样表面最光滑,表面凸起点尺寸最小和数量最少,其次为3#,2#表面光洁度较差。由此可以发现,屏蔽层表面光洁度是影响屏蔽层-绝缘层电学匹配性的直接因素。屏蔽层的表面凸起点导致屏蔽层-绝缘层界面出现局部电场集中,引发绝缘层电场不均匀分布,导致电气强度降低。表面光洁度越差,电气强度降低幅度越大,从而显著降低了绝缘层-屏蔽层的电学匹配性。由于PVP能够显著改善CB的分散性,其在提高屏蔽料表面光洁度从而改善屏蔽料与XLPE绝缘料的电学匹配性方面发挥了关键的作用。
结合之前的分析,可以得出屏蔽层表面光洁度是影响屏蔽层-绝缘层复合试样电学性能的关键因素之一。通过优化生产工艺、提高加工精度以及改进配方,可以进一步提高屏蔽层表面的光洁度,从而提升屏蔽料与XLPE的电学匹配性,确保电缆在实际运行中的稳定性和安全性。
采用XLPE绝缘料为绝缘层,选择一款进口屏蔽料(1#)以及两款国产配方屏蔽料(2#、3#)制作屏蔽层,制备了屏蔽层-绝缘层复合试样,并对其进行了力学-热学-电学匹配性对比分析,研究不同屏蔽料与绝缘料之间的匹配性能差异,得出以下结论:
(1)2#和3#屏蔽料与XLPE的力学匹配性优异,而1#屏蔽料与XLPE的力学匹配性较差。影响力学匹配性的关键因素是绝缘料和屏蔽料之间的交联特性,绝缘料与屏蔽料交联匹配性的优劣决定了力学匹配性的强弱。
(2)3#屏蔽料与XLPE具有更佳的热学匹配性,这是因为高分子分散剂PVP的引入抑制了3#的热膨胀效应,使其在90℃下的相对形变率与1#相当,热膨胀系数随温度变化的趋势与XLPE绝缘层更加接近。而CB分散性的改善也显著增强了3#的导热性能。
(3)3#-XLPE的电气强度相比于2#-XLPE更高,说明PVP分散剂的加入能够提高屏蔽层的界面均匀性,从而提高屏蔽层-绝缘层的电学匹配性。
(4)3#屏蔽料在热学和电学匹配性方面相比于2#屏蔽料表现出显著的性能提升,更接近进口1#屏蔽料的性能水平,同时具有最优的力学匹配性,因此,PVP改性的3#屏蔽料在综合匹配性能上具有明显的优势。
  • 南方电网公司科技项目(031900KK52210018)
  • 南方电网公司科技项目(GDKJXM20210076)
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2025年第58卷第7期
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doi: 10.16790/j.cnki.1009-9239.im.2025.07.007
  • 接收时间:2024-12-31
  • 首发时间:2025-10-29
  • 出版时间:2025-07-20
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  • 收稿日期:2024-12-31
  • 修回日期:2025-02-21
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南方电网公司科技项目(031900KK52210018)
南方电网公司科技项目(GDKJXM20210076)
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    1.广东电网有限责任公司东莞供电局,广东 东莞 523120
    2.南方电网科学研究院有限责任公司,广东 广州 510663
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2种不同金属材料的力学参数

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Genus
种数
Number of
species
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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