中国材料进展

专利视角下全球第三代半导体材料加工装备技术创新发展研究

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曹晨 ¹^,² , 叶茂 ¹^,² , 江洪 ¹^,²

中国材料进展 | 研究论文 2026,45(10): 1106-1112

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中国材料进展 |研究论文 2026 , 45 (10) : 1106 -1112

专利视角下全球第三代半导体材料加工装备技术创新发展研究

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曹晨¹^,², 叶茂¹^,², 江洪¹^,²

作者信息

^1.中国科学院武汉文献情报中心，湖北　武汉　430071

^2.科技大数据湖北省重点实验室，湖北　武汉　430071

作者简介:

曹晨，女，1988年生，副研究馆员，Email：caoc@mail.whlib.ac.cn

Research on the Innovation and Development of Global Third-Generation Semiconductor Material Processing Equipment Technology from a Patent Perspective

Chen CAO¹^,², Mao YE¹^,², Hong JIANG¹^,²

Affiliations

^1.National Science Library (Wuhan), Chinese Academy of Sciences, Wuhan 430071, China

^2.Hubei Key Laboratory of Big Data in Science and Technology, Wuhan 430071, China

出版时间: 2026-10-20 doi: 10.7502/j.issn.1674-3962.202505004

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摘要

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第三代半导体材料加工装备技术在确保材料性能优势、推动技术创新和发展、提升第三代半导体产业整体竞争力方面具有重要作用。基于Incopat数据库，利用Citespace、Excel等分析工具，结合文献调研和专家咨询，对全球第三代半导体材料加工装备技术领域依次开展了专利申请趋势与技术生命周期、技术来源地与市场分布、研发机构竞争态势、热点研究主题技术进展等分析。研究表明，第三代半导体材料加工装备技术已从成长期过渡到成熟期，但在超宽带隙材料加工、高精度表面处理等细分领域，仍存在创新空间；日本和美国是主要技术来源国，中国在专利申请数量上增长迅速但国际布局滞后；研究热点集中在高精度衬底表面处理与平整化、外延生长精确控制与均匀性提升、集成化与自动化的加工装备制造。

关键词

第三代半导体 / 加工装备 / 专利分析 / 衬底 / 外延

Abstract

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The third-generation semiconductor material processing equipment technology plays an important role in ensuring material performance advantages, promoting technological innovation and development, and enhancing the overall competitiveness of the third-generation semiconductor industry. Based on the Incopat database and using analysis tools such as Citespace and Excel, combined with literature research and expert consultation, this study conducted a sequential analysis of patent application trends and technology life cycle, technology source regions and market distribution, R&D institution competition situation, and hot research topic technology progress in the field of global third-generation semiconductor material processing equipment technology. Research has shown that the third-generation semiconductor material processing equipment technology has transitioned from the growth stage to the mature stage, but there is still room for innovation in sub fields such as ultrawide bandgap material processing and high-precision surface treatment. Japan and the United States are the main source regions of technology, while China has grown rapidly in the number of patent applications but lags behind in its international layout. The research hotspots focus on high-precision substrate surface treatment and planarization, precise control and uniformity improvement of epitaxial growth, and integrated and automated processing equipment manufacturing.

Key words

the third-generation semiconductors / processing equipment / patent analysis / substrate / extension

引用本文

曹晨, 叶茂, 江洪. 专利视角下全球第三代半导体材料加工装备技术创新发展研究. 中国材料进展, 2026 , 45 (10) : 1106 -1112 . DOI: 10.7502/j.issn.1674-3962.202505004

Chen CAO, Mao YE, Hong JIANG. Research on the Innovation and Development of Global Third-Generation Semiconductor Material Processing Equipment Technology from a Patent Perspective[J]. Materials China, 2026 , 45 (10) : 1106 -1112 . DOI: 10.7502/j.issn.1674-3962.202505004

基金

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中国科学院文献情报能力建设专项资金资助项目(E4KZ261003)

参考文献

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2026年第45卷第10期

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文章信息

doi: 10.7502/j.issn.1674-3962.202505004

接收时间：2025-05-08
首发时间：2026-10-16
出版时间：2026-10-20

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收稿日期：2025-05-08
修回日期：2025-07-11

基金

中国科学院文献情报能力建设专项资金资助项目(E4KZ261003)

作者信息

^1.中国科学院武汉文献情报中心，湖北　武汉　430071

^2.科技大数据湖北省重点实验室，湖北　武汉　430071

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2种不同金属材料的力学参数

科 Family	属数 Number of genus	种数 Number of species	占总种数比例 Percentage of total species (%)	属 Genus	种数 Number of species	占总种数比例 Percentage of total species (%)
鹅膏菌科Amanitaceae	2	11	5.26	鹅膏菌属 Amanita	10	4.78
小菇科 Mycenaceae	2	12	5.74	丝盖伞属 Inocybe	5	2.39
多孔菌科 Polyporaceae	8	14	6.70	蜡蘑属 Laccaria	5	2.39
红菇科 Russulaceae	3	23	11.00	小皮伞属 Marasmius	6	2.87
				小菇属 Mycena	11	5.26
				光柄菇属 Pluteus	5	2.39
				红菇属 Russula	17	8.13
				栓菌属 Trametes	5	2.39

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