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Article(id=1304921794020926308, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1304921686403474081, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2026.06.007, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1760544000000, receivedDateStr=2025-10-16, revisedDate=1765382400000, revisedDateStr=2025-12-11, acceptedDate=null, acceptedDateStr=null, onlineDate=1789047199968, onlineDateStr=2026-09-10, pubDate=1781884800000, pubDateStr=2026-06-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1789047199968, onlineIssueDateStr=2026-09-10, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1789047199968, creator=13701087609, updateTime=1789047199968, updator=13701087609, issue=Issue{id=1304921686403474081, tenantId=1146029695717560320, journalId=1149653034449285133, year='2026', volume='59', issue='6', pageStart='1', pageEnd='188', issueExtLink='null', onlineDate='null', pubDate='1781884800000', pubDateStr='2026-06-20', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1789047174311, creator='13701087609', updateTime=1789118019323, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1305218831971021057, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1304921686403474081, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1305218831971021058, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1304921686403474081, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=74, endPage=81, ext={EN=ArticleExt(id=1304921794180309861, articleId=1304921794020926308, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Application and development trend of low Dk/Df materials in flexible printed circuit boards field, columnId=null, journalTitle=Insulating Materials, columnName=null, runingTitle=null, highlight=null, articleAbstract=

With the deployment of 5G and the outlook toward 6G, flexible printed circuits (FPC) are facing more stringent requirements in high‑frequency, high‑speed signal transmission, and dielectric constant (Dk) and dielectric loss factor (Df) are key parameters determining signal attenuation and time delay. This paper reviewed the current state and application challenges of key insulating materials for FPC, focusing on the performance advantages, modification strategies, and industrialization progress of modified polyimide (MPI) and liquid crystal polymer (LCP) as high‑frequency dielectric substrates. It also analyzed the challenges in formulation design, filler selection and process compatibility of modified polyimide and polyolefin systems used for high-frequency pure adhesive films. In addition, the potential of low‑Dk/Df polymers such as fluorinated resins was evaluated, the trade-offs among electrical properties, processability and cost were discussed, and suggestions for future research and industrialization pathways of high-frequency FPC materials were proposed.

, authors=Lifang ZHENG, Jiancheng CAO, Zongmin HU, authorsList=Lifang ZHENG, Jiancheng CAO, Zongmin HU, authorCompany=null, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1304921795778339704, articleId=1304921794020926308, tenantId=1146029695717560320, journalId=1149653034449285133, language=CN, title=低介电介损材料在柔性电路板领域的应用与发展趋势, columnId=null, journalTitle=绝缘材料, columnName=, runingTitle=null, highlight=null, articleAbstract=

随着5G的部署与6G的前瞻发展，柔性电路板（FPC）在高频高速信号传输方面面临更严格的性能要求，其中介电常数（Dk）与介电损耗因子（Df）是决定信号衰减与时延的关键参数。本文综述了FPC关键绝缘材料的研究与应用现状，重点评述改性聚酰亚胺（MPI）与液晶聚合物（LCP）作为高频介质基材的性能优势、改性策略及产业化进展，同时分析用于高频纯胶膜的改性聚酰亚胺与聚烯烃体系在配方设计、填料选择与工艺适配方面的挑战。文章还评估了氟树脂等低Dk/Df高分子材料的潜力，讨论了电学性能、工艺可加工性与成本之间的权衡，并提出了面向高频FPC材料的未来研究与产业化路径建议。

, authors=郑理方, 曹建诚, 胡宗敏, authorsList=郑理方, 曹建诚, 胡宗敏, authorCompany=null, correspAuthors=null, authorNote=

郑理方（1996-），男（汉族），山西运城人，工程师，从事柔性电路板材料研发工作。

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郑理方（1996-），男（汉族），山西运城人，工程师，从事柔性电路板材料研发工作。

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郑理方（1996-），男（汉族），山西运城人，工程师，从事柔性电路板材料研发工作。

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Insulating Materials,2025,58(6):43-51., articleTitle=Preparation and performance study of flame-retardant and hydrophobic fluorinated polyimide porous composite films, refAbstract=null)], funds=null, companyList=[AuthorCompany(id=1304921808973623296, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, xref=null, ext=[AuthorCompanyExt(id=1304921808982011905, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, companyId=1304921808973623296, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=MFLEX (Yan Cheng) Co., Ltd., Yancheng 224000, China), AuthorCompanyExt(id=1304921808986206210, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, companyId=1304921808973623296, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=盐城维信电子有限公司，江苏　盐城　224000)])], figs=[ArticleFig(id=1304921810642956316, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Fig.1, caption=Design of microstrip and stripline, figureFileSmall=WUWGiS5H1MjdSenlIQBBwQ==, figureFileBig=VXdKueV3eq43kGgFm+GStA==, tableContent=null), ArticleFig(id=1304921810705870877, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=图1, caption=微带线和带状线设计, figureFileSmall=WUWGiS5H1MjdSenlIQBBwQ==, figureFileBig=VXdKueV3eq43kGgFm+GStA==, tableContent=null), ArticleFig(id=1304921810793951262, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Fig.2, caption=Two typical FPC stack up design, figureFileSmall=l+w5sbbbL73EHXDf3BHrEg==, figureFileBig=nACEQ7DSQMfkxWm7DpFDSg==, tableContent=null), ArticleFig(id=1304921810877837343, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=图2, caption=两种典型FPC叠层结构示意图, figureFileSmall=l+w5sbbbL73EHXDf3BHrEg==, figureFileBig=nACEQ7DSQMfkxWm7DpFDSg==, tableContent=null), ArticleFig(id=1304921810995277856, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Fig.3, caption=Typical PI and MPI molecular structures, figureFileSmall=XFki9LwF8C724/tMqnLLyA==, figureFileBig=V7U/PmDnFI+kmRubn0J9Wg==, tableContent=null), ArticleFig(id=1304921811074969633, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=图3, caption=常见的PI及MPI分子结构, figureFileSmall=XFki9LwF8C724/tMqnLLyA==, figureFileBig=V7U/PmDnFI+kmRubn0J9Wg==, tableContent=null), ArticleFig(id=1304921811146272802, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Fig.4, caption=Comparison of transmission loss between MPI FPC and PI FPC, figureFileSmall=fPqW5FdstD+vM0Hv1kqNhQ==, figureFileBig=yUhC47k7IShxYpiio6Cw0w==, tableContent=null), ArticleFig(id=1304921811217575971, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=图4, caption=MPI FPC与PI FPC传输损耗对比, figureFileSmall=fPqW5FdstD+vM0Hv1kqNhQ==, figureFileBig=yUhC47k7IShxYpiio6Cw0w==, tableContent=null), ArticleFig(id=1304921811288879140, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Fig.5, caption=Stacking design of different LCP FPC, figureFileSmall=pM6hWkdkueBu8fQMFOhXMA==, figureFileBig=EXQ0i8KQ4NIZha+XKvgGBA==, tableContent=null), ArticleFig(id=1304921811381153829, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=图5, caption=不同LCP FPC的叠构设计, figureFileSmall=pM6hWkdkueBu8fQMFOhXMA==, figureFileBig=EXQ0i8KQ4NIZha+XKvgGBA==, tableContent=null), ArticleFig(id=1304921811452456998, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Fig.6, caption=Comparison of transmission loss between conventional ADH BAF-FPC and high frequency ADH BAF-FPC, figureFileSmall=Zz2ujHoMIY3NDoODyuAbRw==, figureFileBig=gbsdZPoQqMHFbqkxr7T/XQ==, tableContent=null), ArticleFig(id=1304921811532148775, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=图6, caption=常规胶膜FPC与高频胶膜FPC传输损耗对比, figureFileSmall=Zz2ujHoMIY3NDoODyuAbRw==, figureFileBig=gbsdZPoQqMHFbqkxr7T/XQ==, tableContent=null), ArticleFig(id=1304921811599257640, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Table 1, caption=

Performance comparison of PI/MPI from mainstream manufacturers in the market

, figureFileSmall=null, figureFileBig=null, tableContent=
厂商类型Dk/Df(10 GHz)吸水率/%拉伸强度/MPa断裂伸长率/%
美国杜邦(DuPont)PI3.40/0.0051.019321
MPI3.20/0.0030.537545
日本钟源化学 (KANEKA)PI3.20/0.0091.218060
MPI3.50/0.0030.728080
), ArticleFig(id=1304921811683143721, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=表1, caption=

市面主流厂商PI/MPI材料的性能对比

, figureFileSmall=null, figureFileBig=null, tableContent=
厂商类型Dk/Df(10 GHz)吸水率/%拉伸强度/MPa断裂伸长率/%
美国杜邦(DuPont)PI3.40/0.0051.019321
MPI3.20/0.0030.537545
日本钟源化学 (KANEKA)PI3.20/0.0091.218060
MPI3.50/0.0030.728080
), ArticleFig(id=1304921811767029802, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Table 2, caption=

Typical structure of LCP molecule and its melting point range

, figureFileSmall=null, figureFileBig=null, tableContent=
LCP类型化学结构熔点/℃
Ⅰ330～
Ⅱ280～320
Ⅲ～240
), ArticleFig(id=1304921811829944363, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=表2, caption=

典型LCP分子结构及熔点范围

, figureFileSmall=null, figureFileBig=null, tableContent=
LCP类型化学结构熔点/℃
Ⅰ330～
Ⅱ280～320
Ⅲ～240
), ArticleFig(id=1304921811909636140, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Table 3, caption=

Performance comparison of different types of LCP FCCL

, figureFileSmall=null, figureFileBig=null, tableContent=
FCCL制备方式铜箔结合力/(N/mm)吸水率/%DkDf
薄膜压合>0.50.043.30.002
溶液涂布>1.10.033.30.002
), ArticleFig(id=1304921811980939309, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=表3, caption=

两种不同类型的LCP基FCCL性能对比

, figureFileSmall=null, figureFileBig=null, tableContent=
FCCL制备方式铜箔结合力/(N/mm)吸水率/%DkDf
薄膜压合>0.50.043.30.002
溶液涂布>1.10.033.30.002
), ArticleFig(id=1304921812052242478, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Table 4, caption=

Comparison of key properties of fluororesin film and composite film

, figureFileSmall=null, figureFileBig=null, tableContent=
厂商材料类型Dk/Df(10 GHz)吸水率/%拉伸强度/MPa断裂伸长率/%
日本旭硝子(AGC)氟树脂薄膜2.60/0.0020.312045

台湾达迈

(TAIMIDE)

氟树脂复合薄膜2.70/0.0030.418020
), ArticleFig(id=1304921812148711471, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=表4, caption=

氟树脂薄膜及复合薄膜关键性能对比

, figureFileSmall=null, figureFileBig=null, tableContent=
厂商材料类型Dk/Df(10 GHz)吸水率/%拉伸强度/MPa断裂伸长率/%
日本旭硝子(AGC)氟树脂薄膜2.60/0.0020.312045

台湾达迈

(TAIMIDE)

氟树脂复合薄膜2.70/0.0030.418020
), ArticleFig(id=1304921812232597552, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=EN, label=Table 5, caption=

Common ADH BAF and their performance

, figureFileSmall=null, figureFileBig=null, tableContent=
类型吸水率/%Dk/Df(10 GHz)模量/GPa断裂伸长率/%
常规环氧胶膜0.73.30/0.0280.884
高频聚烯烃胶膜0.62.30/0.0030.1448
高频MPI胶膜0.12.80/0.00321.3
), ArticleFig(id=1304921812312289329, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1304921794020926308, language=CN, label=表5, caption=

常见纯胶膜及其性能

, figureFileSmall=null, figureFileBig=null, tableContent=
类型吸水率/%Dk/Df(10 GHz)模量/GPa断裂伸长率/%
常规环氧胶膜0.73.30/0.0280.884
高频聚烯烃胶膜0.62.30/0.0030.1448
高频MPI胶膜0.12.80/0.00321.3
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低介电介损材料在柔性电路板领域的应用与发展趋势
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郑理方 , 曹建诚 , 胡宗敏
绝缘材料 | 2026,59(6): 74-81
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绝缘材料 | 2026 , 59 (6) : 74 -81
低介电介损材料在柔性电路板领域的应用与发展趋势
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郑理方, 曹建诚, 胡宗敏
作者信息
  • 盐城维信电子有限公司，江苏　盐城　224000
作者简介:

郑理方（1996-），男（汉族），山西运城人，工程师，从事柔性电路板材料研发工作。

Application and development trend of low Dk/Df materials in flexible printed circuit boards field
Lifang ZHENG, Jiancheng CAO, Zongmin HU
Affiliations
  • MFLEX (Yan Cheng) Co., Ltd., Yancheng 224000, China
出版时间: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.007
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随着5G的部署与6G的前瞻发展，柔性电路板（FPC）在高频高速信号传输方面面临更严格的性能要求，其中介电常数（Dk）与介电损耗因子（Df）是决定信号衰减与时延的关键参数。本文综述了FPC关键绝缘材料的研究与应用现状，重点评述改性聚酰亚胺（MPI）与液晶聚合物（LCP）作为高频介质基材的性能优势、改性策略及产业化进展，同时分析用于高频纯胶膜的改性聚酰亚胺与聚烯烃体系在配方设计、填料选择与工艺适配方面的挑战。文章还评估了氟树脂等低Dk/Df高分子材料的潜力，讨论了电学性能、工艺可加工性与成本之间的权衡，并提出了面向高频FPC材料的未来研究与产业化路径建议。

柔性电路板  /  高频高速  /  低介电介损材料  /  聚酰亚胺  /  液晶聚合物

With the deployment of 5G and the outlook toward 6G, flexible printed circuits (FPC) are facing more stringent requirements in high‑frequency, high‑speed signal transmission, and dielectric constant (Dk) and dielectric loss factor (Df) are key parameters determining signal attenuation and time delay. This paper reviewed the current state and application challenges of key insulating materials for FPC, focusing on the performance advantages, modification strategies, and industrialization progress of modified polyimide (MPI) and liquid crystal polymer (LCP) as high‑frequency dielectric substrates. It also analyzed the challenges in formulation design, filler selection and process compatibility of modified polyimide and polyolefin systems used for high-frequency pure adhesive films. In addition, the potential of low‑Dk/Df polymers such as fluorinated resins was evaluated, the trade-offs among electrical properties, processability and cost were discussed, and suggestions for future research and industrialization pathways of high-frequency FPC materials were proposed.

flexible printed circuits boards  /  high-frequency and high-speed  /  low Dk/Df material  /  polyimide  /  liquid crystal polymer
郑理方, 曹建诚, 胡宗敏. 低介电介损材料在柔性电路板领域的应用与发展趋势. 绝缘材料, 2026 , 59 (6) : 74 -81 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.007
Lifang ZHENG, Jiancheng CAO, Zongmin HU. Application and development trend of low Dk/Df materials in flexible printed circuit boards field[J]. Insulating Materials, 2026 , 59 (6) : 74 -81 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.007
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0　引言
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2019年6月，工信部向中国移动、中国联通、中国电信及中国广电正式颁发5G商用牌照，标志着我国全面进入5G商用时代[1]。展望未来，第六代移动通信技术（6G）预计于2030年左右实现商用，其性能将实现质的飞跃：传输速率预计提升至5G的50倍，时延降低至5G的十分之一，并在连接密度、移动性及定位精度等关键指标上大幅突破。这一技术演进将有力推动原生AI、VR设备、L5级自动驾驶、协作机器人等前沿应用的落地，同时也对底层硬件性能提出了更高要求。作为关键信号载体的柔性电路板（flexible printed circuits boards，FPC），提升其高频高速下的传输性能，降低传输损耗，显得尤为重要。最为常见的高频高速FPC的叠构设计一般会采用微带线（Microstrip）或带状线（Stripline），如图1所示。带状线设计的传输线被介质基材完全包裹，上下方都有参考接地层，传输过程中信号抗干扰能力强，电磁辐射极小，一般适用于高于10 GHz的频段。微带线则是一种半暴露的传输线，仅在下方有参考接地层，易受外部干扰，也易向外辐射能量，一般适用于低于10 GHz频段。
一般通信技术中信号传递损耗（TL）分为导体损耗（TLC）和介质损耗（TLD），其中TLD与介质材料的介电常数（Dk）及介电损耗（Df）之间的关系为：TLD=K×fc×Dk×Df，式中K为系数，f为频率，c为光速。通信技术中的信号传输延迟Td与介质材料的Dk之间的关系为：Td=KDk0.5[2]。在微带线与带状线这两种主流的柔性电路板（FPC）设计中，与金属导体层直接接触的绝缘介质材料，其Dk与Df等关键介电性能参数对信号传输质量及损耗程度起着决定性作用。FPC常用材料主要包括挠性覆铜板（FCCL）、覆盖膜（CVL）以及纯胶膜（BS）等，其典型叠层结构如图2所示。因此，FCCL的介质层、CVL以及BS的介电特性都会直接影响FPC整体的信号传输性能。
综上，选用具有低介电常数与低介电损耗的先进材料，成为降低信号介质损耗、减少传输延迟的有效途径。自FPC技术问世以来，科研机构与材料厂商对介质层与纯胶膜的开发与优化工作持续不断。从材料体系来看，传统的低介电损耗高分子种类繁多，包括聚酰亚胺（PI）、液晶聚合物（LCP）、氟系树脂、聚烯烃（如聚丙烯、环烯烃共聚物）、聚苯醚（PPO）、聚醚醚酮（PEEK）、双马来酰亚胺三嗪树脂（BT）、苯并环丁烯（BCB）等。然而，其中大多数材料受限于自身力学性能、耐热性能、加工适配性或成本等因素，未能在此领域实现规模化应用。目前，成功在高频高速FPC中作为绝缘介质薄膜使用的材料主要有改性聚酰亚胺（modified polyimide，MPI）和液晶聚合物（liquid crystal polymer，LCP）两种。而在纯胶膜方面，改性聚酰亚胺与聚烯烃类聚合物（polyolefin）则因其优异的综合性能，成为高频应用中的主流材料选择。
1　柔性电路板中低介电介损材料的应用状况
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1.1　改性聚酰亚胺（MPI）
自杜邦公司推出首款商用聚酰亚胺（PI）薄膜至今，该材料因其优异的综合性能，在柔性电路板领域得到了长期而广泛的应用。然而，面对现代电子产品对高频高速传输性能日益严苛的要求，传统PI材料显现出性能瓶颈。为突破此限制，产业界与学术界对PI材料展开了系统性的改性研究，从而有力地推动了性能更佳的MPI的演进与发展，改性的方法主要围绕在降低材料的Dk及Df方面。目前，降低Dk的技术路径较多，相关理论体系也趋于成熟。常用的方法主要包括：增大分子链间的自由体积、降低分子链的极性以及引入低Dk的功能性填料等。而Df的本质源于交变电场作用下发生的介质弛豫现象，以及极化单元旋转所导致的能量损耗。因此，降低Df的核心思路是抑制极化单元在不同频率下的旋转响应，关键在于限制偶极矩极化和电子极化的贡献[3]。图3列举了常见的PI和MPI分子结构。
在具体材料设计中，引入氟元素被证实是提升材料综合性能的有效策略之一。氟原子能够显著降低聚合物的吸湿性，并改善介电性能，因此多个研究团队尝试在PI主链中引入-CF3等含氟基团[4]。HE Jianhao等[5]通过引入含氟基团成功开发出Dk<3.0的PI薄膜，在实现低介电性能的同时，也较好地平衡了含氟基团引入可能带来的热稳定性下降问题。LIU Yiwu等[6]则通过在刚性PI主链中引入具有大位阻的刚性非平面共轭侧链，构造出亚纳米尺度的自由体积孔隙，从而有效降低材料Dk。所制备薄膜的介电性能显著优于市售PI产品。上述方法均展示了具有创新性的材料设计思路，并成功制备出性能优异的MPI材料。为降低MPI薄膜的吸水率与Df，LU Q H团队[3]通过在分子主链中精确调控酯键与醚键的密度，改变了链内相互作用，成功制备了Df<0.002的MPI薄膜，虽该方案对热力学性能有所影响，但提供了关键的分子改性思路。另一方面，添加高带隙无机填料（如SiO2、Al2O3）是改善材料介电性能的常用手段[7]，但填料-基体界面易因电性能不匹配产生极化，导致介电常数升高。为此，YANG Jinghui团队[8]通过在MoS2表面原位组装吡咯聚合物，有效抑制了界面极化并提升了分散性，实现了对材料介电性能的有效调控。然而，值得关注的是，欧盟五国（丹麦、德国、荷兰、挪威和瑞典）于2023年1月13日联合向欧洲化学品管理局提交了一项提案，旨在全面限制聚氟烷烃物质（PFASs）在欧洲境内的生产、投放及使用。该提案对PFASs的定义十分严格，明确规定：任何含有完全氟化的甲基或亚甲基结构，且该碳原子上未连接氢、氯、溴、碘等原子的化学品，均属于限制范围。尽管该提案目前仍处于立法程序中，尚未正式生效，但在未来开展针对MPI材料介电性能的含氟改性研究时，需高度关注其潜在的法规合规风险。
相较于传统PI，MPI材料不仅具备更低的Dk与Df，还拥有更优的吸湿表现，使其在高频高速应用中对信号完整性的维护更为出色。因此我们分别选用MPI FCCL和PI FCCL制备了FPC，并对比了其传输损耗，结果见图4。从图4可以看出，选用MPI FCCL加工得到的FPC信号传输损耗相比于PI FCCL制得的FPC更低（所有传输损耗数据在25℃、50%RH环境下收集）。从产业链角度看，MPI薄膜在FPC加工制程上的制造难度与传统PI材料较为接近，这意味着无论是上游材料供应商还是下游FPC制造商，都能凭借现有成熟的工艺设备实现平滑过渡与快速导入，极大地降低了技术切换的门槛与成本。
与此同时，市场格局也正悄然改变。近年来，全球范围内涌现出众多MPI薄膜供应商，除早期的Kaneka、PIAM、UBE、达迈等国际厂商外，瑞华泰、巨先、国风、时代华鑫等国内PI 厂商也相继开始布局MPI材料开发。表1列举了主流厂商及其产品的关键性能（所有Dk/Df数据在25℃、50%RH环境下收集）。日益激烈的竞争使得面向FPC的基板（FCCL）与覆盖膜（CVL）等材料资源愈加丰富，推动了成本的优化，为MPI的普及提供了强劲动力。然而必须指出的是，尽管MPI材料已成为高频高速FPC应用领域的主流选择，但其进一步发展仍面临一系列亟待攻克的技术瓶颈。首先，在工艺层面，如何制备更厚的MPI材料，是满足特定电路设计需求的关键。其次，在核心性能上，如何在更宽的频率与温度范围内，进一步降低并稳定Dk与Df是追求极致信号完整性的核心挑战。再次，材料的吸湿性是影响其介电性能稳定的顽疾，开发有效的耐湿策略以阻断水分子对介电性能的劣化影响至关重要。最后，随着柔性电子形态的多样化，如何进一步提升薄膜的耐弯折性能与抗疲劳特性，也成为决定其应用边界的重要因素。
1.2　液晶聚合物（LCP）
LCP材料是一种热塑性有机材料，其分子链在熔融状态下仍能保持一定的有序排列，这种特性使其具备低介电常数、低介电损耗及低吸水率等特性，尤其在较宽的频率范围内表现出相当稳定的介电常数，被视为5G高频应用中最具前景的高分子材料之一[9]。表2列出了典型LCP分子结构及熔点信息。但LCP材料本身的分子结构特性决定了它在熔融态是像“火柴棒”一样的有序排列（液晶态），而不是像普通聚合物那样是无规的“线团”。这种固有的有序性是其优异性能的来源，也是制造难度的根源。在成膜过程中，这些“火柴棒”非常容易沿着拉伸方向高度取向。如果控制不好，会导致薄膜纵向（MD）与横向（TD）的力学性能和热收缩率差异巨大，即各向异性过于明显，使得薄膜在后续加工中容易因应力不均而翘曲或撕裂。同时用于制备薄膜的树脂必须是高分子量、高纯度的“膜级”LCP树脂，树脂的合成难度大。目前高品质的“膜级”LCP树脂主要被少数几家国际化工巨头（如塞拉尼斯、宝理）所掌握，导致上游材料资源稀缺，成本居高不下。LCP薄膜的成膜工艺主要采用吹膜法与流延法两种路线，为了改善成膜性，可能需要调整树脂配方或工艺，然而无论采用何种工艺，所制得的LCP薄膜普遍存在性能均一性较差的问题，因此在实际生产中通常需要引入退火制程，以改善其综合性能并提升其均一性。此外，在全球范围内，能够稳定供应LCP树脂原料的企业较为有限，目前主要集中于少数几家日本厂商，受此制约，目前实现LCP薄膜量产供应的企业也屈指可数，以日本村田、可乐丽等为代表，整体产业资源高度集中。但值得关注的是，近年来国内企业如金发科技、普利特、沃特股份、聚嘉新材料等，正积极布局LCP树脂及薄膜的研发与产业化。在这一进程中，普利特凭借其技术积累与产品进展，目前走在行业前列，其LCP薄膜产品已经接近量产水平，展现出国产替代的积极信号。
对于LCP材料而言，其加工难度不仅存在于材料合成阶段，也显著体现在下游制造环节，无论是FCCL制造商还是FPC厂商，均面临相应的工艺挑战。对于FCCL厂家来说，核心难点在于如何充分利用LCP的热塑性特性，实现与铜箔之间稳定可靠的结合力，并同时保障薄膜厚度均匀性与整体尺寸稳定性。这些性能的实现高度依赖于FCCL生产设备的精度、工艺参数的优化、成型工艺的控制，以及合适的铜箔选择，每一环节均直接影响最终产品的质量与可靠性，对企业的综合制造能力提出了较高要求。除了常见的以LCP薄膜通过压合工艺制备FCCL之外，目前也有部分厂商采用改性LCP溶液，通过涂布工艺来制造FCCL。这种工艺路径在加工制造方面相对简便，且能够实现LCP与铜箔之间更强的结合力。然而，为了提升LCP溶液涂布过程的适用性与成膜质量，往往需要在材料配方中引入相应改性组分，这在一定程度上牺牲了LCP本身优异的介电性能与低吸湿特性。两种工艺路径制得的FCCL在多项关键性能上存在差异，具体特性对比见表3。
对于柔性电路板FPC制造商而言，加工LCP基FCCL同样存在多项工艺挑战。首先，LCP材料本身的热塑性特性决定了其热稳定性相对有限。典型LCP材料的熔点约为300℃左右，这一特性限制了其在高温制程中的应用，例如Hot Bar焊接等工艺。此外，制造过程中的热制程环节（压合、烘烤等）对其层间结合力、尺寸稳定性、基础性能的一致性与均匀性也构成考验。其次，LCP与铜箔之间的结合力通常低于传统PI基材，这要求制造商在焊接可靠性方面予以特别关注。同时，LCP与纯胶膜压合后的界面结合力也受材料特性影响，往往需要配套特殊的表面处理工艺与压合参数设置。除传统搭配纯胶膜的FPC结构外，业界也在探索利用LCP自身热塑性的全LCP结构方案（如图5所示）。该结构无需使用纯胶膜，而是通过LCP材料在熔融状态下的自粘接性实现层间结合。然而，这种方案要求压合温度必须达到LCP熔点（约300℃）以上，对层间对位精度、压合后的性能稳定性及一致性提出了更高要求，也相应考验FPC厂商在设备能力与工艺控制方面的水平。值得注意的是，以村田为代表的厂商通过特殊的堆叠设计与印刷烧结工艺，已实现多层全LCP FPC结构的量产。然而，该工艺目前仍存在线路平整度控制难度大、层间LCP厚度均匀性不足等局限性。
综上所述，LCP柔性电路板方案核心优势在于更低的吸湿特性所带来的介电性能稳定性，这一点在高速信号传输损耗方面表现尤为突出。LCP材料极低的吸水率有效降低了因环境湿度波动导致的介电参数（Dk/Df）漂移，从而在高频应用中能够维持更稳定的阻抗控制和信号完整性。然而，LCP方案的大规模应用仍面临挑战：LCP原材料本身价格较高，且全球供应链集中度较高，导致资源相对受限；在制造工艺方面，LCP薄膜的加工窗口较窄，对热压合、钻孔及金属化等工序提出了更苛刻的要求，工艺难度与MPI相比显著提升。这些因素共同制约了LCP柔性电路板在成本敏感或制造能力有限场景下的应用广度。
1.3　氟树脂
氟元素材料在高端电子封装领域展现出显著的应用潜力，这主要源于其独特的分子结构与化学特性。-CF3基团作为典型的强吸电子基团，不仅具有极高的电负性（约3.98），其刚性骨架与大空间位阻效应还能有效抑制分子链段运动，降低介电响应过程中的极化损耗。同时，C-F键极低的极化率（约1.54 D）与分子间较弱的相互作用力，赋予了材料优异的疏水特性，使其平衡吸水率可维持在0.05%以下，这一特性对维持高频信号传输稳定性至关重要。从材料化学角度分析，C-F键能高达485 kJ/mol，赋予其卓越的热稳定性（热分解温度>400℃）与化学惰性，能够耐受强酸、强碱及有机溶剂的侵蚀，在极端环境下仍能保持稳定的介电性能（Dk≈为2.1～2.4，Df<0.001）。这一系列特性使氟树脂成为5G毫米波通信、航空航天电子等高频应用场景的理想候选材料[10-12]。然而，纯氟树脂薄膜，如PTFE等，在力学性能方面存在明显不足，难以满足柔性电路板的机械可靠性要求。因此在实际应用中常采用MPI与氟树脂复合的体系以增强其机械强度，但该策略往往以牺牲部分电学性能为代价，具体数据对比见表4。另外，常规氟树脂对紫外光的吸收率极低，导致其在激光钻孔等微加工过程中工艺窗口狭窄，需研发专用的加工参数并优化树脂体系以提升其可加工性。同时，氟树脂本身的高稳定性与低表面能使其表现出明显的表面惰性，难以实现与其他材料的稳定粘接，且在孔加工后的清洁与电镀环节中也面临严峻挑战，对FPC厂商的工艺积累与过程管控能力提出了极高要求。更为严峻的是，全球范围内日益严格的环保法规（如欧盟PFAS禁令、RoHS 2.0）正在限制PFAS的生产与使用。尽管氟树脂在10 GHz下的Dk/Df可达2.15/0.000 8，远超传统PI材料，但其原材料及加工综合成本较高，加工难度大，且面临供应链可持续性挑战。这些技术瓶颈与政策限制共同制约了氟树脂在高端电子领域的规模化应用，推动行业加速开发新型低介电、易加工的非氟替代材料。
1.4　高频FPC用纯胶膜
在常规FPC的制备中，通常使用环氧树脂（EP）作为纯胶膜，用于CVL与FPC的粘接或不同FCCL间的粘接。环氧体系还会额外添加固化剂和填料，固化剂用于形成交联网络，常见的固化剂通常为多官能团的一级胺或二级胺。填料（如SiO2、Al2O3等）在纯胶膜中主要用于改善固化后的微观结构与性能，例如提高模量、改善热稳定性并调节电学特性。此外，通过选择合适的粒径/表面处理、控制填充量并加入分散/流变助剂可以调控胶膜在固化过程中的黏度和流动性[13]。但不同环氧胶的Dk/Df特性较差，不能满足高频FPC的介电性能要求，为了应对高频传输需求，需要选用一些高频纯胶膜，通常选用MPI或聚烯烃等体系，并引入环氧基团进行改性，以实现低Dk/Df和胶粘功能的平衡，从而降低FPC信号传输损耗。我们收集并对比了常规环氧胶膜FPC与高频聚烯烃胶膜FPC的传输损耗，结果见图6。
常规环氧胶膜与高频聚烯烃胶膜、改性聚酰亚胺胶膜在力学性能、电学特性及耐热性等方面存在显著差异，如表5所示。以聚烯烃树脂为例，聚烯烃由非极性的碳-碳和碳-氢键构成，分子对称性高，在电场中极化程度低，能量损耗小，导致聚烯烃材料具有极低的Dk和Df，在高速高频场景中表现出优异的信号完整性。然而，该分子链结构也导致胶膜断裂伸长率较高，在FPC精密加工过程中易出现冲切相关问题。此外，聚烯烃胶膜与铜箔及基板间的界面结合力、压合之后的耐热性也明显弱于含有极性基团的环氧胶膜体系。为克服这些局限性，在实际FPC制造中需引入特定的基板前处理工艺，如等离子体活化、铜箔表面粗化、基板烘烤处理等，以增强界面粘接，提高耐热性，从而确保最终FPC产品在高频应用中的长期可靠性。
2　其他材料
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除了上述材料以外，同样有很多介电性能优异的高分子薄膜材料，但都因为资源成本、加工性能问题没能在高频高速FPC领域内展开应用。比如聚苯醚树脂（PPO）作为一种高性能工程塑料，具备出色的机械强度、热稳定性与电绝缘性能，特别是经过改性的PPO，展现出优异的介电特性[14]。双马来酰亚胺树脂（BMI）以其卓越的耐热性能、电绝缘性能、透波性能、耐辐射、阻燃性能以及良好的力学性能和尺寸稳定性著称，其成型工艺与环氧树脂类似，因此在航空航天、机械制造、电子等高科技工业中获得了广泛应用[15]。聚醚醚酮（PEEK）作为一种半结晶性热塑性塑料，已被多次证实具备优异的电气强度、介电常数和低介电损耗等特性[16-17]。尽管可通过调控退火工艺、结晶度及分子结构来优化其力学性能与玻璃化转变温度，但PEEK在柔性电路板制造过程中所面临的高温与强拉伸等严苛工艺条件下，仍存在适应性问题。环烯烃共聚物（COCs）是一类先进的无定形热塑性塑料，该类材料通常采用茂金属催化工艺，通过环状单体与线性烯烃共聚而成，其环状非极性重复单元结构赋予材料极低的介电损耗与吸水性[18]。然而，较高的单体成本、较低的拉伸强度及玻璃化转变温度，限制了其实际应用的推广。空气作为一种理想的介电材料，其介电常数接近真空，多孔结构的MPI材料已被证实具备优异的介电性能，并已有多种制备方法见诸报道[13,19-20]。然而，多孔结构不可避免地带来机械强度下降、耐高压性能减弱等问题，同时，该类特殊结构对下游企业的生产工艺也提出了更高要求，应用范围受限。
3　结束语
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5G/6G通信技术对信号传输速率和完整性的要求日益严苛，驱使FPC必须采用低Dk/Df的先进介质材料以降低信号损耗。当前高频FPC材料领域呈现出“MPI主导现实应用，LCP代表性能方向”的格局。MPI以其优异的综合性能和成熟的产业链占据市场主流，而LCP尽管性能顶尖，但受限于成本与工艺难度，应用范围相对专一。未来的发展将集中于进一步优化MPI的综合性能、突破LCP的原材料与制造瓶颈、开发非氟环保替代材料，以及解决高频纯胶膜与基材的工艺兼容性问题，以共同推动下一代高速通信电子产品的演进。

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2026年第59卷第6期
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doi: 10.16790/j.cnki.1009-9239.im.2026.06.007
  • 接收时间：2025-10-16
  • 首发时间：2026-09-10
  • 出版时间：2026-06-20
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  • 收稿日期：2025-10-16
  • 修回日期：2025-12-11
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    盐城维信电子有限公司，江苏　盐城　224000
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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