电源学报

基于改进维纳滤波反卷积的SiC器件瞬态热结构函数建模研究

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李龙女 ¹ , 刘展鹏 ¹ , 朱高嘉 ¹ , 章松茂 ¹^,² , 梅云辉中国电源学会高级会员 ¹

电源学报 | 功率半导体器件与驱动 2026,24(1): 1-9

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电源学报 |功率半导体器件与驱动 2026 , 24 (1) : 1 -9

基于改进维纳滤波反卷积的SiC器件瞬态热结构函数建模研究

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李龙女¹, 刘展鹏¹, 朱高嘉¹, 章松茂¹^,², 梅云辉中国电源学会高级会员¹

作者信息

^1.天津工业大学电气工程学院，天津　300387

^2.中国电子产品可靠性与环境试验研究所电子元器件可靠性物理及其应用技术国家级重点实验室，广州　511370

通讯作者:

梅云辉（1985—　），男，中国电源学会高级会员，通信作者，博士，教授。研究方向：电力电子器件高可靠封装与材料。E-mail：meiyunhui@tiangong.edu.cn。

作者简介:

李龙女（1988—　），女，博士，副教授。研究方向：电气装备多物理场建模与优化。E-mail：lilongnv@tiangong.edu.cn。

刘展鹏（1999—　），男，硕士研究生。研究方向：功率器件热稳定性分析。E-mail：email0257@163.com。

朱高嘉（1989—　），男，博士，副教授。研究方向：电气装备多物理场建模与优化。E-mail：zhugaojia@tiangong.edu.cn。

章松茂（1999—　），男，硕士。研究方向：功率半导体器件的封装可靠性及寿命评估。E-mail：zhangsongmao0804@163.com。

Research on Transient Thermal Structure Function Modeling of SiC Devices Based on Improved Wiener Filtering Deconvolution

Longnü LI¹, Zhanpeng LIU¹, Gaojia ZHU¹, Songmao ZHANG¹^,², Yunhui MEI Senior Member, CPSS¹

Affiliations

^1.School of Electrical Engineering, Tiangong University, Tianjin 300387, China

^2.The Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China

出版时间: 2026-01-30 doi: 10.13234/j.issn.2095-2805.2026.1.1

文章导航

摘要

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碳化硅（SiC）功率器件的热特性建模是其设计与开发中的关键。结构函数法是表征器件热特性的重要手段，其核心在于通过反卷积算法得到输入数据的时间常数谱。然而，在实际测试中，环境噪声的影响难以避免，这对结构函数的反卷积算法提出了更高的挑战。为此，提出1种基于改进维纳滤波的反卷积结构函数算法，有效解决瞬态热分析过程中测量数据的噪声问题。首先，提出1种基于维纳滤波反卷积的结构函数模型，并通过TDIM-Master基准问题进行分析，验证了算法的有效性。其次，针对基准问题加载不同量级的噪声，以探索不同噪声条件下时间常数谱的信号质量和峰值热阻，并与常规算法进行对比，验证改进方法在处理噪声问题时的准确性和优越性。最后，基于2颗不同规格的SiC功率器件，测量在有无导热硅脂下的瞬态热阻，并进行结构函数分析，验证所提算法在真实测量环境下的稳定性和适用性。

关键词

结构函数 / SiC功率器件 / 瞬态热特性 / 维纳滤波反卷积 / 噪声抑制

Abstract

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The thermal characteristic modeling of silicon carbide (SiC) power devices is a key aspect in their design and development. The structure function method is crucial for characterizing the devices’ thermal characteristics, focusing on acquiring the time-constant spectrum of input data via deconvolution algorithms. However, the environmental noise inevitably affects actual tests, thereby demanding more sophisticated deconvolution algorithms for the structure function. Therefore, a deconvolution structure function algorithm based on improved Wiener filtering is proposed, effectively addressing the noise problem in the measurement data during the transient thermal analysis. First, a structure function model based on Wiener filtering deconvolution is put forward, and the algorithm’s effectiveness is validated through analyzing the TDIM-Master benchmark problem. Second, different levels of noise are added to the benchmark problem to explore the signal quality and peak thermal resistance of the time-constant spectrum across various noise conditions. The accuracy and superiority of the improved method when dealing with noises are verified through a comparison with the conventional algorithm. Finally, the transient thermal resistance of two different types of SiC power devices were measured under conditions with or without thermal silicone grease, and the structure function analysis was also performed, thus verifying the stability and applicability of the proposed algorithm under real measurement environment.

Key words

Structure function / SiC power device / transient thermal characteristic / Wiener filtering deconvolution / noise suppression

引用本文

李龙女, 刘展鹏, 朱高嘉, 章松茂, 梅云辉中国电源学会高级会员. 基于改进维纳滤波反卷积的SiC器件瞬态热结构函数建模研究. 电源学报, 2026 , 24 (1) : 1 -9 . DOI: 10.13234/j.issn.2095-2805.2026.1.1

Longnü LI, Zhanpeng LIU, Gaojia ZHU, Songmao ZHANG, Yunhui MEI. Research on Transient Thermal Structure Function Modeling of SiC Devices Based on Improved Wiener Filtering Deconvolution[J]. Journal of Power Supply, 2026 , 24 (1) : 1 -9 . DOI: 10.13234/j.issn.2095-2805.2026.1.1

基金

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工程电介质及其应用教育部重点实验室（哈尔滨理工大学）资助项目(KFZ202603)
国家自然科学基金资助项目(52177189)
教育部“春晖计划”国际合作科研资助项目(HZKY20220604)
天津市科技计划项目京津冀基础研究合作专项(24JCZXJC00130)

参考文献

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2026年第24卷第1期

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文章信息

doi: 10.13234/j.issn.2095-2805.2026.1.1

接收时间：2025-01-10
首发时间：2026-10-26
出版时间：2026-01-30

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出版历史

收稿日期：2025-01-10
修回日期：2025-03-08
录用日期：2025-03-20

基金

Key Laboratory of Engineering Dielectrics and Its Application (Harbin University of Science and Technology), Ministry of Education(KFZ202603)

工程电介质及其应用教育部重点实验室（哈尔滨理工大学）资助项目(KFZ202603)

National Natural Science Foundation of China(52177189)

国家自然科学基金资助项目(52177189)

“Chunhui Plan” Collaborative Research Project of Ministry of Education of China(HZKY20220604)

教育部“春晖计划”国际合作科研资助项目(HZKY20220604)

Tianjin Municipal Science and Technology Bureau(24JCZXJC00130)

天津市科技计划项目京津冀基础研究合作专项(24JCZXJC00130)

作者信息

^1.天津工业大学电气工程学院，天津　300387

^2.中国电子产品可靠性与环境试验研究所电子元器件可靠性物理及其应用技术国家级重点实验室，广州　511370

通讯作者:

梅云辉（1985—　），男，中国电源学会高级会员，通信作者，博士，教授。研究方向：电力电子器件高可靠封装与材料。E-mail：meiyunhui@tiangong.edu.cn。

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https://castjournals.cast.org.cn/joweb/dyxb/CN/10.13234/j.issn.2095-2805.2026.1.1

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2种不同金属材料的力学参数

科 Family	属数 Number of genus	种数 Number of species	占总种数比例 Percentage of total species (%)	属 Genus	种数 Number of species	占总种数比例 Percentage of total species (%)
鹅膏菌科Amanitaceae	2	11	5.26	鹅膏菌属 Amanita	10	4.78
小菇科 Mycenaceae	2	12	5.74	丝盖伞属 Inocybe	5	2.39
多孔菌科 Polyporaceae	8	14	6.70	蜡蘑属 Laccaria	5	2.39
红菇科 Russulaceae	3	23	11.00	小皮伞属 Marasmius	6	2.87
				小菇属 Mycena	11	5.26
				光柄菇属 Pluteus	5	2.39
				红菇属 Russula	17	8.13
				栓菌属 Trametes	5	2.39

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