首页 期刊 论文 学科刊群 资讯 加盟 关于
EN
image
Article(id=1322276143907061843, tenantId=1146029695717560320, journalId=1220038251117760515, issueId=1322276007797702769, articleNumber=null, orderNo=null, doi=10.11868/j.issn.1001-4381.2024.000864, pmid=null, cstr=32421.14.j.issn.1001-4381.2024.000864, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1735056000000, receivedDateStr=2024-12-25, revisedDate=null, revisedDateStr=null, acceptedDate=1737648000000, acceptedDateStr=2025-01-24, onlineDate=1793184799410, onlineDateStr=2026-10-28, pubDate=1789833600000, pubDateStr=2026-09-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1793184799410, onlineIssueDateStr=2026-10-28, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1793184799410, creator=13701087609, updateTime=1793184799410, updator=13701087609, issue=Issue{id=1322276007797702769, tenantId=1146029695717560320, journalId=1220038251117760515, year='2026', volume='54', issue='9', pageStart='1', pageEnd='252', issueExtLink='null', onlineDate='null', pubDate='1789833600000', pubDateStr='2026-09-20', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=1, specialIssue=0, createTime=1793184766959, creator='13701087609', updateTime=1793185369041, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1322278533200728093, tenantId=1146029695717560320, journalId=1220038251117760515, issueId=1322276007797702769, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1322278533200728094, tenantId=1146029695717560320, journalId=1220038251117760515, issueId=1322276007797702769, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=91, endPage=98, ext={EN=ArticleExt(id=1322276144095805524, articleId=1322276143907061843, tenantId=1146029695717560320, journalId=1220038251117760515, language=EN, title=Preparation and microstructure evolution of AuSn20 solder ball based on pulsated orifice ejection method, columnId=1220689384450478826, journalTitle=Journal of Materials Engineering, columnName=RESEARCH ARTICLE, runingTitle=null, highlight=null, articleAbstract=

In the field of electronic packaging， Au-Sn eutectic alloy （AuSn20） serves as key solder materials， and its preparation process directly affects the packaging performance and reliability. However， due to the brittleness of AuSn20， there is currently no efficient method for the preparation of AuSn20 solder balls. This study uses pulsated orifice ejection method to achieve the high precision and consistency of the on-demand preparation of AuSn20 solder balls. The results show that various specifications of AuSn20 solder balls are prepared under optimal process conditions， with the smallest specification being 50 μm， and the maximum standard deviation of the target particle size being 1.58 μm， significantly improving the preparation accuracy. Microstructural analysis reveals that the solder balls are mainly composed of δ-AuSn and ζ'-Au5Sn eutectic phases， with no abnormal new phases observed. After reflow treatment， the composition distribution inside the solder ball tends to be uniform.Interface reaction studies show that due to the synergistic diffusion of Ni atoms in the diffusion barrier layer， a complex intermetallic compounds （Au，Ni）Sn and （Au，Ni）3Sn2 are formed at the interface joint. The AuSn20 solder balls prepared in this study not only achieve precise control of particle size and consistent thermal history， but also show excellent interface stability and structural integrity under simulated service conditions， opening up new application avenues for Au-Sn alloy brazing materials in advanced electronic packaging.

, authors=Wei DONG, Fengyue GE, Fumin XU, authorsList=Wei DONG, Fengyue GE, Fumin XU, authorCompany=null, correspAuthors=Wei DONG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1322276147224756331, articleId=1322276143907061843, tenantId=1146029695717560320, journalId=1220038251117760515, language=CN, title=脉冲微孔喷射法制备AuSn20焊球及组织演变行为, columnId=1220689384622445292, journalTitle=材料工程, columnName=研究论文, runingTitle=null, highlight=null, articleAbstract=

在电子封装领域，金锡共晶合金（AuSn20）作为关键焊接材料，其制备工艺直接影响封装性能和可靠性。然而，受限于AuSn20合金的脆性，目前AuSn20焊球尚无高效的制备方法。本研究采用脉冲微孔喷射技术实现了AuSn20焊球的高精度、高一致性的按需制备。结果表明，在最优工艺条件下制备了多种规格AuSn20焊球，最小规格为50 μm，目标粒径标准偏差最大为1.58 μm，显著提高了制备精度。微观组织分析揭示，焊球主要由δ-AuSn相和ζ'-Au5Sn相共晶组织构成，未观察到异常新相生成。回流处理后，焊球内部成分分布趋于均匀。研究发现，由于扩散阻挡层Ni原子的协同扩散，在界面接头处形成了（Au，Ni）Sn和（Au，Ni）3Sn2等金属间化合物。所制备的AuSn20焊球不仅实现了粒径精确可控和热历史一致性，且在模拟服役条件下表现出优异的界面稳定性和结构完整性，为金锡合金钎料在先进电子封装领域开辟了新的应用途径。

, authors=董伟, 葛凤跃, 许富民, authorsList=董伟, 葛凤跃, 许富民, authorCompany=null, correspAuthors=董伟, authorNote=null, correspAuthorsNote=
董伟（1965—），男，副教授，博士，主要从事单分散粉末制备及相关研究，联系地址：辽宁省大连市甘井子区凌工路2号大连理工大学新三束实验室220（116024），E-mail：
, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=pWX9HhZzJLYYHHlDp/8Rwg==, magXml=lViQAbW0jk2xw9yLTXuqzg==, pdfUrl=null, pdf=LSV5j7OFMnvo03wrQpbxlQ==, pdfFileSize=4814560, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=Y+BWh/DsJ3Ic2Da9Na7bDw==, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=A8LHIy2n2aGaGU91bQTHww==, mapNumber=null, fund=null)}, authors=[Author(id=1322276147799375984, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, orderNo=0, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=w-dong@dlut.edu.cn, emailSecond=null, emailThird=null, correspondingAuthor=1, authorType=1, ext={EN=AuthorExt(id=1322276147866484850, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147799375984, language=EN, stringName=Wei DONG, firstName=Wei, middleName=null, lastName=DONG, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1322276147929399411, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147799375984, language=CN, stringName=董伟, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=大连理工大学 材料科学与工程学院，辽宁 大连 116024, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])]), Author(id=1322276147988119669, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, orderNo=1, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1322276148126531703, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147988119669, language=EN, stringName=Fengyue GE, firstName=Fengyue, middleName=null, lastName=GE, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1322276148193640568, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147988119669, language=CN, stringName=葛凤跃, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=大连理工大学 材料科学与工程学院，辽宁 大连 116024, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])]), Author(id=1322276148269138042, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, orderNo=2, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1322276148336246908, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276148269138042, language=EN, stringName=Fumin XU, firstName=Fumin, middleName=null, lastName=XU, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1322276148407550077, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276148269138042, language=CN, stringName=许富民, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=大连理工大学 材料科学与工程学院，辽宁 大连 116024, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])])], keywords=[Keyword(id=1322276148508213374, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, orderNo=1, keyword=pulsated orifice ejection method), Keyword(id=1322276148566933631, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, orderNo=2, keyword=AuSn20 alloy), Keyword(id=1322276148625653888, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, orderNo=3, keyword=solder ball preparation), Keyword(id=1322276148684374145, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, orderNo=4, keyword=particle size control), Keyword(id=1322276148751483010, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, orderNo=1, keyword=脉冲微孔喷射法), Keyword(id=1322276148814397571, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, orderNo=2, keyword=AuSn20合金), Keyword(id=1322276148885700740, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, orderNo=3, keyword=焊球制备), Keyword(id=1322276148961198213, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, orderNo=4, keyword=粒径调控)], refs=[Reference(id=1322276151393894565, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2008, volume=46, issue=1, pageStart=75, pageEnd=82, url=null, language=null, rfNumber=[1], rfOrder=0, authorNames=Tan C W, Chan Y C, Leung B, journalName=Optics and Lasers in Engineering, refType=null, unstructuredReference=Tan C W， Chan Y C， Leung B，et al.Effects of soft beam energy on the microstructure of Pb37Sn，Au20Sn，and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application［J］.Optics and Lasers in Engineering，2008，46（1）：75-82., articleTitle=Effects of soft beam energy on the microstructure of Pb37Sn，Au20Sn，and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application, refAbstract=null), Reference(id=1322276151465197734, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2003, volume=15, issue=11, pageStart=1507, pageEnd=1509, url=null, language=null, rfNumber=[2], rfOrder=1, authorNames=Zhao J, Li L, Wang W M, journalName=IEEE Photonics Technology Letters, refType=null, unstructuredReference=Zhao J， Li L， Wang W M，et al.High-power and low-divergence 980-nm InGaAs-GaAsP-AlGaAs strain-compensated quantum-well diode laser grown by MOCVD［J］.IEEE Photonics Technology Letters，2003，15（11）：1507-1509., articleTitle=High-power and low-divergence 980-nm InGaAs-GaAsP-AlGaAs strain-compensated quantum-well diode laser grown by MOCVD, refAbstract=null), Reference(id=1322276151557472423, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=1993, volume=191, issue=1, pageStart=71, pageEnd=78, url=null, language=null, rfNumber=[3], rfOrder=2, authorNames=Ciulik J, Notis M R, journalName=Journal of Alloys and Compounds, refType=null, unstructuredReference=Ciulik J， Notis M R.The Au-Sn phase diagram［J］.Journal of Alloys and Compounds，1993，191（1）：71-78., articleTitle=The Au-Sn phase diagram, refAbstract=null), Reference(id=1322276151616192680, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2009, volume=476, issue=1/2, pageStart=138, pageEnd=141, url=null, language=null, rfNumber=[4], rfOrder=3, authorNames=Zhang G S, Jing H Y, Xu L Y, journalName=Journal of Alloys and Compounds, refType=null, unstructuredReference=Zhang G S， Jing H Y， Xu L Y，et al.Creep behavior of eutectic 80Au/20Sn solder alloy［J］.Journal of Alloys and Compounds，2009，476（1/2）：138-141., articleTitle=Creep behavior of eutectic 80Au/20Sn solder alloy, refAbstract=null), Reference(id=1322276151691690153, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2006, volume=417, issue=1/2, pageStart=143, pageEnd=148, url=null, language=null, rfNumber=[5], rfOrder=4, authorNames=Kim J, Lee C C, journalName=Materials Science and Engineering：A, refType=null, unstructuredReference=Kim J， Lee C C.Fluxless wafer bonding with Sn-rich Sn-Au dual-layer structure［J］.Materials Science and Engineering：A，2006，417（1/2）：143-148., articleTitle=Fluxless wafer bonding with Sn-rich Sn-Au dual-layer structure, refAbstract=null), Reference(id=1322276151758799018, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2005, volume=5, issue=8, pageStart=5, pageEnd=8, url=null, language=null, rfNumber=[6], rfOrder=5, authorNames=周涛, 汤姆·鲍勃, 马丁·奥德, journalName=电子与封装, refType=null, unstructuredReference=周涛，汤姆·鲍勃，马丁·奥德，等.金锡焊料及其在电子器件封装领域中的应用［J］.电子与封装，2005，5（8）：5-8., articleTitle=金锡焊料及其在电子器件封装领域中的应用, refAbstract=null), Reference(id=1322276151838490795, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2005, volume=5, issue=8, pageStart=5, pageEnd=8, url=null, language=null, rfNumber=[6], rfOrder=6, authorNames=Zhou T, Tom B, Martin O, journalName=Electronics & Packaging, refType=null, unstructuredReference=Zhou T， Tom B， Martin O，et al.An introduction to eutectic Au/Sn solder alloy and its preforms in microelectronics/optoelectronic packaging applications［J］.Electronics & Packaging，2005，5（8）：5-8., articleTitle=null, refAbstract=null), Reference(id=1322276151930765484, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2021, volume=31, issue=4, pageStart=82, pageEnd=87, url=null, language=null, rfNumber=[7], rfOrder=7, authorNames=朱盼星, 石生荷, 杨剑, journalName=粉末冶金工业, refType=null, unstructuredReference=朱盼星，石生荷，杨剑，等.气体雾化技术制备金属粉末研究综述［J］.粉末冶金工业，2021，31（4）：82-87., articleTitle=气体雾化技术制备金属粉末研究综述, refAbstract=null), Reference(id=1322276152002068653, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2021, volume=31, issue=4, pageStart=82, pageEnd=87, url=null, language=null, rfNumber=[7], rfOrder=8, authorNames=Zhu P X, Shi S H, Yang J, journalName=Powder Metallurgy Industry, refType=null, unstructuredReference=Zhu P X， Shi S H， Yang J，et al.Research progress on the gas atomization for producing metal powders［J］.Powder Metallurgy Industry，2021，31（4）：82-87., articleTitle=null, refAbstract=null), Reference(id=1322276152064983214, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2005, volume=24, issue=5, pageStart=21, pageEnd=23, url=null, language=null, rfNumber=[8], rfOrder=9, authorNames=刘海霞, 雷永平, 夏志东, journalName=电子元件与材料, refType=null, unstructuredReference=刘海霞，雷永平，夏志东，等.切丝重熔法制备的BGA焊球及其表面形貌［J］.电子元件与材料，2005，24（5）：21-23., articleTitle=切丝重熔法制备的BGA焊球及其表面形貌, refAbstract=null), Reference(id=1322276152132092079, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2005, volume=24, issue=5, pageStart=21, pageEnd=23, url=null, language=null, rfNumber=[8], rfOrder=10, authorNames=Liu H X, Lei Y P, Xia Z D, journalName=Electronic Components & Materials, refType=null, unstructuredReference=Liu H X， Lei Y P， Xia Z D，et al.Fabrication of solder balls by fine-wire cutting-remelting and its surface appearance［J］.Electronic Components & Materials，2005，24（5）：21-23., articleTitle=null, refAbstract=null), Reference(id=1322276152207589552, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2013, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[9], rfOrder=11, authorNames=Reinl S, journalName=null, refType=null, unstructuredReference=Reinl S. Diode lasers used in plastic welding and selective laser soldering-applications and products［C］∥proceedings of the 7th International WLT Conference on Lasers in Manufacturing （LiM）. Amsterdam：Elsevier Science，2013., articleTitle=Diode lasers used in plastic welding and selective laser soldering-applications and products, refAbstract=null), Reference(id=1322276152283087025, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2015, volume=215, issue=null, pageStart=6, pageEnd=11, url=null, language=null, rfNumber=[10], rfOrder=12, authorNames=Nishikawa H, Iwata N, journalName=Journal of Materials Processing Technology, refType=null, unstructuredReference=Nishikawa H， Iwata N.Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-AgCu solder on a Cu Pad［J］.Journal of Materials Processing Technology，2015，215：6-11., articleTitle=Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-AgCu solder on a Cu Pad, refAbstract=null), Reference(id=1322276152354390194, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2021, volume=12, issue=8, pageStart=921, pageEnd=null, url=null, language=null, rfNumber=[11], rfOrder=13, authorNames=Hu Z J, Li S J, Yang F, journalName=Micromachines, refType=null, unstructuredReference=Hu Z J， Li S J， Yang F，et al.Formation and elimination of satellite droplets during monodisperse droplet generation by using piezoelectric method［J］.Micromachines，2021，12（8）：921., articleTitle=Formation and elimination of satellite droplets during monodisperse droplet generation by using piezoelectric method, refAbstract=null), Reference(id=1322276152425693363, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2009, volume=469, issue=1/2, pageStart=108, pageEnd=115, url=null, language=null, rfNumber=[12], rfOrder=14, authorNames=Yoon J W, Chun H S, Jung S B, journalName=Journal of Alloys and Compounds, refType=null, unstructuredReference=Yoon J W， Chun H S， Jung S B.Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint［J］.Journal of Alloys and Compounds，2009，469（1/2）：108-115., articleTitle=Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint, refAbstract=null), Reference(id=1322276152505385140, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2020, volume=842, issue=null, pageStart=155849, pageEnd=null, url=null, language=null, rfNumber=[13], rfOrder=15, authorNames=Huang Y F, Liu W S, Ma Y Z, journalName=Journal of Alloys and Compounds, refType=null, unstructuredReference=Huang Y F， Liu W S， Ma Y Z，et al.Effect of added Ag on plasticity enhancement of Au80Sn20 eutectic alloys［J］.Journal of Alloys and Compounds，2020，842：155849., articleTitle=Effect of added Ag on plasticity enhancement of Au80Sn20 eutectic alloys, refAbstract=null), Reference(id=1322276152593465525, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2023, volume=217, issue=null, pageStart=112522, pageEnd=null, url=null, language=null, rfNumber=[14], rfOrder=16, authorNames=Dong W, Jia Z R, Wang X D, journalName=Vacuum, refType=null, unstructuredReference=Dong W， Jia Z R， Wang X D，et al.Size-on-demand preparation of SAC305 solder balls based on pulsated orifice ejection method［J］.Vacuum，2023，217：112522., articleTitle=Size-on-demand preparation of SAC305 solder balls based on pulsated orifice ejection method, refAbstract=null), Reference(id=1322276152668962998, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2015, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[15], rfOrder=17, authorNames=瞿玉海, journalName=null, refType=null, unstructuredReference=瞿玉海.金锡合金快速凝固与金镍合金深过冷凝固行为研究［D］.昆明：云南大学，2015., articleTitle=金锡合金快速凝固与金镍合金深过冷凝固行为研究, refAbstract=null), Reference(id=1322276152761237687, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2015, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[15], rfOrder=18, authorNames=Qu Y H, journalName=null, refType=null, unstructuredReference=Qu Y H.Study on rapid solidification of gold-tin alloy and deep subcooling solidification behavior of gold-nickel alloy［D］.Kunming：Yunnan University，2015., articleTitle=null, refAbstract=null), Reference(id=1322276152824152248, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=1982, volume=53, issue=2, pageStart=1158, pageEnd=1168, url=null, language=null, rfNumber=[16], rfOrder=19, authorNames=Aziz M J, journalName=Journal of Applied Physics, refType=null, unstructuredReference=Aziz M J.Model for solute redistribution during rapid solidification［J］.Journal of Applied Physics，1982，53（2）：1158-1168., articleTitle=Model for solute redistribution during rapid solidification, refAbstract=null), Reference(id=1322276152891261113, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2013, volume=23, issue=7, pageStart=1907, pageEnd=1913, url=null, language=null, rfNumber=[17], rfOrder=20, authorNames=韦小凤, 王日初, 彭超群, journalName=中国有色金属学报, refType=null, unstructuredReference=韦小凤，王日初，彭超群，等.AuSn20/Ni焊点的界面反应及剪切强度［J］.中国有色金属学报，2013，23（7）：1907-1913., articleTitle=AuSn20/Ni焊点的界面反应及剪切强度, refAbstract=null), Reference(id=1322276152958369978, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, doi=null, pmid=null, pmcid=null, year=2013, volume=23, issue=7, pageStart=1907, pageEnd=1913, url=null, language=null, rfNumber=[17], rfOrder=21, authorNames=Wei X F, Wang R C, Peng C Q, journalName=The Chinese Journal of Nonferrous Metals, refType=null, unstructuredReference=Wei X F， Wang R C， Peng C Q，et al.Interfacial reaction and shear strength of AuSn20/Ni solder joints［J］.The Chinese Journal of Nonferrous Metals，2013，23（7）：1907-1913., articleTitle=null, refAbstract=null)], funds=[Fund(id=1322276151297425572, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, awardId=51571052, language=CN, fundingSource=国家自然科学基金项目(51571052), fundOrder=null, country=null)], companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])], figs=[ArticleFig(id=1322276149074444422, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.1, caption=Schematic diagram of pulsated orifice ejection equipment, figureFileSmall=lFKoWRMnCXyGmk8HCStk4Q==, figureFileBig=Y+BWh/DsJ3Ic2Da9Na7bDw==, tableContent=null), ArticleFig(id=1322276149141553287, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图1, caption=脉冲微孔喷射设备示意图, figureFileSmall=lFKoWRMnCXyGmk8HCStk4Q==, figureFileBig=Y+BWh/DsJ3Ic2Da9Na7bDw==, tableContent=null), ArticleFig(id=1322276149317714056, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.2, caption=Schematic diagram of pulse waveform, figureFileSmall=udPsIosRDqj4N9iL3FmePA==, figureFileBig=CXCb9DS7LuBuXVRo7UCLPg==, tableContent=null), ArticleFig(id=1322276149380628617, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图2, caption=脉冲波形示意图, figureFileSmall=udPsIosRDqj4N9iL3FmePA==, figureFileBig=CXCb9DS7LuBuXVRo7UCLPg==, tableContent=null), ArticleFig(id=1322276149439348874, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.3, caption=Effect of key waveform parameters on particle size

（a）particle size change with driving voltage （ tup：100 μs）；（b）particle size change with tup （driving voltage：50 V）

, figureFileSmall=/fHdZaENtbQjy3APgebnTQ==, figureFileBig=45wreDGdwE6+UFHTuj/O5w==, tableContent=null), ArticleFig(id=1322276149510652043, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图3, caption=波形关键参数对粒径的影响

（a）粒径随驱动电压变化（ tup为100 μs）；（b）粒径随上升沿 tup变化（驱动电压为50 V）

, figureFileSmall=/fHdZaENtbQjy3APgebnTQ==, figureFileBig=45wreDGdwE6+UFHTuj/O5w==, tableContent=null), ArticleFig(id=1322276149590343820, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.4, caption=Window diagram of AuSn20 solder ball stable preparation based on rising edge and driving voltage, figureFileSmall=o8JClr7tc9w28ffG5sW/xg==, figureFileBig=LhxmKG5pMYOmy/OzQBbTvg==, tableContent=null), ArticleFig(id=1322276149640675469, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图4, caption=基于上升沿和驱动电压的AuSn20焊球稳定制备窗口图, figureFileSmall=o8JClr7tc9w28ffG5sW/xg==, figureFileBig=LhxmKG5pMYOmy/OzQBbTvg==, tableContent=null), ArticleFig(id=1322276149703590030, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.5, caption=SEM images and average size distributions of AuSn20 solder ball（a）52.7 μm；（b）102.8 μm；（c）203.0 μm；（d）303.3 μm；（e）-（h）solder ball size distributions corresponding to Fig.（a）-（d），respectively, figureFileSmall=pBqaIrv2gM5tanS4q+aCew==, figureFileBig=/f3y4dtKJ072lOl30K3RRw==, tableContent=null), ArticleFig(id=1322276149770698895, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图5, caption=AuSn20焊球的 SEM 图和粒度分布（a）52.7 μm；（b）102.8 μm；（c）203.0 μm；（d）303.3 μm；（e）~（h）分别对应于图（a）~（d）的焊球粒度分布, figureFileSmall=pBqaIrv2gM5tanS4q+aCew==, figureFileBig=/f3y4dtKJ072lOl30K3RRw==, tableContent=null), ArticleFig(id=1322276149842002064, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.6, caption=XRD patterns of AuSn20 solder ball, figureFileSmall=XtVt1VHZmehalG/z0mTVQQ==, figureFileBig=wm3yI/Lg6D4CUTm96eYfRA==, tableContent=null), ArticleFig(id=1322276149904916625, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图6, caption=AuSn20焊球的XRD图谱, figureFileSmall=XtVt1VHZmehalG/z0mTVQQ==, figureFileBig=wm3yI/Lg6D4CUTm96eYfRA==, tableContent=null), ArticleFig(id=1322276149984608402, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.7, caption=Temperature variation curve of AuSn20 solder ball under Ar and He solidification atmosphere, figureFileSmall=yU3I006c5YenqG3CpXLpRQ==, figureFileBig=I0aMor41/LOfdLr5lXrnhQ==, tableContent=null), ArticleFig(id=1322276150064300179, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图7, caption=Ar及He凝固氛围下AuSn20焊球的温度变化曲线, figureFileSmall=yU3I006c5YenqG3CpXLpRQ==, figureFileBig=I0aMor41/LOfdLr5lXrnhQ==, tableContent=null), ArticleFig(id=1322276150127214740, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.8, caption=Surface and cross section microstructures of solder ball with diameter of 203.0 μm（a）microstructure of AuSn20 solder ball； （b）cross section structure of AuSn20 solder ball； （c）enlarged image of the mark in Fig.（b）, figureFileSmall=J0WNmqjk/1kLyfXydcr8Og==, figureFileBig=241o+phxuAdvNdDCOkCeJw==, tableContent=null), ArticleFig(id=1322276150198517909, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图8, caption=粒径为203.0 μm焊球表面及截面显微组织（a）AuSn20焊球的表面形貌；（b）AuSn20焊球的截面组织；（c）图（b）标记处放大图, figureFileSmall=J0WNmqjk/1kLyfXydcr8Og==, figureFileBig=241o+phxuAdvNdDCOkCeJw==, tableContent=null), ArticleFig(id=1322276150269821078, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.9, caption=Cross-sectional SEM images of AuSn20/ENIG interfaces（a）bumping morphology after 60 s at 330 ℃ reflow；（b）locally enlarged image of solder ball edge structure；（c）AuSn20-ENIG interface structure；（d）locally enlarged image of Fig.（c）, figureFileSmall=9LUwzZGsNHvdbLIra9l8aA==, figureFileBig=7MYtjEsQszTt72Z6Vxy9Bw==, tableContent=null), ArticleFig(id=1322276150341124247, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图9, caption=AuSn20/ENIG界面的横截面SEM图像（a）在330 ℃下回流60 s后的凸点形貌；（b）焊球边缘组织局部放大图；（c）AuSn20-ENIG界面组织；（d）图（c）的局部放大图, figureFileSmall=9LUwzZGsNHvdbLIra9l8aA==, figureFileBig=7MYtjEsQszTt72Z6Vxy9Bw==, tableContent=null), ArticleFig(id=1322276150412427416, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.10, caption=Ternary isoth ermal section of Au-Ni-Sn at room temperature［17］, figureFileSmall=/0zWZ5u5n3xiDJjRk/oIzQ==, figureFileBig=tw5Pt0ddbXx1Ld7WKrYsfg==, tableContent=null), ArticleFig(id=1322276150483730585, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图10, caption=室温下的 Au-Ni-Sn 三元等温截面［17］, figureFileSmall=/0zWZ5u5n3xiDJjRk/oIzQ==, figureFileBig=tw5Pt0ddbXx1Ld7WKrYsfg==, tableContent=null), ArticleFig(id=1322276150550839450, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Fig.11, caption=SEM images and EDS analysis of the AuSn20/ENIG interfaces（a）cross-sectional SEM image of the interface；（b）Au elemental mapping；（c）Sn elemental mapping； （d）Cu elemental mapping；（e）Ni elemental mapping；（f）enlarged view of the interface；（g）EDS line-scan analysis across the region indicated by the arrows in Fig.（f）, figureFileSmall=ilnNsGIbo6WgXYQIKDuSFg==, figureFileBig=/7lKOiaHUb69BD+No4yxUw==, tableContent=null), ArticleFig(id=1322276150638919835, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=图11, caption=AuSn20/ENIG界面的SEM图像和EDS分析（a）界面SEM图；（b）Au元素面扫描；（c）Sn元素面扫描；（d）Cu元素面扫描；（e）Ni元素面扫描；（f）界面放大图；（g）图（f）中箭头区域线扫描, figureFileSmall=ilnNsGIbo6WgXYQIKDuSFg==, figureFileBig=/7lKOiaHUb69BD+No4yxUw==, tableContent=null), ArticleFig(id=1322276150710223004, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Table 1, caption=

Key process parameters of AuSn20 solder ball preparation

, figureFileSmall=null, figureFileBig=null, tableContent=
ParameterTemperature/℃Orifice diameter/µmFrequency/Hztup/µsthold/μstfall/μsPressure/kPaVoltage/VRod distance/mm
Value120050/100/200/30010050-300125022500-0.130-750.1-2.0
), ArticleFig(id=1322276150768943261, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=表1, caption=

AuSn20焊球制备的关键工艺参数

, figureFileSmall=null, figureFileBig=null, tableContent=
ParameterTemperature/℃Orifice diameter/µmFrequency/Hztup/µsthold/μstfall/μsPressure/kPaVoltage/VRod distance/mm
Value120050/100/200/30010050-300125022500-0.130-750.1-2.0
), ArticleFig(id=1322276150827663518, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Table 2, caption=

Physical properties used in temperature calculation during solidification［16］

, figureFileSmall=null, figureFileBig=null, tableContent=
Atmoshphere

λg/

（W·m-1·K-1）

ρg/

（kg·m-3）

μg/

（Pa·s）

Cg/

（J·g-1·K-1）

Ar1.763×10-21.62422.7×10-60.522
He1.527×10-10.16319.93×10-65.193
), ArticleFig(id=1322276150903160991, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=表2, caption=

凝固过程中温度计算使用的物性参数［15］

, figureFileSmall=null, figureFileBig=null, tableContent=
Atmoshphere

λg/

（W·m-1·K-1）

ρg/

（kg·m-3）

μg/

（Pa·s）

Cg/

（J·g-1·K-1）

Ar1.763×10-21.62422.7×10-60.522
He1.527×10-10.16319.93×10-65.193
), ArticleFig(id=1322276150978658464, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Table 3, caption=

Physical property parameters of AuSn20

, figureFileSmall=null, figureFileBig=null, tableContent=
ρ/（kg·m-3）Tm/KQ/（kJ·kg-1）
1452055120.10
), ArticleFig(id=1322276151054155937, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=表3, caption=

AuSn20的物性参数

, figureFileSmall=null, figureFileBig=null, tableContent=
ρ/（kg·m-3）Tm/KQ/（kJ·kg-1）
1452055120.10
), ArticleFig(id=1322276151138042018, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=EN, label=Table 4, caption=

Chemical composition of phase marked in Fig.9

, figureFileSmall=null, figureFileBig=null, tableContent=
PointAtom fraction/%Phase
AuNiSn
A82.7317.27Au5Su
B52.7747.23AuSu
C45.285.5349.19（Au，Ni）Sn
D27.7328.3043.98（Au，Ni）3Sn2
), ArticleFig(id=1322276151200956579, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, language=CN, label=表4, caption=

图9中标记相的化学成分

, figureFileSmall=null, figureFileBig=null, tableContent=
PointAtom fraction/%Phase
AuNiSn
A82.7317.27Au5Su
B52.7747.23AuSu
C45.285.5349.19（Au，Ni）Sn
D27.7328.3043.98（Au，Ni）3Sn2
)], attaches=null, journal=Journal(id=1220037122615103490, delFlag=0, nameCn=材料工程, nameEn=Journal of Materials Engineering, nameHistory1=null, nameHistory2=null, issn=1001-4381, eissn=, cn=11-1800/TB, coden=null, periodic=0, language=CN, oaType=null, ccby=null, superviseOffice=null, ownerOffice=null, pubOffice=null, editorOffice=null, officeType=null, aims=null, clcCode=null, officeProv=null, officeCity=null, officeAddr=null, officeZip=null, officeEmail=null, officePhone=null, editDirector=null, officeDirector=null, officeDirectorPhone=null, officeStaffNum=null, officeEmpNum=null, coverPicUrl=qS5NycccBtA0aS0XG68cYQ==, journalPrice=null, startedYear=null, abbrevIsoEn=Journal of Materials Engineering, journalRemark=null, publicationField=null, createdTime=1768809117229, updatedTime=1784018147184, createdBy=18614031015, updatedBy=13041195026, firstLetterCn=C, firstLetterEn=C, subjectCode=Engineering, subjectName=null, subjectCodeEn=Engineering, subjectNameEn=null, picCn=qS5NycccBtA0aS0XG68cYQ==, picEn=sX2rup0n5xdutL/arTf/Mw==, jcr=null, cjcr=null, exts=[JournalExt(id=1283828417913140193, language=CN, name=材料工程, nameHistory1=null, nameHistory2=null, managedBy=, sponsoredBy=, publishedBy=, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=, createdTime=1784018147209, updatedTime=1784018147209, createdBy=13041195026, updatedBy=13041195026, submissionGuidelinesUrl=, submissionAuthorUrl=https://clgcauthor.manuscriptcloud.com/login, submissionEditorUrl=https://clgceditor.manuscriptcloud.com/login, submissionReviewUrl=https://clgcauthor.manuscriptcloud.com/login, submissionCeEditorUrl=, submissionAeEditorUrl=, option={"copyright":""}), JournalExt(id=1283828417976054754, language=EN, name=Journal of Materials Engineering, nameHistory1=null, nameHistory2=null, managedBy=, sponsoredBy=, publishedBy=, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=, createdTime=1784018147224, updatedTime=1784018147224, createdBy=13041195026, updatedBy=13041195026, submissionGuidelinesUrl=, submissionAuthorUrl=https://clgcauthor.manuscriptcloud.com/login, submissionEditorUrl=https://clgceditor.manuscriptcloud.com/login, submissionReviewUrl=https://clgcauthor.manuscriptcloud.com/login, submissionCeEditorUrl=, submissionAeEditorUrl=, option={"copyright":""})], databaseList=null, tenantJournalId=1220038251117760515, websiteList=[Website(id=1220043903034642771, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1220038251117760515, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/clgc/CN, language=CN, createTime=1768810733803, createBy=18614031015, updateTime=1768810757625, updateBy=18614031015, name=材料工程-中文, tplId=1146099689490845704, title=材料工程, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1220044542284321135, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=articleTextType, value=kx, createTime=1768810886212, updateTime=1768810886212, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542259155308, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=banner, value=null, createTime=1768810886206, updateTime=1768810886206, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542305292658, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=grayFlag, value=0, createTime=1768810886217, updateTime=1768810886217, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542250766699, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=logo, value=https://castjournals.cast.org.cn/joweb/clgc/CN/file/pic?fileId=p1xZoJpDbsHjfSRaIuqUUQ==, createTime=1768810886204, updateTime=1768810886204, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542317875572, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=minRunFlag, value=0, createTime=1768810886220, updateTime=1768810886220, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542275932526, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/clgc/CN/file/pic, createTime=1768810886210, updateTime=1768810886210, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542313681267, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=silenceFlag, value=0, createTime=1768810886219, updateTime=1768810886219, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542267543917, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_cn_619/, createTime=1768810886208, updateTime=1768810886208, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542292709744, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=themeColor, value=null, createTime=1768810886214, updateTime=1768810886214, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044542301098353, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903034642771, code=themeStyle, value=null, createTime=1768810886216, updateTime=1768810886216, creator=18614031015, updator=18614031015)]), Website(id=1220043903097557333, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1220038251117760515, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/clgc/EN, language=EN, createTime=1768810733818, createBy=18614031015, updateTime=1768810794087, updateBy=18614031015, name=材料工程-英文, tplId=1146101810881728533, title=Journal of Materials Engineering, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1220044589159858968, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=articleTextType, value=kx, createTime=1768810897388, updateTime=1768810897388, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589134693141, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=banner, value=null, createTime=1768810897382, updateTime=1768810897382, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589180830491, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=grayFlag, value=0, createTime=1768810897393, updateTime=1768810897393, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589113721620, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=logo, value=https://castjournals.cast.org.cn/joweb/clgc/EN/file/pic?fileId=p1xZoJpDbsHjfSRaIuqUUQ==, createTime=1768810897377, updateTime=1768810897377, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589193413405, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=minRunFlag, value=0, createTime=1768810897396, updateTime=1768810897396, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589151470359, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/clgc/EN/file/pic, createTime=1768810897386, updateTime=1768810897386, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589189219100, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=silenceFlag, value=0, createTime=1768810897395, updateTime=1768810897395, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589143081750, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_en_623/, createTime=1768810897384, updateTime=1768810897384, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589164053273, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=themeColor, value=null, createTime=1768810897389, updateTime=1768810897389, creator=18614031015, updator=18614031015), WebsiteProps(id=1220044589172441882, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1220043903097557333, code=themeStyle, value=null, createTime=1768810897391, updateTime=1768810897391, creator=18614031015, updator=18614031015)])], journalTitle=材料工程, weixinUrl=null, journalUrl=https://jme.biam.ac.cn/, iacademicId=null, status=1, seqNo=null, journalTitleEn=Journal of Materials Engineering, journalPhotoCn=qS5NycccBtA0aS0XG68cYQ==, journalPhotoEn=sX2rup0n5xdutL/arTf/Mw==, journalFirstLetter=C, journalRecommend=null, journalNew=null, journalCollection=null, jcrJf=null, cjcrJf=null, jcrJfStr=null, cjcrJfStr=null, submissionFirstDecision=null, sciSubjectClassification=null, casSubjectClassification=null, citeScore=null, totalCitationFrequency=null, icpCode=null, psCode=null, advertisingLicenseCode=null, copyrightInformation=null, country=null, option=, provinceCode=null, provinceName=null, collectFlag=false, interPubPlatform=, interPubPlatformUrl=null), detailUrlCn=https://castjournals.cast.org.cn/joweb/clgc/CN/10.11868/j.issn.1001-4381.2024.000864, detailUrlEn=https://castjournals.cast.org.cn/joweb/clgc/EN/10.11868/j.issn.1001-4381.2024.000864, pdfUrlCn=https://castjournals.cast.org.cn/joweb/clgc/CN/PDF/10.11868/j.issn.1001-4381.2024.000864, pdfUrlEn=https://castjournals.cast.org.cn/joweb/clgc/EN/PDF/10.11868/j.issn.1001-4381.2024.000864, aliStartDate=0, aliEndDate=0, collectionFlag=false, citedCount=null, citedUrl=null, previewStatus=0, delFlag=0, hasFullText=1, orderTime=1789833600000, fullTextJson=null, articleText=null, reference=null)
收藏切换
脉冲微孔喷射法制备AuSn20焊球及组织演变行为
收藏切换
PDF下载
董伟 , 葛凤跃 , 许富民
材料工程 | 研究论文 2026,54(9): 91-98
收起
收藏切换
材料工程 |研究论文 2026 , 54 (9) : 91 -98
脉冲微孔喷射法制备AuSn20焊球及组织演变行为
全屏
[Author(id=1322276147799375984, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, orderNo=0, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=w-dong@dlut.edu.cn, emailSecond=null, emailThird=null, correspondingAuthor=1, authorType=1, ext={EN=AuthorExt(id=1322276147866484850, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147799375984, language=EN, stringName=Wei DONG, firstName=Wei, middleName=null, lastName=DONG, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1322276147929399411, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147799375984, language=CN, stringName=董伟, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=大连理工大学 材料科学与工程学院，辽宁 大连 116024, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])]), Author(id=1322276147988119669, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, orderNo=1, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1322276148126531703, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147988119669, language=EN, stringName=Fengyue GE, firstName=Fengyue, middleName=null, lastName=GE, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1322276148193640568, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276147988119669, language=CN, stringName=葛凤跃, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=大连理工大学 材料科学与工程学院，辽宁 大连 116024, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])]), Author(id=1322276148269138042, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, orderNo=2, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1322276148336246908, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276148269138042, language=EN, stringName=Fumin XU, firstName=Fumin, middleName=null, lastName=XU, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1322276148407550077, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, authorId=1322276148269138042, language=CN, stringName=许富民, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=大连理工大学 材料科学与工程学院，辽宁 大连 116024, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1322276147711295596, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, xref=null, ext=[AuthorCompanyExt(id=1322276147723878509, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China), AuthorCompanyExt(id=1322276147732267118, tenantId=1146029695717560320, journalId=1220038251117760515, articleId=1322276143907061843, companyId=1322276147711295596, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=大连理工大学 材料科学与工程学院，辽宁 大连 116024)])])]
董伟 , 葛凤跃, 许富民
作者信息
  • 大连理工大学 材料科学与工程学院，辽宁 大连 116024
通讯作者:
董伟（1965—），男，副教授，博士，主要从事单分散粉末制备及相关研究，联系地址：辽宁省大连市甘井子区凌工路2号大连理工大学新三束实验室220（116024），E-mail：
Preparation and microstructure evolution of AuSn20 solder ball based on pulsated orifice ejection method
Wei DONG , Fengyue GE, Fumin XU
Affiliations
  • School of Materials Science and Engineering，Dalian University of Technology，Dalian 116024，Liaoning，China
出版时间: 2026-09-20 doi: 10.11868/j.issn.1001-4381.2024.000864
文章导航
收藏切换
摘要
收起

在电子封装领域，金锡共晶合金（AuSn20）作为关键焊接材料，其制备工艺直接影响封装性能和可靠性。然而，受限于AuSn20合金的脆性，目前AuSn20焊球尚无高效的制备方法。本研究采用脉冲微孔喷射技术实现了AuSn20焊球的高精度、高一致性的按需制备。结果表明，在最优工艺条件下制备了多种规格AuSn20焊球，最小规格为50 μm，目标粒径标准偏差最大为1.58 μm，显著提高了制备精度。微观组织分析揭示，焊球主要由δ-AuSn相和ζ'-Au5Sn相共晶组织构成，未观察到异常新相生成。回流处理后，焊球内部成分分布趋于均匀。研究发现，由于扩散阻挡层Ni原子的协同扩散，在界面接头处形成了（Au，Ni）Sn和（Au，Ni）3Sn2等金属间化合物。所制备的AuSn20焊球不仅实现了粒径精确可控和热历史一致性，且在模拟服役条件下表现出优异的界面稳定性和结构完整性，为金锡合金钎料在先进电子封装领域开辟了新的应用途径。

脉冲微孔喷射法  /  AuSn20合金  /  焊球制备  /  粒径调控

In the field of electronic packaging， Au-Sn eutectic alloy （AuSn20） serves as key solder materials， and its preparation process directly affects the packaging performance and reliability. However， due to the brittleness of AuSn20， there is currently no efficient method for the preparation of AuSn20 solder balls. This study uses pulsated orifice ejection method to achieve the high precision and consistency of the on-demand preparation of AuSn20 solder balls. The results show that various specifications of AuSn20 solder balls are prepared under optimal process conditions， with the smallest specification being 50 μm， and the maximum standard deviation of the target particle size being 1.58 μm， significantly improving the preparation accuracy. Microstructural analysis reveals that the solder balls are mainly composed of δ-AuSn and ζ'-Au5Sn eutectic phases， with no abnormal new phases observed. After reflow treatment， the composition distribution inside the solder ball tends to be uniform.Interface reaction studies show that due to the synergistic diffusion of Ni atoms in the diffusion barrier layer， a complex intermetallic compounds （Au，Ni）Sn and （Au，Ni）3Sn2 are formed at the interface joint. The AuSn20 solder balls prepared in this study not only achieve precise control of particle size and consistent thermal history， but also show excellent interface stability and structural integrity under simulated service conditions， opening up new application avenues for Au-Sn alloy brazing materials in advanced electronic packaging.

pulsated orifice ejection method  /  AuSn20 alloy  /  solder ball preparation  /  particle size control
董伟, 葛凤跃, 许富民. 脉冲微孔喷射法制备AuSn20焊球及组织演变行为. 材料工程, 2026 , 54 (9) : 91 -98 . DOI: 10.11868/j.issn.1001-4381.2024.000864
Wei DONG, Fengyue GE, Fumin XU. Preparation and microstructure evolution of AuSn20 solder ball based on pulsated orifice ejection method[J]. Journal of Materials Engineering, 2026 , 54 (9) : 91 -98 . DOI: 10.11868/j.issn.1001-4381.2024.000864
正文
收起
AuSn20（质量分数/%）共晶合金焊料作为一种无铅钎焊材料具有优异的抗蠕变、抗疲劳性能，以及良好的导电性、导热性和耐蚀性，被广泛应用于微机电系统（MEMS）、光学器件和生物医学器件领域［1-2］。从Au-Sn二元相图可知，在共晶温度为278 ℃时，质量分数为80%Au和20%Sn的Au-Sn共晶合金由ζ′-Au5Sn相和δ-AuSn组成［3］。由于ζ′-Au5Sn相属于六方晶系，脆性较大，AuSn20合金更多地以焊膏、预制片的形式使用。在工业焊接过程中，助焊剂的使用是必不可少的。然而，助焊剂在受热后容易挥发，其挥发气体可能会被困在焊点内部，从而导致在焊点界面处孔洞的形成［4-5］。同时在先进电子封装中，芯片与基板之间的间距会进一步缩小，这给助焊剂的清除带来了极大的困难。金锡预制片在熔化后，受芯片挤压存在明显溢出的问题，也严重影响芯片的长期可靠性［6］。球栅阵列封装（ball grid array packaging， BGA）焊球作为先进封装使用的关键技术被广泛应用于芯片领域，由于AuSn20合金材质较脆，难以进行批量制备工业级焊球，极大地限制了AuSn20合金的进一步应用，目前AuSn20焊球的高效制备方法未见相关报道。
先进电子封装用焊球应保证其具有圆球度高、尺寸均匀和粒度分布窄等特点。目前封装使用的焊球制备方法有雾化法、切丝重熔法以及均匀液滴喷射法等［7-11］，但现有技术都存在一些局限性，雾化法所需原料较多且需要进行筛分处理，获取目标尺寸的AuSn20焊球转化率较低。切丝重熔法难以对脆性材料的体积进行精确控制，效率较低。均匀液滴喷射法调控小尺寸焊球困难，同时难以承受高温，在高温焊料制备方面受限。Yoon等［12］探究了AuSn20合金在ENIG基板上不同温度下的热疲劳行为。Huang等［13］报道了通过真空熔炼方法在AuSn20合金基体中添加Ag可形成（Au，Ag）5Sn，降低了堆垛层错能，从而提高塑性。然而，以往关于AuSn20合金焊料的研究主要集中在金属化合物服役过程中的界面反应，制球方法主要为切丝重熔及机械合金化，这很难保证在工业应用过程中AuSn20焊球制备的一致性。为了满足电子产品向更小型化和高度集成化发展的需求，AuSn20焊球需要实现更精细的尺寸控制和更高的制造精确度。
本工作基于脉冲微孔喷射法（pulsated orifice ejection method，POEM）制备出单分散、尺寸均匀、热历史一致的微米级AuSn20焊球，探究了焊球制备过程中驱动电压、上升沿时间和微孔直径等工艺参数对喷射稳定性和焊球粒径的影响，并分析了不同规格焊球的表面、相组成。以200 μm规格AuSn20焊球为例，通过回流焊探究了界面组织演变行为。本工作旨在为AuSn20合金在先进电子封装领域的微凸点互连应用提供理论依据和技术支撑。
1 实验材料与方法
收起
AuSn20焊球的制备设备如图1所示，由五个核心部分组成：单分散液滴喷射系统、压电陶瓷驱动系统、温度控制系统、真空控制系统以及收集系统。首先将铸态AuSn20合金置入坩埚中。通过机械泵和分子泵的协同作用，将腔室内的气压降至10-3 Pa，确保腔室内的氧含量降至最低。根据实验的具体需求，将保护气引入腔室内，直至达到一个标准大气压。接下来，温度控制系统将坩埚内的原料加热至430 ℃，并保温一定时间以确保AuSn20合金完全熔化。
在实验阶段，压电陶瓷驱动系统中使用的波形如图2所示，由时间（横坐标）和驱动电压（纵坐标）构成，根据作用时间分为上升沿（tup）、保持沿（thold）和下降沿（tfall）三个阶段，对应传动杆向下运动、保持静止和恢复到原位置三个运动状态。它们共同决定了传动杆的位移和速度。压电陶瓷驱动系统驱动传动杆，将在熔体中产生有序的局部扰动传递至微孔处，使得AuSn20熔体克服微孔局域的表面张力，从而喷出形成微液滴并在下落过程中凝固形成焊球。最终，这些焊球被收集罐收集。具体的实验参数详见表1。
通过光学显微镜（OM，LV100NPOL）拍摄粒子图片，利用WinRoof 2018图形分析软件处理分析粒径、圆球度及分布等相关参数。在回流处理中，基板选用150 μm焊盘、化学镀镍沉金（ENIG），其中Ni作为扩散阻挡层。将制备的AuSn20焊球与基板浸入乙醇中超声清洗60 s。接下来，在最高温度330 ℃下回流60 s后冷却至室温。通过金相处理方法制备样品，使用配备能谱（EDS）的扫描电子显微镜（SEM，SU5000）分析微观结构和组成成分。
2 结果与分析
收起
2.1 AuSn20焊球的制备及尺寸调控
在焊球制备过程中，微孔的直径是决定焊球尺寸范围的关键因素。传动杆的最大运动距离Δx随着驱动电压的变化而变化，这一距离由脉冲波形中的驱动电压所控制。在固定电压条件下，即Δx保持不变时，tup越短，意味着传动杆在熔体中的振动速度越快，从而拥有更大的动能，对熔融态的AuSn20合金产生更强的压力扰动。相反，当tup保持不变，即传动杆速度固定时，驱动电压的增加会导致对熔融态AuSn20合金的扰动增强。综上所述，AuSn20焊球尺寸的主要影响因素包括微孔直径、驱动电压以及上升沿tup。
为探究驱动电压对焊球粒径调控的影响，采用tup=100 μs，孔径（orifice diameter，OD）分别选取100、200、300 μm，在不同驱动电压下探究AuSn20焊球的粒径变化。实验结果由图3（a）可知，随着驱动电压的增大，AuSn20焊球粒径呈现增大趋势。以200 μm孔径为例，随着电压从40 V到70 V，粒径均值也从183 μm逐渐增大至219.6 μm。主要由于电压增大带动传动杆振动距离Δx增大，从而使得熔融态AuSn20受到的压力扰动更大，最终通过微孔排出更多体积的AuSn20液滴，经快速凝固后形成AuSn20焊球。同时在孔径一定时，通过调节驱动电压保证稳定喷射过程中，发现AuSn20焊球粒径范围维持在39.0 μm以内。如图3（b）所示，上升沿tup对粒径的最大调控范围在26.6 μm以内，与上升沿相比，驱动电压具有更大的粒径调控空间，并且调控范围不随孔径变化而改变。
在制备AuSn20焊球的过程中，粒径的调控是一个复杂的过程，受到多种因素的影响。图4为上升沿和驱动电压对AuSn20焊球喷射窗口的影响图。在实验中，选择微孔直径为200 μm。图中红色三角形标记了在特定驱动电压和上升沿条件下设备无法喷射出液滴的临界状态。具体参数为：上升沿tup设定为250 μs，保持沿时间为1000 μs，下降沿时间为1000 μs。黄色区域表示无法喷射出液滴的区域，而绿色区域则表示可以成功喷射出液滴的区域。从图4中可以明显看出，上升沿和驱动电压的相互作用对于控制熔体的喷射至关重要。当驱动电压低于3 V或上升沿超过275 μs时，液滴将无法喷射出来。这可能是因为电能转化为传动杆往复振动的能量不足，无法克服熔融态金属的表面张力。因此，为了更精确地调控目标粒径，在微孔直径固定的情况下，应首先通过调整驱动电压来控制粒径范围，然后调整上升沿进一步细化目标粒径。
利用脉冲微孔喷射技术，通过调整微孔直径、驱动电压和上升沿，成功制备了目标粒径为50、100、200、300 μm的AuSn20焊球，图5（a）~（d）展示了不同规格焊球的表面形貌，图5（e）~（h）分别对应于图5（a）~（d）的焊球粒度分布，其中MD为平均粒径，PSD为粒径分布范围，SD为标准偏差，SPHT为圆球度。焊球的MD分别为52.7、102.8、203.0、303.3 μm，SD分别为0.78、1.23、1.33、1.58 μm。通过对影响粒径的因素进行精细调控，能够实现目标粒径焊球的稳定批量制备。
对目标粒径为100、200、300 μm的AuSn20焊球进行了XRD分析，如图6所示，所有样品均由ζ′-Au5Sn相和δ-AuSn两相构成，没有其他多余相产生。
2.2 凝固氛围对焊球表面的影响
在焊球下落过程中，凝固气氛的差异可能导致焊球凝固时间和表面形貌的变化，进而对金锡焊球在光电器件封装中的良率有着直接影响。不同凝固氛围下的导热系数不同，这导致焊球的冷却速率和凝固时间存在差异。因此，通过实验结合理论计算，分析了熔融态金锡在Ar和He氛围下的凝固过程。
在实验中，设定了100 Hz的频率、200 μm的孔径、6 V的驱动电压和100 μs的上升沿时间，分别在Ar和He氛围中制备了AuSn20焊球。鉴于焊球的粒径微小，在模拟过程中做出了两个基本假设：一是熔融态金锡内部的温度是均匀的；二是焊球仅通过表面进行热交换。环境温度设定为25 ℃，并采用牛顿冷却模型来计算温度变化，具体计算公式如式（1）［14］所示，详细的计算过程可以参考文献［16-18］。
dTdt=6hρCd(T-Tsur)+6εσρCd(T4-Tsur4)
式中：T为实际温度；t为时间；C为焊料的质量热容；d为焊球直径；h为气体对流换热系数；Tsur为环境温度；ε为发射率；σ为斯蒂芬波尔兹曼常数；ρ为焊料的密度。所使用的热物性参数详见表2［15］，其中λg为热导率，μg为黏度系数，Cg为比热容。
图7为不同凝固氛围下AuSn20焊球表面温度随着时间的曲线以及分别在Ar、He氛围下制备AuSn20焊球的表面形貌。可以看出在Ar氛围下的AuSn20焊球表面光滑，粒径均一，圆球度高，但在He氛围下制备的金锡焊球在其表面出现凹陷。由表2可知，在相同条件下 He 具有更大热导率，能够使得热量可以更快地从固体内部传递到表面，从而增加与流体的热交换速率，使得对流换热系数更高，冷却速率更高。表3为AuSn20的物理参数，Tm为熔点，Q为融化潜热。通过表3数值计算可知，在相同初始温度及实验条件下，He凝固氛围下的AuSn20到达凝固点需要0.015 s，Ar氛围下需要0.03 s，冷却速率相差一倍。熔融态金锡从孔口喷出时液滴在颈缩作用后会产生回弹，在He氛围下冷却速率过高，由于表面张力及黏度作用，还未形成圆球状就已经完全凝固，进而AuSn20焊球的表面产生凹陷。通过模型分析，能够更精确地预测和控制焊球的凝固过程，从而优化光电器件封装的良率和焊球的质量。
2.3 AuSn20焊球组织分析
图8显示了在Ar氛围下调控制备粒径为203.0 μm的AuSn20焊球及截面显微组织。如图8（a）所示，焊球圆球度高且表面光滑。由图8（b）可以看出，焊球截面边缘中出现了由边缘向中间生长的树枝晶，并且中心处没有明显树枝晶存在。根据Au-Sn二元合金平衡相图［3］可知，在平衡凝固条件下AuSn20合金的凝固组织由脆性六方晶格δ-AuSn相和ζ′-Au5Sn相组成的层片共晶组织。在凝固过程中AuSn20液滴表面受到凝固氛围影响，较高的冷却速率使得树枝晶由表面向中心生长。由于在非平衡凝固过程中，δ-AuSn相和ζ′-Au5Sn相发生相选择，亮白色的ζ′-Au5Sn相作为初生相析出，δ-AuSn相被抑制，即发生竞争形核与生长。当液滴合金到达共晶温度时，发生共晶反应，形成δ-AuSn和ζ′-Au5Sn相缠绕的共晶组织。但初生相ζ′-Au5Sn占整个焊球体积分数较少，对基体的共晶成分影响很小。对图8（c）中标记处进行EDS点分析，初生相ζ′-Au5Sn的组成为79.91%Au（原子分数，下同）和20.09%Sn，其中Sn的含量高于理论值。由 Aziz 溶质保留模型［16］可知，晶体生长过程由于仅受晶体-熔体界面上原子的撞击频率的限制，比溶质-溶剂重新分布过程发生得更快，当溶质的生长速度快于试图逃逸的原子扩散运动时，溶质就会被完全捕获。在非平衡凝固过程中，由于AuSn20焊球冷却速率高，凝固速率较高，Sn原子未能充分扩散就已形成初生相ζ′-Au5Sn，最终发生“溶质捕获”现象。经图6的XRD图谱证实AuSn20焊球由δ-AuSn相和ζ′-Au5Sn相组成，并无其他新相组成。
2.4 AuSn20焊球/ENIG界面分析
为探究制备的AuSn20焊球与ENIG基板的界面反应，选取粒径为203.0 μm的AuSn20焊球，使用ENIG作为基板，在回流焊机中以最高温度330 ℃进行回流60 s，然后冷却至室温。回流过程中没有使用助焊剂。图9展示了AuSn20焊球在ENIG基板上经回流处理后的焊球截面形貌及组织分析。与机械合金化制备的AuSn20箔材［17］相比，界面处生成的化合物更均匀。图9（b）为焊球内部边缘处的局部放大图，其中δ-AuSn相和ζ′-Au5Sn相互相缠绕，形成均匀的共晶组织。AuSn20焊球与ENIG基板接头处的显微组织如图9（c）所示，在界面处最初基板的Au层消失，界面有黑灰色棒状相和薄层新相产生。在回流过程中焊球内部枝晶偏析消失，形成δ-AuSn相和ζ′-Au5Sn相组成的共晶组织，同时ENIG基板中的Au层很快溶解到熔融AuSn20焊料中。基板中Au层较薄，对焊球整体成分造成的影响可以忽略。与图8（c）相比，焊球截面中的ζ′-Au5Sn相枝晶偏析消失，焊球在回流过程中发生重熔，ζ′-Au5Sn初生相和δ-AuSn相重新融化形成共晶组织。
如图9（c）所示，在AuSn20-ENIG界面接头处看到有棒状及薄层状化合物存在，焊球和ENIG基板处之间发现两种反应产物。经EDS测试，图9（b），（d）中标记相的化学含量如表4所示。棒状反应产物的组成为5.53%Ni、 45.28%Au和49.19%Sn，（Au+Ni）与Sn的原子分数比为50.71∶49.19，接近1∶1，表明反应产物是（Au，Ni）Sn 金属间化合物（IMC）。
由图10中室温下Au-Ni-Sn三元体系的等温截面［17］所示，由于Au和Ni具有相似的物理和化学性质，Ni原子可以进入AuSn晶格并取代Au原子形成（Au，Ni）Sn IMC。经EDS测试接头处层状反应产物组成为28.30%Ni、27.73%Au和43.98%Sn，其中（Au+Ni）与Sn的原子分数比为56.02∶43.98，接近3∶2，表明反应产物是（Au，Ni）3Sn2 IMC。主要由于在回流过程中Ni原子不断从基板向焊料中扩散，当局部Ni原子饱和后，进一步形成（Au，Ni）3Sn2相。与其他研究相比［13］，POEM制备的AuSn20焊球在模拟服役的条件下形成了均匀的（Au，Ni）Sn和（Au，Ni）3Sn2相，具有较好的结构完整性。
图11展示了AuSn20焊球经回流焊处理后的SEM图和线扫描的元素分布图。图11（b）~（e）分别为Au、Sn、Cu、Ni的元素分布图，由图可知，Au、Sn原子分别均匀地分布在基板上方，界面处由于形成δ-AuSn和ζ′-Au5Sn相，Sn原子聚集，Au原子由于Ni的晶格替代，导致Au浓度减小。图11（f），（g）为界面处的线扫描图，经回流后内部δ-AuSn相和ζ′-Au5Sn相中Au原子含量规律变化，到达约4.5 μm处由于Ni原子的扩散形成（Au，Ni）Sn相，导致Au相含量降低。随着距离基板越近，基板中的Ni不断向内部扩散形成（Au，Ni）3Sn2，相对应的Ni在晶格中占据更多Au原子，导致Au含量也逐渐降低。到达7 μm左右时，Au、Sn原子含量发生骤降，正好到达ENIG基板交界处，Ni原子含量上升。
3 结论
收起
（1）利用脉冲微孔喷射技术，成功稳定地制备了多种粒径规格的AuSn20焊球，包括50、100、200、300 μm，目标粒径的标准偏差最大值为1.58 μm。
（2）焊球的粒径随着驱动电压和上升沿的增加而增大。在固定孔径的条件下，通过调整驱动电压，发现AuSn20焊球的粒径可以在39.0 μm的范围内调节，而上升沿的调节则可以将粒径控制在26.6 μm的最大范围内。与He氛围相比，Ar氛围下制备的焊球展现出更高的圆球度和更光滑的表面。
（3）在脉冲微孔喷射制备的AuSn20焊球中，出现少量偏析的初生相ζ′-Au5Sn。经过回流处理后，基板中的Au层迅速溶解于熔融焊料中，δ-AuSn和ζ′-Au5Sn相发生重熔并重新形成了均匀的共晶组织。
基金
收起
  • 国家自然科学基金项目(51571052)
文献
收起
参考文献 引证文献
排序方式：
[1]
Tan C W， Chan Y C， Leung B，et al.Effects of soft beam energy on the microstructure of Pb37Sn，Au20Sn，and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application［J］.Optics and Lasers in Engineering，2008，46（1）：75-82.
[2]
Zhao J， Li L， Wang W M，et al.High-power and low-divergence 980-nm InGaAs-GaAsP-AlGaAs strain-compensated quantum-well diode laser grown by MOCVD［J］.IEEE Photonics Technology Letters，2003，15（11）：1507-1509.
[3]
Ciulik J， Notis M R.The Au-Sn phase diagram［J］.Journal of Alloys and Compounds，1993，191（1）：71-78.
[4]
Zhang G S， Jing H Y， Xu L Y，et al.Creep behavior of eutectic 80Au/20Sn solder alloy［J］.Journal of Alloys and Compounds，2009，476（1/2）：138-141.
[5]
Kim J， Lee C C.Fluxless wafer bonding with Sn-rich Sn-Au dual-layer structure［J］.Materials Science and Engineering：A，2006，417（1/2）：143-148.
[6]
周涛，汤姆·鲍勃，马丁·奥德，等.金锡焊料及其在电子器件封装领域中的应用［J］.电子与封装，2005，5（8）：5-8.
Zhou T， Tom B， Martin O，et al.An introduction to eutectic Au/Sn solder alloy and its preforms in microelectronics/optoelectronic packaging applications［J］.Electronics & Packaging，2005，5（8）：5-8.
[7]
朱盼星，石生荷，杨剑，等.气体雾化技术制备金属粉末研究综述［J］.粉末冶金工业，2021，31（4）：82-87.
Zhu P X， Shi S H， Yang J，et al.Research progress on the gas atomization for producing metal powders［J］.Powder Metallurgy Industry，2021，31（4）：82-87.
[8]
刘海霞，雷永平，夏志东，等.切丝重熔法制备的BGA焊球及其表面形貌［J］.电子元件与材料，2005，24（5）：21-23.
Liu H X， Lei Y P， Xia Z D，et al.Fabrication of solder balls by fine-wire cutting-remelting and its surface appearance［J］.Electronic Components & Materials，2005，24（5）：21-23.
[9]
Reinl S. Diode lasers used in plastic welding and selective laser soldering-applications and products［C］∥proceedings of the 7th International WLT Conference on Lasers in Manufacturing （LiM）. Amsterdam：Elsevier Science，2013.
[10]
Nishikawa H， Iwata N.Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-AgCu solder on a Cu Pad［J］.Journal of Materials Processing Technology，2015，215：6-11.
[11]
Hu Z J， Li S J， Yang F，et al.Formation and elimination of satellite droplets during monodisperse droplet generation by using piezoelectric method［J］.Micromachines，2021，12（8）：921.
[12]
Yoon J W， Chun H S， Jung S B.Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint［J］.Journal of Alloys and Compounds，2009，469（1/2）：108-115.
[13]
Huang Y F， Liu W S， Ma Y Z，et al.Effect of added Ag on plasticity enhancement of Au80Sn20 eutectic alloys［J］.Journal of Alloys and Compounds，2020，842：155849.
[14]
Dong W， Jia Z R， Wang X D，et al.Size-on-demand preparation of SAC305 solder balls based on pulsated orifice ejection method［J］.Vacuum，2023，217：112522.
[15]
瞿玉海.金锡合金快速凝固与金镍合金深过冷凝固行为研究［D］.昆明：云南大学，2015.
Qu Y H.Study on rapid solidification of gold-tin alloy and deep subcooling solidification behavior of gold-nickel alloy［D］.Kunming：Yunnan University，2015.
[16]
Aziz M J.Model for solute redistribution during rapid solidification［J］.Journal of Applied Physics，1982，53（2）：1158-1168.
[17]
韦小凤，王日初，彭超群，等.AuSn20/Ni焊点的界面反应及剪切强度［J］.中国有色金属学报，2013，23（7）：1907-1913.
Wei X F， Wang R C， Peng C Q，et al.Interfacial reaction and shear strength of AuSn20/Ni solder joints［J］.The Chinese Journal of Nonferrous Metals，2013，23（7）：1907-1913.
2026年第54卷第9期
PDF下载
32
13
引用本文
BibTeX
文章信息
doi: 10.11868/j.issn.1001-4381.2024.000864
  • 接收时间：2024-12-25
  • 首发时间：2026-10-28
  • 出版时间：2026-09-20
补充材料
相关文章
文章信息
作者
出版历史
  • 收稿日期：2024-12-25
  • 录用日期：2025-01-24
基金
国家自然科学基金项目(51571052)
作者信息
    大连理工大学 材料科学与工程学院，辽宁 大连 116024

通讯作者:

董伟（1965—），男，副教授，博士，主要从事单分散粉末制备及相关研究，联系地址：辽宁省大连市甘井子区凌工路2号大连理工大学新三束实验室220（116024），E-mail：
参考文献
分享链接
https://castjournals.cast.org.cn/joweb/clgc/CN/10.11868/j.issn.1001-4381.2024.000864
分享至
全文二维码

扫描看全文

引用本文
BibTeX
本文的引用情况
2种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
相关链接
论文
最新文章
热读文章
热点专题
内参
蓝皮书
产业发展报告
传播力报告
期刊分级目录
资讯
学术新闻
行业新闻
学术会议
行业会议
关于
关于我们
联系我们
北京市海淀区学院南路86号
100081
010-62662699（运营及技术支持）
qkjq@cast.org.cn

中国科学技术协会版权所有 京ICP 备10216604号-4 海淀分局备案 1101084647
科技导报社主办 中国科协信息中心技术支持