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Article(id=1209928456289260037, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1209928452547933122, articleNumber=null, orderNo=null, doi=10.16790/j.cnki.1009-9239.im.2024.06.003, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1649952000000, receivedDateStr=2022-04-15, revisedDate=1653580800000, revisedDateStr=2022-05-27, acceptedDate=null, acceptedDateStr=null, onlineDate=1766399023362, onlineDateStr=2025-12-22, pubDate=1718812800000, pubDateStr=2024-06-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1766399023362, onlineIssueDateStr=2025-12-22, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1766399023362, creator=13701087609, updateTime=1766399023362, updator=13701087609, issue=Issue{id=1209928452547933122, tenantId=1146029695717560320, journalId=1149653034449285133, year='2024', volume='57', issue='6', pageStart='1', pageEnd='120', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1766399022471, creator=13701087609, updateTime=1766563931405, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1210620130816561673, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1209928452547933122, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1210620130816561674, tenantId=1146029695717560320, journalId=1149653034449285133, issueId=1209928452547933122, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=17, endPage=22, ext={EN=ArticleExt(id=1209928456582861320, articleId=1209928456289260037, tenantId=1146029695717560320, journalId=1149653034449285133, language=EN, title=Thermal conductive and insulating epoxy composites filled with imidazole-silver modified BN, columnId=1190369066675179686, journalTitle=Insulating Materials, columnName=Material Research, runingTitle=null, highlight=null, articleAbstract=

Epoxy resin (EP) has been widely applied in electrical insulating materials, but with a low thermal conductivity, it cannot meet the requirement of heat dissipation in modern electrical equipment with high-power density. In this paper, silver acetate (AgAc) and 2-ethyl-4-methylimidazole (2E4MI) complex was deposited on boron nitride (BN) surface to prepare imidazole-silver modified BN hybrid materials (Ag(2E4MI)2Ac@BN), then Ag(2E4MI)2Ac@BN was filled in EP to prepare Ag(2E4MI)2Ac@BN/EP composites,and its thermal conductivity was studied. The results show that when the volume fraction of filler is 20%, the thermal conductivity of Ag(2E4MI)2Ac@BN/EP composites is 1.72 W/(m·K), which is 79.2% higher than that of BN/EP composites (0.96 W/(m·K)). The results of Monte Carlo simulation show that in the EP matrix, the thermal contact resistance (Rc) of Ag(2E4MI)2Ac@BN is 2.7×106 K/W, which is lower than the that of BN (Rc=5.5×106 K/W). In comparison with BN/EP composites, Ag(2E4MI)2Ac@BN/EP composites exhibit higher tensile strength and dielectric loss tangent (tanδ), lower dielectric strength and volume resistivity, while maintain good electrical insulating properties.

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环氧树脂（EP）已经广泛应用于电气绝缘材料，但其导热系数较低，越来越难以适应现代高功率密度电气设备的散热需求。本文在氮化硼（BN）表面沉积醋酸银（AgAc）和2-乙基-4-甲基咪唑（2E4MI）络合物，制备咪唑-银修饰BN杂化材料（Ag(2E4MI)2Ac@BN），用其填充EP制得Ag(2E4MI)2Ac@BN/EP复合材料，随后研究其导热性能。结果表明：当填料体积分数为20%时，Ag(2E4MI)2Ac@BN/EP复合材料的导热系数为1.72 W/(m·K)，比BN/EP复合材料的导热系数（0.96 W/(m·K)）提高了79.2%。Monte Carlo法模拟表明：在EP基体中，Ag(2E4MI)2Ac@BN的接触热阻Rc=2.7×106 K/W，低于BN的Rc（5.5×106 K/W）。与BN/EP复合材料相比，Ag(2E4MI)2Ac@BN/EP复合材料的拉伸强度及介质损耗因数（tanδ）增加，电气强度及体积电阻率降低，但仍保持较高电绝缘性能。

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杨李懿（1991-），男（汉族），浙江嘉兴人，高级工程师，主要从事高分子材料，胶黏剂合成改性工作；

汪蔚（1971-），男（汉族），安徽黄山人，教授，主要从事聚合物基复合材料的研究。

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杨李懿（1991-），男（汉族），浙江嘉兴人，高级工程师，主要从事高分子材料，胶黏剂合成改性工作；

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杨李懿（1991-），男（汉族），浙江嘉兴人，高级工程师，主要从事高分子材料，胶黏剂合成改性工作；

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汪蔚（1971-），男（汉族），安徽黄山人，教授，主要从事聚合物基复合材料的研究。

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汪蔚（1971-），男（汉族），安徽黄山人，教授，主要从事聚合物基复合材料的研究。

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Vf /%拉伸强度/MPa
BN/EPAg(2E4MI)2Ac@BN/EP
041.2741.27
440.3142.84
1240.0146.65
2042.3252.62
), ArticleFig(id=1217749114834571352, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1209928456289260037, language=CN, label=表1, caption=

填料体积分数对BN/EP和Ag(2E4MI)2Ac@BN/EP拉伸强度的影响

, figureFileSmall=null, figureFileBig=null, tableContent=
Vf /%拉伸强度/MPa
BN/EPAg(2E4MI)2Ac@BN/EP
041.2741.27
440.3142.84
1240.0146.65
2042.3252.62
), ArticleFig(id=1217749114901680220, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1209928456289260037, language=EN, label=Tab.2, caption=Effects of filler volume fraction on the electrical properties of BN/EP and Ag(2E4MI)2Ac@BN/EP, figureFileSmall=null, figureFileBig=null, tableContent=
Vf /%BN/EPAg(2E4MI)2Ac@BN/EP
体积电阻率/(Ω·m)电气强度/(kV/mm)tanδ体积电阻率/(Ω·m)电气强度/(kV/mm)tanδ
04.1×101537.64.56×10-34.1×101537.64.56×10-3
43.6×101539.44.98×10-37.5×101436.12.07×10-3
121.1×101540.55.22×10-32.4×101431.41.13×10-3
202.2×101538.34.75×10-38.4×101329.50.82×10-3
), ArticleFig(id=1217749114981371998, tenantId=1146029695717560320, journalId=1149653034449285133, articleId=1209928456289260037, language=CN, label=表2, caption=

填料体积分数对BN/EP和Ag(2E4MI)2Ac@BN/EP电性能的影响

, figureFileSmall=null, figureFileBig=null, tableContent=
Vf /%BN/EPAg(2E4MI)2Ac@BN/EP
体积电阻率/(Ω·m)电气强度/(kV/mm)tanδ体积电阻率/(Ω·m)电气强度/(kV/mm)tanδ
04.1×101537.64.56×10-34.1×101537.64.56×10-3
43.6×101539.44.98×10-37.5×101436.12.07×10-3
121.1×101540.55.22×10-32.4×101431.41.13×10-3
202.2×101538.34.75×10-38.4×101329.50.82×10-3
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咪唑-银修饰BN填充环氧树脂导热绝缘复合材料
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杨李懿 1, 2 , 葛凡 2 , 汪蔚 1 , 李艳飞 2 , 马苗 2 , 冉涛 2
绝缘材料 | 材料研究 2024,57(6): 17-22
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绝缘材料 | 材料研究 2024, 57(6): 17-22
咪唑-银修饰BN填充环氧树脂导热绝缘复合材料
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杨李懿1, 2, 葛凡2, 汪蔚1, 李艳飞2, 马苗2, 冉涛2
作者信息
  • 1嘉兴大学，浙江 嘉兴 314001
  • 2浙江荣泰科技企业有限公司，浙江 嘉兴 314007

    • 杨李懿（1991-），男（汉族），浙江嘉兴人，高级工程师，主要从事高分子材料，胶黏剂合成改性工作；

    汪蔚（1971-），男（汉族），安徽黄山人，教授，主要从事聚合物基复合材料的研究。

Thermal conductive and insulating epoxy composites filled with imidazole-silver modified BN
Liyi YANG1, 2, Fan GE2, Wei WANG1, Yanfei LI2, Miao MA2, Tao RAN2
Affiliations
  • 1Jiaxing University, Jiaxing 314001, China
  • 2Zhejiang Rongtai Technical Industry Co., Ltd., Jiaxing 314007, China
出版时间: 2024-06-20 doi: 10.16790/j.cnki.1009-9239.im.2024.06.003
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摘要
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环氧树脂（EP）已经广泛应用于电气绝缘材料，但其导热系数较低，越来越难以适应现代高功率密度电气设备的散热需求。本文在氮化硼（BN）表面沉积醋酸银（AgAc）和2-乙基-4-甲基咪唑（2E4MI）络合物，制备咪唑-银修饰BN杂化材料（Ag(2E4MI)2Ac@BN），用其填充EP制得Ag(2E4MI)2Ac@BN/EP复合材料，随后研究其导热性能。结果表明：当填料体积分数为20%时，Ag(2E4MI)2Ac@BN/EP复合材料的导热系数为1.72 W/(m·K)，比BN/EP复合材料的导热系数（0.96 W/(m·K)）提高了79.2%。Monte Carlo法模拟表明：在EP基体中，Ag(2E4MI)2Ac@BN的接触热阻Rc=2.7×106 K/W，低于BN的Rc（5.5×106 K/W）。与BN/EP复合材料相比，Ag(2E4MI)2Ac@BN/EP复合材料的拉伸强度及介质损耗因数（tanδ）增加，电气强度及体积电阻率降低，但仍保持较高电绝缘性能。

复合材料  /  环氧树脂  /  BN  /  导热  /  绝缘

Epoxy resin (EP) has been widely applied in electrical insulating materials, but with a low thermal conductivity, it cannot meet the requirement of heat dissipation in modern electrical equipment with high-power density. In this paper, silver acetate (AgAc) and 2-ethyl-4-methylimidazole (2E4MI) complex was deposited on boron nitride (BN) surface to prepare imidazole-silver modified BN hybrid materials (Ag(2E4MI)2Ac@BN), then Ag(2E4MI)2Ac@BN was filled in EP to prepare Ag(2E4MI)2Ac@BN/EP composites,and its thermal conductivity was studied. The results show that when the volume fraction of filler is 20%, the thermal conductivity of Ag(2E4MI)2Ac@BN/EP composites is 1.72 W/(m·K), which is 79.2% higher than that of BN/EP composites (0.96 W/(m·K)). The results of Monte Carlo simulation show that in the EP matrix, the thermal contact resistance (Rc) of Ag(2E4MI)2Ac@BN is 2.7×106 K/W, which is lower than the that of BN (Rc=5.5×106 K/W). In comparison with BN/EP composites, Ag(2E4MI)2Ac@BN/EP composites exhibit higher tensile strength and dielectric loss tangent (tanδ), lower dielectric strength and volume resistivity, while maintain good electrical insulating properties.

composites  /  epoxy resin  /  BN  /  thermal conductive  /  electrical insulation
杨李懿, 葛凡, 汪蔚, 李艳飞, 马苗, 冉涛. 咪唑-银修饰BN填充环氧树脂导热绝缘复合材料. 绝缘材料, 2024 , 57 (6) : 17 -22 . DOI: 10.16790/j.cnki.1009-9239.im.2024.06.003
Liyi YANG, Fan GE, Wei WANG, Yanfei LI, Miao MA, Tao RAN. Thermal conductive and insulating epoxy composites filled with imidazole-silver modified BN[J]. Insulating Materials, 2024 , 57 (6) : 17 -22 . DOI: 10.16790/j.cnki.1009-9239.im.2024.06.003
正文
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0 引言
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随着现代电气设备向高功率密度、高过载能力等方向发展，设备内部有效散热空间不足而发热量增加，如果这些热量无法及时向外传递，将加速绝缘老化，严重影响设备的运行效率、可靠性和使用寿命[1-3]。提高绝缘材料的导热性能是解决现代电气设备热管理问题的最有效途径[4-6]。对大型永磁同步牵引电机和发电机的仿真分析及实践证明，当绝缘材料的导热系数由0.23 W/(m·K)增加到0.44 W/(m·K)时，电机温升可降低约11℃，使用寿命延长近1倍[7-8]。
填充型导热绝缘环氧树脂（EP）材料加工成型方便、结构性能可按需设计、易于工业化生产，在电气绝缘材料中的应用最为广泛。常用填料主要有氮化硼（BN）、氮化铝（AlN）、氧化铝（Al2O3）、氧化镁（MgO）等[9-13]。与其他绝缘填料相比，BN具有导热系数（280 W/(m·K)）高、介质损耗低等优点，是制备高导热绝缘树脂的理想填料。然而，BN/EP复合材料的导热系数相对EP的提高却十分有限，例如：填料体积分数为25%的BN/EP复合材料导热系数为0.90～1.00 W/(m·K)，还不到BN的0.36%，没有发挥BN的高导热系数优势[14-16]。这主要是由于采用简单共混复合的方法，BN作为分散相被树脂基体所包围，彼此间相互接触概率低，不能形成有效导热通路。另一方面，虽然提高BN含量可以增加彼此间相互接触的概率，但是BN之间不可避免地存在气隙，形成很大的接触热阻从而阻碍热量传递。
本文在BN微米片表面沉积醋酸银（AgAc）和2-乙基-4-甲基咪唑（2E4MI）络合物，制备咪唑-银修饰BN杂化材料Ag(2E4MI)2Ac@BN，用其填充EP制备Ag(2E4MI)2Ac@BN/EP复合材料。在加热条件下，沉积在BN表面的Ag(2E4MI)2Ac分解产生2E4MI，引发EP的固化反应，与此同时，Ag+被还原成纳米Ag，并熔融烧结与BN相互连接形成导热通路，以此提高复合材料的导热性能。
1 实验
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1.1 主要原材料
环氧树脂：凤凰牌E-51，南通星辰合成材料有限公司；氮化硼（BN），片径为3～5 µm，厚度约为300 nm，丹东市化工研究所有限责任公司；醋酸银（AgAc）、2-乙基-4-甲基咪唑（2E4MI）和二氯甲烷（CH2Cl2），均为分析纯，阿拉丁生化科技股份有限公司。
1.2 Ag(2E4MI)2Ac@BN杂化材料的制备
首先，按文献[17]所述制备AgAc和2E4MI络合物（Ag(2E4MI)2Ac），即将10 mmol 2E4MI、5 mmol AgAc和100 mL CH2Cl2加入烧瓶中，磁力搅拌1 h直至完全溶解，形成淡黄色透明的Ag(2E4MI)2Ac溶液。然后根据复合材料填充量要求加入BN，继续搅拌1 h，再将分散液在室温下陈化24 h后，真空干燥24 h以完全去除CH2Cl2，即得Ag(2E4MI)2Ac@BN杂化材料，制备过程如图1(a)所示。
1.3 Ag(2E4MI)2Ac@BN/EP复合材料的制备
将Ag(2E4MI)2Ac@BN与EP混合，其中EP与Ag(2E4MI)2Ac的质量比保持为100∶12.5。通过改变Ag(2E4MI)2Ac@BN中BN的含量得到不同填料含量的复合材料。将混合物经三辊机混合均匀，在80℃下真空脱泡0.5～1 h，然后在150℃下固化2 h，即得Ag(2E4MI)2Ac@BN/EP复合材料，制备过程如图1(b)所示。按同样的方法，制备填料体积含量相同的BN/EP复合材料作为对比。
1.4 测试与表征
采用红外光谱仪（NEXUS670型，美国Nicolet公司）测试BN表面沉积Ag(2E4MI)2Ac前后的傅里叶变换红外吸收光谱（FTIR），KBr压片，扫描范围为4 000～400 cm-1，分辨率为2 cm-1。采用X射线光电子能谱仪（ESCALAB250Xi型，美国Thermo Fisher Scientific公司）测试X-射线光电子能谱（XPS）。采用X射线衍射仪（D8 ADVANCE型，德国Bruker公司）测试X射线衍射谱（XRD），粉末衍射法，测试条件为铜靶，电压为40 kV，电流为30 mA，扫描角度为10°～90°。采用场发射扫描电子显微镜（JSM-5600LV型，日本电子光学公司）观察分析样品微观形貌，样品表面喷金处理。采用导热系数仪（TC3000E型，西安夏溪电子科技有限公司），在室温下通过 热线法测试复合材料的导热系数。按照GB/T 1040.1—2018[18]测试复合材料的拉伸强度；按照GB/T 1410—2006[19]和GB/T 1408.1—2016[20]分别测试复合材料的的体积电阻率和电气强度；按照GB/T 1409—2006[21]测试复合材料的介质损耗因数（tanδ），外加电压、频率分别为220 V、50 Hz。
2 结果与讨论
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2.1 结构分析
图2为BN和Ag(2E4MI)2Ac@BN的XRD谱图，其中2θ为76°、55°、42°、27°的峰分别对应BN的(110)、(004)、(100)、(002)晶面[22]。与BN相比，Ag(2E4MI)2Ac@BN在10°～28°处出现若干峰，这些峰为层状结构Ag(2E4MI)2Ac的特征衍射峰[23-24]。
图3为BN和Ag(2E4MI)2Ac@BN的XPS全谱及Ag 3d高分辨率窄谱。图3中190.8 eV和398.4 eV处分别为B 1s和N 1s的峰，Ag(2E4MI)2Ac@BN在285.0、368.2、374.2、533.5、573.6 eV处出现了 C 1s、Ag 3d5/2、Ag 3d3/2、O 1s、Ag 3p峰。由XPS计算得到样品的元素组成，BN不含C、O和Ag元素， Ag(2E4MI)2Ac@BN的C、O和Ag元素质量分数分别为14.44%、2.74%和9.25%。
图4为BN和Ag(2E4MI)2Ac@BN的FTIR谱图。图中1 390 cm-1和800 cm-1处的峰分别对应 B-N-B的面内振动和B-N的面外振动吸收峰，1 404 cm-1和1 575 cm-1处的两个宽峰则为Ag(2E4MZ)2Ac络合物的特征吸收峰[25]。
图5为BN和Ag(2E4MI)2Ac@BN的TEM图像。从图5可以看出，BN为半透明，Ag(2E4MI)2Ac @BN表面有黑色吸附层。
图6为BN/EP和Ag(2E4MI)2Ac@BN/EP复合材料（填料体积分数均为20%）的SEM图像。从图6可以看出，在BN/EP复合材料中，BN之间存在明显空隙，而Ag(2E4MI)2Ac@BN/EP复合材料中BN之间有许多短纤维相连，短纤维的直径和长度分别为100～200 nm和300～600 nm。
2.2 导热性能分析
图7为BN/EP和Ag(2E4MI)2Ac@BN/EP复合材料的导热系数与填料体积分数的关系。从图7可以看出，相同填料体积分数下，Ag(2E4MI)2Ac@BN/EP的导热系数明显大于BN/EP的导热系数。当填料体积分数为20%时，Ag(2E4MI)2Ac@BN/EP的导热系数为1.72 W/(m·K)，比BN/EP的导热系数（0.96 W/(m·K)）提高了79.2%。
M FOYGEL等[26]采用Monte Carlo法模拟分析，提出片状填料填充树脂基复合材料的导热系数理论计算公式，如式（1）所示。
λ=λ0(Vf-Vc)t
式（1）中：λ为复合材料的导热系数；λ0为指前因子；Vf为填料体积分数；Vc为临界体积分数；t为导热系数指数，该值取决于填料的直径与厚度之比（α）。根据图6观察分析结果及产品资料，本研究所用BN的α≈13.3。对于该类α>>1的填料，t≈1.8，Vc≈0.60/α≈0.045。
BN/EP和Ag(2E4MI)2Ac@BN/EP复合材料导热系数的Foygel模拟结果见图8。
从图8可以看出，模拟结果与实验结果相差较大。这是由于Foygel模拟只适合于Vf >Vc，即填料之间开始发生接触时的情况，考虑到Vf ≤Vc时复合材料的导热系数，提出修正公式如式（2）所示[14]。
λ=λ0(Vf-Vc)t+λc
式（2）中：λc为填料含量为Vc时复合材料的导热系数。根据实测，BN/EP和Ag(2E4MI)2Ac@BN/EP的λc分别为0.22 W/(m·K)和0.26 W/(m·K)。BN/EP和Ag(2E4MI)2Ac@BN/EP复合材料导热系数的修正型Foygel模拟结果见图9，该结果与实验结果基本一致。填料间的接触热阻Rc如式（3）所示。
Rc=(λ0LVct)-1
式（3）中，L为填料片径。
通过观察图6，取填料片径平均值为4 μm，根据图9计算得到BN/EP和Ag(2E4MI)2Ac@BN/EP的λ0分别为12.1 W/(m·K)和24.6 W/(m·K)。因此，按式（3）可计算出Ag(2E4MI)2Ac@BN在环氧树脂基体中的接触热阻Rc为2.7×106 K/W，BN在环氧树脂基体中的Rc为5.5×106 K/W。前者较后者低，这可能是由于在固化过程中，Ag(2E4MI)2Ac@BN表面的Ag+被还原成纳米银并与BN相互连接，导致接触热阻降低。
2.3 力学性能
表1为BN/EP和Ag(2E4MI)2Ac@BN/EP复合材料拉伸强度与填料体积分数Vf的关系。从表1可以看出，随着Vf的增加，BN/EP复合材料的拉伸强度基本不变，而Ag(2E4MI)2Ac@BN/EP复合材料的拉伸强度增大。这可能是由于BN和纳米银纤维形成的网络结构（如图6所示）能起到传递应力，阻止裂纹扩张的作用。
2.4 电性能分析
表2为BN/EP和Ag(2E4MI)2Ac@BN/EP复合材料电性能与填料体积分数Vf的关系。从表2可以看出，BN/EP复合材料的体积电阻率、电气强度和介质损耗因数（tanδ）基本不受Vf的影响。随着Vf的增加，Ag(2E4MI)2Ac@BN/EP复合材料的tanδ增加，电气强度和体积电阻率下降。这可能是由于复合材料中少量的金属Ag导体会导致极化和漏导损耗。当Vf=20%时，Ag(2E4MI)2Ac @BN/EP的体积电阻率为8.4×1013 Ω·m，仍保持电绝缘性（体积电阻率≥1011 Ω·m）。通常，导电粒子填充树脂基复合材料中，当导电粒子开始相互接触，形成逾渗网络时，体系的电阻率会急剧下降，甚至由绝缘体向半导体或导体转变。在本研究中，纳米Ag的含量很低，不足以形成导电逾渗网络。另外，电绝缘性基体及BN产生的隧穿势垒也阻碍了电子传递，使得 Ag(2E4MI)2Ac@BN/EP复合材料仍保持较高的电绝缘性能。
3 结论
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（1）在氮化硼（BN）表面沉积2-乙基-4-甲基咪唑（2E4MI）和醋酸银（AgAc）络合物，制备了咪唑-银修饰BN杂化材料Ag(2E4MI)2Ac@BN，用其填充EP制备了导热绝缘环氧树脂复合材料。当填料体积分数为20%时，Ag(2E4MI)2Ac@BN/EP复合材料的导热系数为1.72 W/(m·K)，比BN/EP复合材料的导热系数（0.96 W/(m·K)）提高了79.2%。
（2）修正型Monte Carlo法模拟分析结果表明，Ag(2E4MI)2Ac@BN在环氧树脂基体中的接触热阻为2.7×106 K/W，低于BN在环氧基体中的接触热阻（5.5×106 K/W）。
（3）与BN/EP相比，Ag(2E4MI)2Ac@BN/EP复合材料的拉伸强度和介质损耗增加，电气强度和体积电阻率下降。当填料体积分数为20%时，Ag(2E4MI)2Ac@BN/EP的体积电阻率为1013 Ω·m，低于BN/EP的体积电阻率（1015 Ω·m），但仍保持较高的电绝缘性能。
基金
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  • 浙江省基础公益研究计划项目(LGG19E030006)
文献
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2024年第57卷第6期
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doi: 10.16790/j.cnki.1009-9239.im.2024.06.003
  • 接收时间：2022-04-15
  • 首发时间：2025-12-22
  • 出版时间：2024-06-20
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  • 收稿日期：2022-04-15
  • 修回日期：2022-05-27
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浙江省基础公益研究计划项目(LGG19E030006)
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    1嘉兴大学，浙江 嘉兴 314001
    2浙江荣泰科技企业有限公司，浙江 嘉兴 314007
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2种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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